CN201946395U - High positive temperature coefficient (PTC) thermistor with multilayer structure - Google Patents
High positive temperature coefficient (PTC) thermistor with multilayer structure Download PDFInfo
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- CN201946395U CN201946395U CN2010206555699U CN201020655569U CN201946395U CN 201946395 U CN201946395 U CN 201946395U CN 2010206555699 U CN2010206555699 U CN 2010206555699U CN 201020655569 U CN201020655569 U CN 201020655569U CN 201946395 U CN201946395 U CN 201946395U
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Abstract
The utility model relates to a high positive temperature coefficient (PTC) thermistor with a multilayer structure, which is provided with a thermistor chip, a first outer electrode, a second outer electrode, a first leading-out wire, a second leading-out wire and an insulation protection layer, wherein the first leading-out wire is conductively connected with the first outer electrode, the second leading-out wire is conductively connected with the second electrode, the insulation protection layer wraps the thermistor chip, the first outer electrode and the second outer electrode, and the first leading-out wire and the second leading-out wire penetrate out of the insulation protection layer. The high PTC thermistor with the multilayer structure is characterized in that the first outer electrode is provided with at least two first inner electrode units which are conducted with the first outer electrode, the second outer electrode is provided with at least three second inner electrode units which are conducted with the second outer electrode, the first inner electrode units and the second inner electrode units stretch into the thermistor chip and are crossly arranged, a gap is arranged between each first inner electrode unit and each second inner electrode unit, the gaps are filled by thermistor chip to form a printed and laminated layer.
Description
Technical field
The utility model relates to a kind of big temperature coefficient PTC themistor with sandwich construction.
Background technology
Existing overtemperature protection class PTC element is widely used in fields such as IC device, hybrid integrated circuit, Switching Power Supply, IGBT power device, small and special electric machine, lithium battery, DC converter, its protection temperature range is 60～130 ℃, and this element has following characteristics: the reaction time is fast; Work is steady in a long-term reliable; Overall dimension is little, easy for installation; Not needing after the product overtemperature protection to be provided with again. its operation principle is a characteristic of utilizing PTC themistor suddenly to raise in the above resistance value of Curie temperature; when ambient temperature raises unusually; the protection circuit that PTC themistor is housed is switched on or switched off the loop by the change of resistance, reaches protection assembly purpose.
In order to reach desirable protective effect; when doing the design of overtemperature protection element and temperature control sensor, required the PTC component size little; temperature coefficient height and room temperature resistance≤100 Ω. this has just limited the selection of ptc material greatly; causing PTC component temperature coefficient less than normal, can't in Standard resistance range, satisfy the overtemperature protection requirement than broad. the product percent of pass of element only has 25-30%.
Therefore, there is defective in existing PTC themistor, need improve.
The utility model content
The purpose of this utility model is to improve on existing P TC thermistor structure, and a kind of big temperature coefficient PTC themistor with sandwich construction is provided.
Basic design of the present utility model is: introduce the Multi-layer Parallel structure in conventional PTC element is made, realized significantly improving PTC component temperature coefficient when not increasing component size and room temperature resistance.The purpose of this utility model can realize in the following manner: ceramic PTC porcelain body is prepared certain density slurry, pass through curtain coating with special electrode size then, and--seal is folded, and--cutting--is total to burning--, and technologies such as plating are finished the making of PTC element chip new method.Keeping under the constant prerequisite of PTC component size and room temperature resistance, realizing that PTC component temperature coefficient significantly improves.Its principle is: linking to each other several PTC element parallel connections that independently overlap together by internal and external electrode is an element.Realized that when not increasing component size and room temperature resistance the resistivity of the ptc material of selecting for use can improve 5-10 doubly, temperature coefficient improves 60-100%, thereby causes New PTC component temperature coefficient significantly to increase by the light of nature.Satisfy the overtemperature protection requirement in the Standard resistance range of broad, product percent of pass is brought up to 75-85%.
Particularly; big temperature coefficient PTC themistor with sandwich construction of the present utility model has the thermistor chip; the first external electrode; the second external electrode; first lead-out wire; second lead-out wire and insulating protective layer; described the first external electrode is positioned at thermistor chip one side; described the second external electrode is positioned at thermistor chip another side; described first lead-out wire is connected with the first external electrode conduction; described second lead-out wire is connected with the second external electrode conduction; described insulating protective layer is with the thermistor chip; the first external electrode and the second external electrode parcel; described first lead-out wire and second lead-out wire pass insulating protective layer; it is characterized in that described the first external electrode has two first interior electrode units of conducting with it at least; described the second external electrode has three the second inner electrode unit of conducting with it at least; electrode unit and the second inner electrode unit extend to cross arrangement in the thermistor chip in described first; have the gap between electrode unit and the second inner electrode unit in described first, described gap is filled by the thermistor chip and is constituted the seal lamination.
Has the gap between the first interior electrode unit and the second inner electrode unit described in the utility model, described gap is filled by the thermistor chip and is constituted the seal lamination, be meant that promptly the thermistor chip material between the first interior electrode unit and the second inner electrode unit has constituted the seal lamination, this seal lamination can be at three layers to ten layers, as: as described in the first external electrode have three with it conducting first in electrode units, described the second external electrode has three the second inner electrode unit of conducting with it, after electrode unit and the cross arrangement of the second inner electrode unit, the seal lamination that the adjacent first interior electrode unit and the second inner electrode unit form is a five-layer structure in first.
Compared with the aforementioned existing similar products, of the present utility model have the big temperature coefficient PTC themistor of sandwich construction when not increasing component size and room temperature resistance, allow resistivity raising, temperature coefficient improve, thereby allow PTC component temperature coefficient significantly increase by the light of nature.Satisfy the overtemperature protection requirement in the Standard resistance range of broad, product percent of pass improves.
Content of the present utility model further illustrates with the following Examples, but content of the present utility model is not limited only to content related among the embodiment.
Description of drawings
Fig. 1 is the structural representation that has the big temperature coefficient PTC themistor of sandwich construction among the embodiment.
Embodiment
As shown in Figure 1; the big temperature coefficient PTC themistor with sandwich construction described in the present embodiment has thermistor chip 1; the first external electrode 2; the second external electrode 3; first lead-out wire 4; second lead-out wire 5 and insulating protective layer 6; described the first external electrode 2 is positioned at thermistor chip 1 one side; described the second external electrode 3 is positioned at thermistor chip 1 another side; described first lead-out wire 4 is connected with the first external electrode 2 conductions; described second lead-out wire 5 is connected with the second external electrode 3 conductions; described insulating protective layer 6 is with thermistor chip 1; the first external electrode 2 and the second external electrode 3 parcels; described first lead-out wire 4 and second lead-out wire 5 pass insulating protective layer 6; it is characterized in that described the first external electrode 2 has two first interior electrode units 7 of conducting with it at least; described the second external electrode 3 has three the second inner electrode unit 8 of conducting with it at least; electrode unit 7 extends to cross arrangement in the thermistor chip 1 with the second inner electrode unit 8 in described first; have the gap between electrode unit 7 and the second inner electrode unit 8 in described first, described gap is filled by the thermistor chip and is constituted seal lamination 9.
The first external electrode described in the present embodiment 2 has three first interior electrode units 7 of conducting with it, and described the second external electrode 3 has three the second inner electrode unit 8 of conducting with it.
The adjacent first interior electrode unit 7 is a five-layer structure with the seal lamination 9 that the second inner electrode unit 8 forms in the present embodiment.
Claims (2)
1. big temperature coefficient PTC themistor with sandwich construction; has the thermistor chip; the first external electrode; the second external electrode; first lead-out wire; second lead-out wire and insulating protective layer; described the first external electrode is positioned at thermistor chip one side; described the second external electrode is positioned at thermistor chip another side; described first lead-out wire is connected with the first external electrode conduction; described second lead-out wire is connected with the second external electrode conduction; described insulating protective layer is with the thermistor chip; the first external electrode and the second external electrode parcel; described first lead-out wire and second lead-out wire pass insulating protective layer; it is characterized in that described the first external electrode has two first interior electrode units of conducting with it at least; described the second external electrode has three the second inner electrode unit of conducting with it at least; electrode unit and the second inner electrode unit extend to cross arrangement in the thermistor chip in described first; have the gap between electrode unit and the second inner electrode unit in described first, described gap is filled by the thermistor chip and is constituted the seal lamination.
2. the big temperature coefficient PTC themistor with sandwich construction as claimed in claim 1, it is characterized in that described the first external electrode has three first interior electrode units of conducting with it, described the second external electrode has three the second inner electrode unit of conducting with it.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010206555699U CN201946395U (en) | 2010-12-13 | 2010-12-13 | High positive temperature coefficient (PTC) thermistor with multilayer structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010206555699U CN201946395U (en) | 2010-12-13 | 2010-12-13 | High positive temperature coefficient (PTC) thermistor with multilayer structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201946395U true CN201946395U (en) | 2011-08-24 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010206555699U Expired - Fee Related CN201946395U (en) | 2010-12-13 | 2010-12-13 | High positive temperature coefficient (PTC) thermistor with multilayer structure |
Country Status (1)
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| CN (1) | CN201946395U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2019041224A1 (en) * | 2017-08-31 | 2019-03-07 | Littelfuse Electronics (Shanghai) Co., Ltd. | Polymeric positive temperature coefficient device for seat motor protection |
-
2010
- 2010-12-13 CN CN2010206555699U patent/CN201946395U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2019041224A1 (en) * | 2017-08-31 | 2019-03-07 | Littelfuse Electronics (Shanghai) Co., Ltd. | Polymeric positive temperature coefficient device for seat motor protection |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110824 Termination date: 20131213 |