A kind of heat abstractor of electromagnetic oven
Technical field
The utility model relates to a kind of heat abstractor of electromagnetic oven, belongs to the improvement technology of the heat abstractor of electromagnetic oven.
Background technology
As shown in Figure 1, the power device 2 of existing electromagnetic oven generally is installed in the upper surface of radiator 1, and be inserted into by the pin 21 that bends and realize on the circuit board 3 and being electrically connected of circuit board, this radiator structure assembly difficulty is big, production efficiency is low, and the kink of pin damages power device easily, had a strong impact on the service life of power device, easily be short-circuited when being exposed between the pin on the circuit board cross-over connection conductor simultaneously, therefore generally also to set up sleeve pipe, corresponding material and the manufacturing cost that has increased complete machine in bending pins portion.
Summary of the invention
The purpose of this utility model is to consider the problems referred to above and provides a kind of simple and practical that cost is low, easily the heat abstractor of the electromagnetic oven of assembling.
The technical solution of the utility model is: a kind of heat abstractor of electromagnetic oven, comprise radiator, power device, circuit board and electromagnetic oven base, circuit board is installed in the electromagnetic oven base, it is characterized in that described power device vertically is inserted on the circuit board by pin, radiator is close to power device and is installed on the circuit board, and device has the insulating heat-conductive parts between power device and the radiator.
Described power device and insulating heat-conductive parts are fastened on the side of radiator by securing member.
Described power device is rectifier bridge heap, IGBT or metal-oxide-semiconductor.
The orientation of the fin of described radiator and the perpendicular or parallel setting of the pin of power device.
Described insulating heat-conductive parts are heat-conducting silicone grease or insulating concrete mica plate.
The beneficial effects of the utility model are, power device is by vertical being plugged on the circuit board of pin, not only saved the pin sleeve pipe, and solved the problem that pin cross-over connection conductor easily is short-circuited, avoid bending pins that power device is caused damage, improve the efficiency of assembling of production line greatly, reduce Material Cost; Device has the insulating heat-conductive parts between the sidewall of power device and radiator simultaneously, and thermal heat transfer capability is better, and radiating effect is better, thereby has prolonged the service life of electromagnetic oven, improves the security and the reliability of system.
Description of drawings
Fig. 1 is the structural representation of existing electromagnetic oven heat radiation device.
Fig. 2 is the structural representation of the utility model embodiment 1.
Fig. 3 is the assembly structure schematic diagram of the power device of the utility model embodiment 1 and radiator, circuit board.
Fig. 4 is the power device of the utility model embodiment 2 and the structural representation of radiator.
The specific embodiment
The utility model is described in further detail below in conjunction with embodiment and accompanying drawing.
Embodiment 1:
As Fig. 2, shown in Figure 3, the utility model electromagnetic oven heat radiation device, comprise radiator 1, power device 2, circuit board 3 and electromagnetic oven base 4, circuit board 3 is installed in the electromagnetic oven base 4, described power device 2 vertically is inserted on the circuit board 3 by pin 21, radiator 1 is close to power device 2 and is installed on the circuit board 3, and device has insulating heat-conductive parts 11 between power device 2 and the radiator 1.
For making radiating effect better, it is more firm to install, and described power device 2 and insulating heat-conductive parts 11 are fastened on the side of radiator 1 by screw 22.
In the present embodiment, the fin 12 of radiator is transversely arranged, and is vertical with the pin 21 of power device.Described power device 2 is rectifier bridge heap, IGBT or metal-oxide-semiconductor.Described insulating heat-conductive parts 11 are heat-conducting silicone grease or insulating concrete mica plate.
Embodiment 2:
As shown in Figure 4, the difference of present embodiment and embodiment 1 is, the fin 12 of radiator is double-deck vertically to be arranged, and be arranged in parallel with the pin 21 of power device.Other structure is identical with embodiment 1.