CN201919247U - Non-destructive welding device for miniature PCB (printed circuit board) devices - Google Patents
Non-destructive welding device for miniature PCB (printed circuit board) devices Download PDFInfo
- Publication number
- CN201919247U CN201919247U CN 201020697627 CN201020697627U CN201919247U CN 201919247 U CN201919247 U CN 201919247U CN 201020697627 CN201020697627 CN 201020697627 CN 201020697627 U CN201020697627 U CN 201020697627U CN 201919247 U CN201919247 U CN 201919247U
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- miniature pcb
- welder
- harm
- heater
- miniature
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Abstract
The utility model discloses a non-destructive welding device for miniature PCB (printed circuit board) devices. The non-destructive welding device comprises a baseboard, a moving platform and a heating device, the moving platform is movably arranged on the baseboard and used for moving a miniature PCB, the heating device is fixedly arranged on the baseboard and close to one side of the moving platform. The problem that repair welding of devices poor in high temperature resistance cannot be realized by welding tools such as electric iron agent heat guns and the like onto a device intensive area during the subsequent PCB process is solved, and feasibility of local welding process for PCBs is increased, requirements on operating skills of operators are reduced, and breakthrough improvement in terms of operating efficiency and processing precision is achieved.
Description
Technical field
The utility model relates to a kind of welder, particularly relates to the harmless welder of a kind of miniature PCB device.
Background technology
At present, in the SMT industry, usually need be to the follow-up repair welding of miniature PCB (miniature PCB is meant that thickness is no more than list/two sided pcb of 1 millimeter) top device or adjustment etc.Electric iron or storage heater are normally adopted in the repair welding of existing local device,, hold welding or the dismounting that this class instrument carries out device by hand that is.Yet, in this process, need operating personnel that higher professional skill and experience are arranged.In addition, this class tool work inefficiency, welding quality also can't guarantee usually.
Along with soldered miniaturization of devices, and the concentrated densification of the device of miniature PCB, the welding method of electric iron is according to playing a role.And miniature PCB goes up a lot of packagings, also can't bear the high temperature of storage heater.Therefore, by existing soldering appliance, can't finish the repair welding of the local non-refractory device of miniature PCB at all.
The utility model content
The technical problems to be solved in the utility model is to realize the defective of the repair welding of the local non-refractory device of miniature PCB for the soldering appliances such as electric iron that overcome prior art, and the miniature PCB device welder of the repair welding of the local non-refractory device that a kind of energy finishes miniature PCB accurate, harmlessly is provided.
The utility model solves above-mentioned technical problem by following technical proposals: a kind of miniature PCB device can't harm welder, and its characteristics are that it comprises:
One base plate;
One activity is located on the described base plate and is used for moving the handover platform of described miniature PCB;
One is fixedly arranged on the heater on the described base plate, and described heater is positioned at described handover platform one side.
Preferably, described heater comprises:
One heater; And
One with the affixed molten tin device in end of described heater, the end face of described molten tin device is lower than the plane at described handover platform place.
Preferably, described heater comprises that also one is used for the adjustable locating rack of the described heater of clamping, and the bottom of described adjustable locating rack is fixedly arranged on the described base plate.
Preferably, described heater is an electric iron.
Preferably, the described molten tin device tin pot that is a ccontaining scolding tin.
Preferably, be provided with an operation protection sheet between described heater and the described molten tin device.
Preferably, the bottom of described handover platform is movably equipped with two parallel screw mandrels.
Preferably, two described parallel screw mandrels are fixedly arranged on the described base plate by two fixed blocks respectively.
Preferably, be movably equipped with a feed screw nut on the described parallel screw mandrel, described handover platform and described feed screw nut are affixed.
Preferably, described handover platform is provided with some reference columns that are used for fixing described miniature PCB.
Preferably, the side near described heater is provided with a heat shield on the described handover platform.
Preferably, described base plate is a bakelite plate.
Preferably, described miniature PCB is the single or double printed circuit board that thickness is no more than 1mm.
Positive progressive effect of the present utility model is:
1, the utility model has solved miniature PCB and has made the later stage, can't be with soldering appliances such as electric iron agent heat guns at the device close quarters, and the industry technology of repair welding non-refractory device has solved the feasibility of PCB local welding technology effectively.
2, the utility model adopts molten tinware to carry out localized heating from the bottom to miniature pcb board, overcome the infeasible and number of drawbacks that the high-density device welding is taken place on the traditional-handwork welding method, simulated the good result that Reflow Soldering and wave-soldering combine preferably, the saving equipment frock drops into, satisfied present electron trade preferably to high density, little spacing, the local welding of non-refractory device products is required.
3, the utility model can solve the technology difficult problem that the local device of miniature PCB can't carry out manual dribbleware or disassemble well accurately to the harmless welding of the local device of miniature PCB.
Therefore 4, in addition, the utility model is simple in structure, and low cost of manufacture can be suitable for the welding and the dismounting technology of the local device of PCB of other type of different structure.
5, the utility model has also reduced the requirement to operator's operative skill, on operating efficiency and process implementing precision breakthrough raising is arranged.
Description of drawings
Fig. 1 is the device partial sectional view of the utility model one preferred embodiment.
Fig. 2 is that B among Fig. 1 is to view.
Fig. 3 be among Fig. 1 A to the partial structurtes vertical view.
Embodiment
Provide the utility model preferred embodiment below in conjunction with accompanying drawing, to describe the technical solution of the utility model in detail.
As shown in Figure 1 to Figure 3, the utility model provides the local device of a kind of miniature PCB harmless soldering appliance, comprises that base plate 1, one activity is located on the base plate 1 and is used to place and moves the handover platform 2 of miniature PCB; One is fixedly arranged on the heater 5 of base plate 1 one sides.Heater 5 close sides of transferring platform 2, and be positioned at the below of transferring plane, platform 2 place.Like this, when miniature PCB moves to heater 5 tops, can pass through the bottom heating of 5 couples of miniature PCB of heater, thereby finish the harmless welding of the local device of miniature PCB.
Preferably, heater 5 of the present utility model can comprise: a heater 51; One is used for the adjustable locating rack 52 of clamping heater 51, and a molten tin device 53 that is fixed in the end of heater 51.Adjustable locating rack 52 is fixedly arranged on the base plate 1.
Further, heater 51 of the present utility model can be an electric iron, by a heater base 511 electric iron is erected certain altitude.
Preferably, molten tin device 53 can be a tin pot that is used for the goblet shape of ccontaining scolding tin.
Preferably, the safety in order to operate is provided with a block operations screening glass 54 between heater 51 and molten tin device 53.
Preferably, the bottom of transferring platform 2 is movably equipped with two parallel screw mandrels 4, is movably equipped with a feed screw nut 41 on the parallel screw mandrel 4, and it is affixed with feed screw nut 41 to transfer platform 2.Like this, under the drive of parallel screw mandrel 4, then mobile platform 2 base plate 1 horizontal slip relatively.
Preferably, transfer on the platform 2, on mobile platform 2, also be provided with some reference columns 21 for miniature PCB is fixed on.
Preferably, the side near heater 5 is provided with a heat shield 22 on the handover platform 2.
Fail safe when operating in order to improve, base plate 1 of the present utility model is preferably the base plate of bakelite material.
Preferably, miniature PCB of the present utility model is that thickness is the list/two sided pcb that is no more than 1mm.Device of the present utility model is particularly useful for the harmless welding in part of miniature PCB.
When using device of the present utility model, miniature PCB is fixed on the mobile platform 2, and its zone that needs repair welding is suspended on outside the opposite side of close heater of mobile platform 2.Move up and down the adjustable locating rack 52 of clamping having heaters 51, be lower than the bottom surface of the PCB that treats the repair welding device, lock heater 51 then until the top that makes the tin pot that is fixed on heater 51 ends.
The heater power supply is to the preheat temperature that needs.
Add scolding tin to fusing in the tin pot, the PCB that device to be welded is housed is positioned over PCB transfers platform 2, place by the weldering device corresponding welding position on PCB, moves and transfer platform 2, makes the zone that needs the repair welding device on the miniature pcb board just in time be in the top of tin pot.
By heater 51 scolding tin in the tin pot is preheating to certain high temperature, again the zone of the need repair welding device of miniature PCB is moved to the top of scolding tin, heat the need repairing device bottom of PCB by the scolding tin of thermosol, thereby the solder joint of the need repair welding device root above this PCB is dissolved, with tweezers or staff adjustment, can finish local repair welding or the dismounting of miniature PCB.
After finishing welding or disassembling, retract in the other direction PCB and transfer platform, then operational sequence finishes.
The utility model adopts molten tinware to carry out localized heating from the bottom to miniature PCB, overcome the infeasible and number of drawbacks that the high-density device welding is taken place on the traditional-handwork welding method, simulated the good result that Reflow Soldering and wave-soldering combine preferably, the saving equipment frock drops into, satisfied present electron trade preferably to high density, little spacing, the local welding of non-refractory device products is required.
Further, the utility model has also reduced the requirement to operator's operative skill, and breakthrough raising is all arranged on operating efficiency and craft precision.
The utility model has also reduced the requirement to operator's operative skill, on operating efficiency and process implementing precision breakthrough raising is arranged.
In addition, the utility model also is applicable to other various models, size, and thickness is the welding procedure that is no more than the printed circuit board of 1mm.
Though more than described embodiment of the present utility model, but those skilled in the art is to be understood that, these only illustrate, and under the prerequisite that does not deviate from principle of the present utility model and essence, can make numerous variations or modification to these execution modes.Therefore, protection range of the present utility model is limited by appended claims.
Claims (13)
1. a miniature PCB device can't harm welder, it is characterized in that it comprises:
One base plate;
One activity is located on the described base plate and is used for moving the handover platform of described miniature PCB;
One is fixedly arranged on the heater on the described base plate, and described heater is near described handover platform one side.
2. miniature PCB device as claimed in claim 1 can't harm welder, it is characterized in that described heater comprises:
One heater; And
One with the affixed molten tin device in end of described heater, the end face of described molten tin device is lower than the plane at described handover platform place.
3. miniature PCB device as claimed in claim 2 can't harm welder, it is characterized in that, described heater comprises that also one is used for the adjustable locating rack of the described heater of clamping, and the bottom of described adjustable locating rack is fixedly arranged on the described base plate.
4. miniature PCB device as claimed in claim 2 can't harm welder, it is characterized in that described heater is an electric iron.
5. miniature PCB device as claimed in claim 2 can't harm welder, it is characterized in that the tin pot that described molten tin device is a ccontaining scolding tin.
6. miniature PCB device as claimed in claim 2 can't harm welder, it is characterized in that, is provided with an operation protection sheet between described heater and the described molten tin device.
7. miniature PCB device as claimed in claim 1 can't harm welder, it is characterized in that the bottom of described handover platform is movably equipped with two parallel screw mandrels.
8. miniature PCB device as claimed in claim 7 can't harm welder, it is characterized in that, two described parallel screw mandrels are fixedly arranged on the described base plate by two fixed blocks respectively.
9. miniature PCB device as claimed in claim 8 can't harm welder, it is characterized in that, be movably equipped with a feed screw nut on the described parallel screw mandrel, described handover platform and described feed screw nut are affixed.
10. miniature PCB device as claimed in claim 1 can't harm welder, it is characterized in that described handover platform is provided with some reference columns that are used for fixing described miniature PCB.
11. miniature PCB device as claimed in claim 1 can't harm welder, it is characterized in that, the side near described heater on the described handover platform is provided with a heat shield.
12. miniature PCB device as claimed in claim 1 can't harm welder, it is characterized in that described base plate is a bakelite plate.
13. miniature PCB device as claimed in claim 1 can't harm welder, it is characterized in that, described miniature PCB is the single or double printed circuit board that thickness is no more than 1mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201020697627 CN201919247U (en) | 2010-12-31 | 2010-12-31 | Non-destructive welding device for miniature PCB (printed circuit board) devices |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201020697627 CN201919247U (en) | 2010-12-31 | 2010-12-31 | Non-destructive welding device for miniature PCB (printed circuit board) devices |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201919247U true CN201919247U (en) | 2011-08-03 |
Family
ID=44419032
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201020697627 Expired - Fee Related CN201919247U (en) | 2010-12-31 | 2010-12-31 | Non-destructive welding device for miniature PCB (printed circuit board) devices |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201919247U (en) |
-
2010
- 2010-12-31 CN CN 201020697627 patent/CN201919247U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110803 Termination date: 20131231 |