CN201918199U - High-strength enameled copper alloy wire - Google Patents
High-strength enameled copper alloy wire Download PDFInfo
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- CN201918199U CN201918199U CN2011200222704U CN201120022270U CN201918199U CN 201918199 U CN201918199 U CN 201918199U CN 2011200222704 U CN2011200222704 U CN 2011200222704U CN 201120022270 U CN201120022270 U CN 201120022270U CN 201918199 U CN201918199 U CN 201918199U
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- alloy wire
- copper alloy
- wire
- lubricating layer
- self
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Abstract
The utility model discloses a high-strength enameled copper alloy wire, which comprises a copper-zinc alloy lead, wherein the surface of the copper-zinc alloy lead is covered by an insulation self-adhered lubricating layer. Compared with a general enameled alloy wire, the high-strength enameled copper alloy wire has higher tensile strength, and the mechanical performance is better expressed; and a coil is wound by using high-speed automatic wire winding equipment, the enameled copper alloy wire cannot be snapped or stretched, so the requirement of the high-speed wire winding equipment for the whole performance of the wire can be met.
Description
Technical field
The utility model relates to a kind of wire rod structure, particularly a kind of high strength enamel-cover copper alloy wire that is adapted at the electromechanics trade use.
Background technology
Enamelled wire is a kind of electric wire with insulating barrier, and it can be applied on general motor, electrical equipment, the instrument.Electromechanics trade generally adopts high-speed automated spooling equipment coiling at present, therefore the various mechanical performances to enamelled wire have proposed higher requirement, high-speed automated spooling equipment requires enamelled wire to have advantages of higher tensile strength, is broken in the coil winding process or is stretched and influences the performance of enamelled wire to prevent enamelled wire.Existing common enamelled wire oneself can not satisfy the modern electrical machine industry to enamelled wire in high requirement that mechanical properties proposed.
Summary of the invention
For addressing the above problem, the utility model provides a kind of high strength enamel-cover copper alloy wire of satisfactory mechanical property, and it can satisfy the requirement of automation spooling equipment well.
The utility model is that the technical scheme that its problem of solution is adopted is:
High strength enamel-cover copper alloy wire comprises the ormolu lead, and the surface of ormolu lead is coated with insulation self-adhesion lubricating layer.
As preferred embodiment, described insulation self-adhesion lubricating layer comprises enamel insulation layer, self-adhesion enamelled coating and the lubricating layer that is coated on the ormolu conductive line surfaces from inside to outside successively.
As preferred embodiment, described lubricating layer is by being formed by the surface-coated finished lubricants at the self-adhesion enamelled coating.
The beneficial effects of the utility model are: the utility model adopts the ormolu lead as electric conductor, compare with general enamelling alloy wire, it has higher tensile strength, the mechanical performance performance is better, when utilizing high-speed automated spooling equipment to carry out coiling, this enamel-cover copper alloy wire can not broken or be stretched, and can satisfy the high speed spooling equipment to the requirement of line on overall performance.
Description of drawings
The utility model is described in further detail below in conjunction with drawings and Examples:
Fig. 1 is an overall structure generalized section of the present utility model.
Embodiment
With reference to Fig. 1, high strength enamel-cover copper alloy wire of the present utility model comprises ormolu lead 1, and the surface of ormolu lead 1 is coated with insulation self-adhesion lubricating layer 2.Wherein, the copper in the ormolu lead 1, zinc mass percentage content are: copper 68.0%-72.0%, zinc 28.0%-32.0%, the ormolu lead 1 of this ratio has mechanical strength preferably.
In addition, continuation is with reference to Fig. 1, as preferred embodiment, insulation self-adhesion lubricating layer 2 comprises enamel insulation layer 3, self-adhesion enamelled coating 4 and the lubricating layer 5 that is coated on the ormolu conductive line surfaces from inside to outside successively, wherein, enamel insulation layer 3 is generally polyurethane paint insulating barrier 2, and lubricating layer 5 is by being formed by the surface-coated finished lubricants at self-adhesion enamelled coating 4.Based on said structure, the existing tack of high strength enamel-cover copper alloy wire of the present utility model has straight weldering again; Adhesion-molded voluntarily at short notice with the not only available method of baking of accompanying of the coil of its coiling, and when plumb joint, needn't remove paint film in advance, can directly ward off tin, welding, therefore, simplified technology greatly, improved production efficiency.
Execution mode of the present utility model is not restricted to the described embodiments, as long as it reaches technique effect of the present utility model with essentially identical means, all should belong to protection range of the present utility model.
Claims (3)
1. high strength enamel-cover copper alloy wire is characterized in that: comprise ormolu lead (1), the surface of ormolu lead (1) is coated with insulation self-adhesion lubricating layer (2).
2. high strength enamel-cover copper alloy wire according to claim 1 is characterized in that described insulation self-adhesion lubricating layer (2) comprises enamel insulation layer (3), self-adhesion enamelled coating (4) and the lubricating layer (5) that is coated on the ormolu conductive line surfaces from inside to outside successively.
3. high strength enamel-cover copper alloy wire according to claim 2 is characterized in that described lubricating layer (5) is by being formed by the surface-coated finished lubricants at self-adhesion enamelled coating (4).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011200222704U CN201918199U (en) | 2011-01-24 | 2011-01-24 | High-strength enameled copper alloy wire |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011200222704U CN201918199U (en) | 2011-01-24 | 2011-01-24 | High-strength enameled copper alloy wire |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201918199U true CN201918199U (en) | 2011-08-03 |
Family
ID=44417991
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011200222704U Expired - Fee Related CN201918199U (en) | 2011-01-24 | 2011-01-24 | High-strength enameled copper alloy wire |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201918199U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103849795A (en) * | 2012-11-29 | 2014-06-11 | 日月光半导体制造股份有限公司 | Copper alloy wire used for semiconductor devices |
| CN106409403A (en) * | 2016-11-07 | 2017-02-15 | 南昌专腾科技有限公司 | Flat enameled wire and manufacturing process thereof |
| CN109530839A (en) * | 2018-12-27 | 2019-03-29 | 苏州市力发电子有限公司 | A kind of connecting line tin sticky technique |
-
2011
- 2011-01-24 CN CN2011200222704U patent/CN201918199U/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103849795A (en) * | 2012-11-29 | 2014-06-11 | 日月光半导体制造股份有限公司 | Copper alloy wire used for semiconductor devices |
| CN106409403A (en) * | 2016-11-07 | 2017-02-15 | 南昌专腾科技有限公司 | Flat enameled wire and manufacturing process thereof |
| CN106409403B (en) * | 2016-11-07 | 2018-01-02 | 南昌专腾科技有限公司 | A kind of flat enamel-covered wire and its manufacturing process |
| CN109530839A (en) * | 2018-12-27 | 2019-03-29 | 苏州市力发电子有限公司 | A kind of connecting line tin sticky technique |
| CN109530839B (en) * | 2018-12-27 | 2021-02-09 | 苏州市力发电子有限公司 | Tin dipping process for connecting wire |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110803 Termination date: 20170124 |