CN201915171U - Silicon rod bonding device facilitating synchronous falling of silicon slices - Google Patents
Silicon rod bonding device facilitating synchronous falling of silicon slices Download PDFInfo
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- CN201915171U CN201915171U CN2011201011077U CN201120101107U CN201915171U CN 201915171 U CN201915171 U CN 201915171U CN 2011201011077 U CN2011201011077 U CN 2011201011077U CN 201120101107 U CN201120101107 U CN 201120101107U CN 201915171 U CN201915171 U CN 201915171U
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- silicon
- silicon rod
- bearing
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- conducting metal
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Abstract
A silicon rod bonding device facilitating synchronous falling of silicon slices is characterized in that a bearing bonding table adopts a hollow structure, wherein an accommodating chamber is formed between an upper support plate and a lower end surface, lightening holes are formed on support side surfaces and the lower end surface, and heat-conducting metal panels are arranged on the upper support plate at equal intervals. The bearing bonding table is designed into a hollow bearing bonding table, the heat-conducting metal panels are inlaid on the upper support plate at equal intervals, the accommodating chamber is additionally formed below the upper support plate, and the lightening holes are formed on the support side surfaces and the lower end surface, so that the self weight of the bearing bonding table is greatly reduced, and the overall heat absorption process of the bearing bonding table is shortened; when the upper support plate is placed into high-temperature water, a bearing glass plate and a silicon slice group fall synchronously, which can greatly reduce the silicon slice breakage rate during the debonding and slice removing process, and lower the energy consumption of the slice removing procedure; and the structure of the bearing bonding table is optimized to improve the buckling deformation resistance of the upper support plate, so that the normal service life of the bearing bonding table can be guaranteed.
Description
Technical field:
The utility model relates to the body silicon rod adhering device with the supporting usefulness side of crystalline silicon slicing machine.
Background technology:
In the production process of silicon chip of solar cell, the silicon rod of crystal pulling Workshop Production is processed into silicon chip must be successively through excision two ends bull, segment, butt and slicing process, cutting into by square silicon rod in the operation of silicon chip, must stick with glue agent before cutting earlier cements in square silicon rod on the carrying binding platform that has guide rail by the bearing glass plate, then with silicon rod, the conjunction of bearing glass plate and carrying binding platform inserts on the slicing machine frame top board by the guide rail on the carrying binding platform, the carrying binding platform that will be stained with square silicon rod with trip bolt is fixed on the cutting machine, start slicing machine, carry out synchronous cutting with cutting steel wire group square shaped silicon rod, after the silicon rod cutting, unclamp the trip bolt on the silicon chip binding platform, the carrying binding platform integral body that carries silicon chip group is put into high-temperature water, force the fusing of thermoplasticity bonded adhesives, make silicon chip, sheet glass separates with plummer, silicon chip like this, bearing glass plate and carrying binding platform have just separated, people can take out silicon chip respectively and scrap in hot water bearing glass plate, and the carrying binding platform is handled through high temperature cabonization, and it is also reusable that removal is bonded in the lip-deep caking agent of carrying binding platform.In actual production process, there is the defective aspect two:
First, silicon rod is to be bonded on the last plane of carrying binding platform by the bearing glass slab integral, the bearing glass plate is bigger with the contact area of carrying binding platform, when integral body is put into high-temperature water after silicon rod cuts into silicon chip, because whole carrying binding platform all is a heat-absorbing body, in the process of heat absorption, the silicon chip that is positioned at bearing glass plate two ends comes off earlier because of gum softening, the interlude heat absorption speed of bearing glass plate is the slowest, thereby be positioned at herein that silicon chip and bearing glass plate are to come off at last, because the thickness of silicon chip is very little, and fragility is big, is easy to fragmentation when silicon chip is subjected to vertical force, like this, after the bearing glass plate that comes off and silicon chip in the process that the shape that looses comes off, be easy to break up the silicon chip that comes off earlier, cause in this workshop section the silicon chip breakage rate higher.
Second, the carrying binding platform is the I-shaped platen of entity, own wt is big, weight behind bonding upward bearing glass plate and the square column silicon rod is bigger, operator's labour intensity is very big, simultaneously hot water come unstuck get sheet and remove the energy that is consumed in the glue scale removal process big, in actual use, the carrying binding platform needs repeatedly through heat and cooling, cause the last plane warping distortion of carrying binding platform easily, after the last plane warping distortion of carrying binding platform, just can not fit tightly between the last plane of bearing glass plate and carrying binding platform, silicon rod is easy to come off after stressed during cutting, causes scrapping in batch of silicon chip in the silicon rod cutting action.
The utility model content:
In order to overcome the prior art above shortcomings, the utility model provides a kind of silicon rod adhering device that silicon chip comes off synchronously of being convenient to, it can guarantee square column silicon rod, bearing glass plate and the triangular strong bond of carrying binding platform, silicon chip group after cutting finishes is come off synchronously, reducing comes unstuck gets silicon chip breakage rate in the sheet process, further reducing hot water comes unstuck and gets sheet and remove energy expenditure in the glue scale removal process, make carrying adhesion station buckling deformation amount in high temperature cabonization and process of cooling repeatedly reduce, guarantee to carry binding platform and can steady in a long-termly reuse.
The technical scheme that the utility model adopted is:
A kind ofly be convenient to the silicon rod adhering device that silicon chip comes off synchronously, it comprises the carrying binding platform, the bearing glass plate, square column silicon rod to be cut and bonding glue-line, the width of bearing glass plate is corresponding with the length of side of square column silicon rod, the length of bearing glass plate is corresponding with the length of square column silicon rod, square column silicon rod to be cut by bonding glue-line strong bond on the upper surface of bearing glass plate, the lower surface of bearing glass plate is bonded on the upper surface of carrying binding platform securely by bonding glue-line, it is characterized in that: described carrying binding platform is a hollow structure, it comprises upper bearing plate, the supporting side, guide rail, the lower surface, cavity volume, lightening hole and heat-conducting metal panel, cavity volume is by upper bearing plate, two supporting sides and lower surface surround and form, lightening hole is opened on the supporting side, guide rail is connected as a single entity by two supporting sides and upper surfaces, the upper bearing plate equal intervals be provided with the heat-conducting metal panel.
Further, on the lower surface, be provided with lightening hole.
Further, the shape of cross section of described heat-conducting metal panel is trapezoidal or " protruding " font.
Further, the heat-conducting metal panel is embedded on the upper surface of upper bearing plate.
Further, the planeness of the upper surface of upper bearing plate is 0.005～0.03, and the upper surface of heat-conducting metal panel is hanged down 0～2 millimeter than the upper surface of upper bearing plate.
Because will carry binding platform is designed to hollow structure, some heat-conducting metal panels have been inlayed on upper bearing plate equal intervals ground, and below upper bearing plate, set up cavity volume, offering of lightening hole not only alleviated the own wt that carries binding platform significantly, and improved the integral body heat absorption speed of upper bearing plate, because the heat conductivility of heat-conducting metal panel is better than cast iron, when upper bearing plate is put into high-temperature water, the heat-conducting metal panel is simultaneously with the heat transferred upper bearing plate of high-temperature water, make upper bearing plate integral body heat up synchronously, guaranteed that bearing glass plate and the silicon chip group that is bonded on the bearing glass plate upper surface come off synchronously, so just can effectively prevent the impact disrepair phenomenon of silicon chip because of successively coming off and produce, having reduced significantly comes unstuck gets silicon chip breakage rate in the sheet process, simultaneously, improved and got sheet efficient, reduced the energy consumption of getting the sheet operation; The hollow structure of carrying binding platform designs and sets up the heat-conducting metal panel on upper bearing plate, optimized carrying binding platform structure, strengthen the thermal deformation resistant performance of upper bearing plate, guaranteed the anti-buckling deformation ability in plane on the carrying binding platform is in heat and process of cooling repeatedly.
Description of drawings:
Fig. 1 is bonded in the structural representation that carries on the binding platform for the square column silicon rod by bearing glass plate and bonding glue-line;
Fig. 2, Fig. 3 are the structural representation of carrying binding platform;
Fig. 2 is an A-A sectional view among Fig. 3;
Fig. 3 is the left view of Fig. 2;
Fig. 4 is the upward view of Fig. 2;
Fig. 5, Fig. 6 are two kinds of lateral cross section shape synoptic diagram of heat-conducting metal panel;
Among the figure: 1-carries binding platform; 2-bearing glass plate; 3-square column silicon rod; The bonding glue-line of 4-; The 11-upper bearing plate; 12-supports the side; The 13-guide rail; The 14-lower surface; The 15-cavity volume; The 16-lightening hole; 17-heat-conducting metal panel.
Embodiment:
Describe embodiment of the present utility model in detail below in conjunction with accompanying drawing.
A kind ofly be convenient to the silicon rod adhering device that silicon chip comes off synchronously, it comprises carrying binding platform 1, bearing glass plate 2, square column silicon rod 3 and bonding glue-line 4 to be cut, the width of bearing glass plate 2 is corresponding with the length of side of square column silicon rod 3, the length of bearing glass plate 2 is corresponding with the length of square column silicon rod 3, on the upper surface of bearing glass plate 2, the lower surface of bearing glass plate 2 is bonded on the upper surface of carrying binding platform 1 securely square column silicon rod 3 to be cut by bonding glue-line 4 by bonding glue-line 4 strong bond; Described carrying binding platform 1 is a hollow structure, shown in Fig. 2～6, it comprises upper bearing plate 11, supporting side 12, guide rail 13, lower surface 14, cavity volume 15, lightening hole 16 and heat-conducting metal panel 17, cavity volume 15 is by upper bearing plate 11, two supporting sides 12 and lower surface 14 surround and form, lightening hole 16 is opened on supporting side 12 and the lower surface 14, guide rail 13 is connected as a single entity with upper bearing plate 11 by two supporting sides 12, upper bearing plate 11 equal intervals be provided with heat-conducting metal panel 17, the shape of cross section of described heat-conducting metal panel 17 is as shown in Figure 5 trapezoidal, or " protruding " font as shown in Figure 6; This example is " protruding " font, and the material of described heat-conducting metal panel 17 is copper alloy or aluminium alloy, and heat-conducting metal panel 17 is embedded on the upper surface of upper bearing plate 11 by the casting mode; The planeness of the upper surface of upper bearing plate 11 is 0.005～0.03, and the upper surface of heat-conducting metal panel 17 is equal or lower slightly with the upper surface of upper bearing plate 11, and drop between the two is 0～2 millimeter.In this example, the upper surface of heat-conducting metal panel 17 is equal with the upper surface of upper bearing plate 11.
Claims (5)
1. be convenient to the silicon rod adhering device that silicon chip comes off synchronously for one kind, it comprises carrying binding platform (1), bearing glass plate (2), square column silicon rod (3) to be cut and bonding glue-line (4), the width of bearing glass plate (2) is corresponding with the length of side of square column silicon rod (3), the length of bearing glass plate (2) is corresponding with the length of square column silicon rod (3), square column silicon rod (3) to be cut by bonding glue-line (4) strong bond on the upper surface of bearing glass plate (2), the lower surface of bearing glass plate (2) is bonded on the upper surface of carrying binding platform (1) securely by bonding glue-line (4), it is characterized in that: described carrying binding platform (1) is a hollow structure, it comprises upper bearing plate (11), supporting side (12), guide rail (13), lower surface (14), cavity volume (15), lightening hole (16) and heat-conducting metal panel (17), cavity volume (15) is by upper bearing plate (11), two supporting sides (12) and lower surface (14) surround and form, lightening hole (16) is opened on the supporting side (12), guide rail (13) is connected as a single entity with the upper surface by two supporting sides (12), upper bearing plate (11) equal intervals be provided with heat-conducting metal panel (17).
2. be convenient to the silicon rod adhering device that silicon chip comes off synchronously according to claim 1 is described, it is characterized in that: on lower surface (14), be provided with lightening hole (16).
3. be convenient to the silicon rod adhering device that silicon chip comes off synchronously according to claim 1 is described, it is characterized in that: the shape of cross section of described heat-conducting metal panel (17) is trapezoidal or " protruding " font.
4. be convenient to the silicon rod adhering device that silicon chip comes off synchronously according to claim 1 is described, it is characterized in that: heat-conducting metal panel (17) is embedded on the upper surface of upper bearing plate (11).
5. be convenient to the silicon rod adhering device that silicon chip comes off synchronously according to claim 1 is described, it is characterized in that: the planeness of the upper surface of upper bearing plate (11) is 0.005～0.03, and the upper surface of heat-conducting metal panel (17) is hanged down 0～2 millimeter than the upper surface of upper bearing plate (11).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011201011077U CN201915171U (en) | 2011-04-08 | 2011-04-08 | Silicon rod bonding device facilitating synchronous falling of silicon slices |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011201011077U CN201915171U (en) | 2011-04-08 | 2011-04-08 | Silicon rod bonding device facilitating synchronous falling of silicon slices |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201915171U true CN201915171U (en) | 2011-08-03 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011201011077U Expired - Fee Related CN201915171U (en) | 2011-04-08 | 2011-04-08 | Silicon rod bonding device facilitating synchronous falling of silicon slices |
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| CN (1) | CN201915171U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102514109A (en) * | 2011-12-30 | 2012-06-27 | 上海硅酸盐研究所中试基地 | Fixed and aligned cutting method of silicon carbide crystal |
| CN102514110A (en) * | 2011-12-30 | 2012-06-27 | 上海硅酸盐研究所中试基地 | Initial processing method of high-stress silicon carbide crystals |
-
2011
- 2011-04-08 CN CN2011201011077U patent/CN201915171U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102514109A (en) * | 2011-12-30 | 2012-06-27 | 上海硅酸盐研究所中试基地 | Fixed and aligned cutting method of silicon carbide crystal |
| CN102514110A (en) * | 2011-12-30 | 2012-06-27 | 上海硅酸盐研究所中试基地 | Initial processing method of high-stress silicon carbide crystals |
| CN102514110B (en) * | 2011-12-30 | 2014-11-05 | 上海硅酸盐研究所中试基地 | Initial processing method of high-stress silicon carbide crystals |
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| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110803 Termination date: 20140408 |