CN201903698U - Laser spot shaper - Google Patents
Laser spot shaper Download PDFInfo
- Publication number
- CN201903698U CN201903698U CN2010206742500U CN201020674250U CN201903698U CN 201903698 U CN201903698 U CN 201903698U CN 2010206742500 U CN2010206742500 U CN 2010206742500U CN 201020674250 U CN201020674250 U CN 201020674250U CN 201903698 U CN201903698 U CN 201903698U
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- CN
- China
- Prior art keywords
- laser
- optical fiber
- silicon chip
- connector
- array
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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- Optical Couplings Of Light Guides (AREA)
- Mechanical Coupling Of Light Guides (AREA)
Abstract
The utility model discloses a laser spot shaper which comprises a silicon chip array and a connector; a plurality of beams of optical fibers are connected between the silicon chip array and the connector; the optical fibers are assembled into an optical fiber circumference array in the connector; one end of the silicon chip array far away from the connector is coupled and welded with the laser output end; and one end of the connector far away from the silicon chip array is hermetically fixed with a casing of the laser. When the laser spot is converted by the laser facula shaper, the laser is completely transmitted by the optical fibers, so that the laser loss is small. Moreover, the laser spot shaper has simple structure and stable and reliable laser conversion performance, and is conveniently combined with the laser. The silicon chip array in the laser spot shaper can be produced in batch and can realize the high repeatability and the interchangeability of optical performance during the use of the connector.
Description
Technical field
The relevant a kind of laser facula reshaper of the utility model is meant a kind of simple in structure, easy for installation and laser facula reshaper that cost is low especially.
Background technology
The semiconductor laser of large-power optical fiber output has in modern optical fiber telecommunications system, industrial lasers equipment, laser medicine and military affairs widely to be used, the strip cylindrical mirror is adopted in the shaping of despot's bar laser output facula more in the semiconductor laser of large-power optical fiber output in the market, optical device such as prism, and after repeatedly handling the hot spot behind the output Shaping.Too much, the complex structure of its operation device loaded down with trivial details, that adopted when adopting aforesaid way to carry out spot shaping, therefore adjust difficulty, because complex structure, optical device sealing in laser instrument is poor, cause hot spot to adjust poor stability, and because laser is to transmit fully, have the laser loss in optical device, the requirement that output laser facula quality does not reach modern laser instrument.
The utility model content
In view of this, fundamental purpose of the present utility model is to provide a kind of laser facula reshaper simple in structure, stable and reliable for performance and easy for installation.
For achieving the above object, the utility model provides a kind of laser facula reshaper, it includes silicon chip array and connector, be connected with multi beam bar optical fiber between described silicon chip array and the described connector, described optical fiber is gathered into the optical fiber circumference array in described connector, described silicon chip array is away from the laser output coupling welding of an end and the laser instrument of described connector, and described connector is fixed away from an end of described silicon chip array and the body seal of laser instrument.
One end of described silicon chip array is flat contact pin, described silicon chip array inside is formed with cavity, be provided with silicon chip linear light fibre array in the cavity of the described silicon chip array other end, have most linear optical fiber V-type grooves on this silicon chip linear light fibre array, the identical distance in interval between every adjacent two described linear optical fiber V-type grooves, described linear optical fiber V-type groove linearly type is arranged.
Described connector two ends have metal ferrule, be equipped with a described optical fiber in each described linear optical fiber V-type groove, the other end of described optical fiber is gathered into described optical fiber circumference array and enters described connector wherein in the metal ferrule of an end, and described optical fiber circumference array also extends to the end of the metal ferrule of the described connector other end.
Described flat contact pin is with the laser output coupling welding of laser instrument, and described connector is fixed away from the metal ferrule of an end of described silicon chip array and the body seal of laser instrument.
Two metal ferrule cylindricals of the circumcircle of described optical fiber circumference array and described connector are concentric circles.
Described linear optical fiber V-type groove is 19.
The utility model laser when laser facula is changed is transmitted by optical fiber fully, so the laser loss is little, and the utility model is simple in structure, and convenient with the laser instrument combination, the laser conversion performance is reliable and stable.Silicon chip array in the utility model can be produced in batches, can realize the connector in use high duplication and the interchangeability of optical property.
Description of drawings
Fig. 1 is the front view of the utility model laser facula reshaper;
Fig. 2 is the vertical view of the utility model laser facula reshaper;
Fig. 3 is the left view of the amplification of silicon chip array in the utility model;
Fig. 4 is the right view that connector amplifies in the utility model.
Embodiment
For ease of structure of the present utility model and the effect that reaches are had further understanding, the preferred embodiment that develops simultaneously of existing conjunction with figs. is described in detail as follows.
As Fig. 1 and shown in Figure 2, the utility model laser facula reshaper includes silicon chip array 1 and connector 2, be connected with multi beam bar optical fiber 3 between this silicon chip array 1 and the connector 2, silicon chip array 1 is away from the laser output coupling welding of an end and the laser instrument of connector 2, connector 2 is fixed away from an end of silicon chip array 1 and the body seal of laser instrument, and this distal process of connector 2 is for the laser instrument shell.
As Fig. 1 and shown in Figure 3, one end of silicon chip array 1 is flat contact pin 10, silicon chip array 1 inside is formed with cavity 11, be provided with silicon chip linear light fibre array 12 in the cavity 11 of silicon chip array 1 other end, these silicon chip linear light fibre array 12 employing monocrystalline silicon semiconductors are carved rotten processes and are gone out most linear optical fiber V-type grooves 120, these linearity optical fiber V-type groove 120 groove widths can reach the micron order high precision, have 19 linear optical fiber V-type grooves 120 in the utility model, and the identical distance in interval between every adjacent two linear optical fiber V-type grooves 120, and linearly type is arranged, be equipped with optical fiber 3 in each linear optical fiber V-type groove 120, the other end of optical fiber 3 is gathered into optical fiber circumference array 30 and enters in the metal ferrule 20 of connector 2, optical fiber circumference array 30 also extends to the end of the metal ferrule 21 of connector 2 other ends, as shown in Figure 4.
The utility model is with the laser output coupling welding with laser instrument of the flat contact pin 10 of silicon chip array 1, the connector 2 of laser facula reshaper is fixed with the body seal of laser instrument away from the metal ferrule 21 of silicon chip array 1, and this metal ferrule 21 protrudes in the laser instrument shell.The laser that laser instrument sends enters the cavity 11 of silicon chip array 1, and enter in the optical fiber 3 in the linear optical fiber V-type groove 120 of silicon chip linear light fibre array 12, laser transfers to connector 2 away from optical fiber circumference array 30 ends in the metal ferrule 21 of silicon chip array 1 by optical fiber 3.Because connector 2 adopts accurate machine work to join the hole away from the metal ferrule 21 of silicon chip array 1 with optical fiber circumference array 30, adopt optical fiber circumference array circumcircle and metal ferrule cylindrical to keep the turning process scheme of high concentricity simultaneously, the circumcircle of optical fiber circumference array 30 and metal ferrule 20,21 cylindrical circle center error reaches micron-sized grade, therefore and adopt accurate optical fiber grinding technics can guarantee the superiority of the optical fiber circumference array 30 end face optical properties of connector 2 bright dipping ends, become circular hot spot after the shaping of face shape scattering laser through the utility model laser facula reshaper of sending by laser instrument.
The flat contact pin 10 of the silicon chip array 1 in the utility model can adopt craft of gilding with the metal ferrule 20,21 of connector 2.Connector 2 in the utility model is the commercially available prod, can adopt the SMA joints of optical fibre, does not do detailed description at this.
The utility model laser when laser facula is changed is transmitted by optical fiber fully, so the laser loss is little, and the utility model is simple in structure, and convenient with the laser instrument combination, the laser conversion performance is reliable and stable.Silicon chip array in the utility model can be produced in batches, can realize the connector in use high duplication and the interchangeability of optical property.
The above is preferred embodiment of the present utility model only, is not to be used to limit protection domain of the present utility model.
Claims (6)
1. laser facula reshaper, it is characterized in that, it includes silicon chip array and connector, be connected with multi beam bar optical fiber between described silicon chip array and the described connector, described optical fiber is gathered into the optical fiber circumference array in described connector, described silicon chip array is away from the laser output coupling welding of an end and the laser instrument of described connector, and described connector is fixed away from an end of described silicon chip array and the body seal of laser instrument.
2. laser facula reshaper as claimed in claim 1, it is characterized in that, one end of described silicon chip array is flat contact pin, described silicon chip array inside is formed with cavity, be provided with silicon chip linear light fibre array in the cavity of the described silicon chip array other end, have most linear optical fiber V-type grooves on this silicon chip linear light fibre array, the identical distance in interval between every adjacent two described linear optical fiber V-type grooves, described linear optical fiber V-type groove linearly type is arranged.
3. laser facula reshaper as claimed in claim 2, it is characterized in that, described connector two ends have metal ferrule, be equipped with a described optical fiber in each described linear optical fiber V-type groove, the other end of described optical fiber is gathered into described optical fiber circumference array and enters described connector wherein in the metal ferrule of an end, and described optical fiber circumference array also extends to the end of the metal ferrule of the described connector other end.
4. laser facula reshaper as claimed in claim 3 is characterized in that, described flat contact pin is with the laser output coupling welding of laser instrument, and described connector is fixed away from the metal ferrule of an end of described silicon chip array and the body seal of laser instrument.
5. laser facula reshaper as claimed in claim 3 is characterized in that, two metal ferrule cylindricals of the circumcircle of described optical fiber circumference array and described connector are concentric circles.
6. laser facula reshaper as claimed in claim 2 is characterized in that, described linear optical fiber V-type groove is 19.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010206742500U CN201903698U (en) | 2010-12-22 | 2010-12-22 | Laser spot shaper |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010206742500U CN201903698U (en) | 2010-12-22 | 2010-12-22 | Laser spot shaper |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201903698U true CN201903698U (en) | 2011-07-20 |
Family
ID=44274291
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010206742500U Expired - Lifetime CN201903698U (en) | 2010-12-22 | 2010-12-22 | Laser spot shaper |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201903698U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103064190A (en) * | 2012-12-28 | 2013-04-24 | 西北核技术研究所 | Flaky light beam smoothing and reshaping device |
| CN103207431A (en) * | 2012-01-12 | 2013-07-17 | 郑州大学 | Optical fiber welding technology |
-
2010
- 2010-12-22 CN CN2010206742500U patent/CN201903698U/en not_active Expired - Lifetime
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103207431A (en) * | 2012-01-12 | 2013-07-17 | 郑州大学 | Optical fiber welding technology |
| CN103207431B (en) * | 2012-01-12 | 2014-12-10 | 郑州大学 | Optical fiber welding technology |
| CN103064190A (en) * | 2012-12-28 | 2013-04-24 | 西北核技术研究所 | Flaky light beam smoothing and reshaping device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20110720 |
|
| CX01 | Expiry of patent term |