CN201876468U - Digitiform contact and integrated circuit wafer testing machine with same - Google Patents
Digitiform contact and integrated circuit wafer testing machine with same Download PDFInfo
- Publication number
- CN201876468U CN201876468U CN 201020290872 CN201020290872U CN201876468U CN 201876468 U CN201876468 U CN 201876468U CN 201020290872 CN201020290872 CN 201020290872 CN 201020290872 U CN201020290872 U CN 201020290872U CN 201876468 U CN201876468 U CN 201876468U
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- wafer
- finger
- type contact
- contact
- integrated circuit
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Abstract
The utility model provides a digitiform contact (201) which comprises a vertical extension part (201a), a horizontal extension part (201b) and a contact finger (201c), wherein the contact finger (201c) can deform under the action of the pressure so that the rear end of the contact finger (201c) can contact with a pin of a wafer (202). The digitiform contact (201) has the advantages of avoiding the wafer pin from being bent and deforming when bearing force at the left side and the right side, and saving the space at the left side and the right side of the testing machine. Furthermore, a relatively simple structure is kept, and the cost is lower. The utility model also provides an integrated circuit wafer testing machine which adopts the digitiform contact (201).
Description
Technical field
The utility model relates to a kind of finger-type contact and adopts the integrated circuit (IC) wafer test machine of this finger-type contact.
Background technology
In the prior art, the integrated circuit (IC) wafer test machine contacts the pin of integrated circuit (IC) wafer by two row's finger-type contacts (CONTACT FINGER is also referred to as golden finger), and energising whether detect the work of wafer normal.
Fig. 1 is the principle of work synoptic diagram of more existing integrated circuit (IC) wafer test machines.Shown in Figure 1A, finger-type contact 101 is arranged at wafer 102 both sides, and with the inside thrust of horizontal direction, the finger-type contact 101 of push to test machine makes it to produce deformation and contacts with the pin of wafer 102, powers on afterwards and detects.The advantage of this test machine comprises to be made simply, and cost is lower; And, stressed because wafer passes through finger-type contact, after stressed, can between two bank contacts, rock, so the wafer shell is difficult for being damaged because of pressure.But the shortcoming of this apparatus structure is also more obvious, the one, in order to exert pressure, need pneumatics cylinder and piston rod equal power device in the left and right sides of finger-type contact, thereby the space, the left and right sides that takies is bigger; The 2nd, about the pressure size be difficult to be consistent, thereby in the test wafer easily about skew; The 3rd, make the bending of wafer pin easily in case pressure is excessive.
Figure 1B shows the principle of work synoptic diagram of another kind of existing integrated circuits wafer tester.This test machine adopts spring finger-type contact 101 ', and the pin of wafer 102 ' is contacted with spring finger-type contact 101 '.The advantage of this structure is to apply downward pressure by each pin of giving wafer, can avoid loose contact; Pin is not flexible; It is also few to take up room in addition.But its shortcoming one of the structure of this spring finger-type contact is because wafer teetertotters, and the failure rate of being damaged by pressure is higher; The 2nd, the contact will be made separately, and the spring of need packing into, so equipment cost can be higher.
The utility model content
Fundamental purpose of the present utility model promptly provides a kind of finger-type contact and adopts the integrated circuit (IC) wafer test machine of this finger-type contact, can reach the effect of spring finger-type contact under the prerequisite that keeps simple structure.
The finger-type contact that the utility model provides (201) comprises vertical stretch (201a), horizontal-extending portion (201b) and fingertip (201c); Wherein vertical stretch (201a) is fixed in the microscope carrier of test machine and extends up to the position that is higher than integrated circuit (IC) wafer (202); Horizontal-extending portion (201b) along continuous straight runs extends; Fingertip (201c) along continuous straight runs extends and end is bent downwardly, but its horizontal-extending part deformation makes end contact with the pin of wafer (202) under pressure.
Preferably, described vertical stretch (201a) connects the test circuit of test machine.
Preferably, the horizontal level of described horizontal-extending portion (201b) scalable fingertip (201c).
The utility model also provides the integrated circuit (IC) wafer test machine that adopts above-mentioned finger-type contact (201), except above-mentioned finger-type contact (201), also comprise microscope carrier (204) and pressing plate (203), its center platen (203) has two outstanding being used for and the contacted briquetting of described fingertip (201c) downwards.
The utility model contacts with the pin of integrated circuit (IC) wafer with downward direction through finger-type contact; Can avoid the wafer pin because of stressed flexural deformation, save the space, the left and right sides of test machine.And, to compare with the spring finger-type contact and to have kept relative simple structure, cost is lower, and can avoid adopting the impaired problem of the incident wafer of spring finger-type contact.
Description of drawings
Below in conjunction with the drawings and specific embodiments the utility model is described in further detail:
The principle of work synoptic diagram of the existing integrated circuit (IC) wafer test machine of Fig. 1;
Fig. 2 is the principle of work synoptic diagram of the integrated circuit (IC) wafer test machine of the utility model embodiment;
Fig. 3 is the structural drawing of the finger-type contact of the utility model embodiment;
Fig. 4 is the structural drawing of the integrated circuit (IC) wafer test machine of the utility model embodiment.
Embodiment
In order to make those skilled in the art person understand the technical solution of the utility model better, and above-mentioned purpose of the present utility model, feature and advantage can be become apparent more, below in conjunction with embodiment and embodiment accompanying drawing the utility model is described in further detail.
Fig. 2 is the principle of work synoptic diagram of the integrated circuit (IC) wafer test machine of the utility model embodiment.Finger-type contact 201 extends to the pin top of wafer 202, and its end is bent downwardly.Under the downward pressure effect that pressing plate 203 is applied, finger-type contact 201 can produce downward deformation, and the end of finger-type contact 201 is contacted with the pin of wafer 202, goes up electro-detection afterwards.
Fig. 3 has specifically illustrated the configuration diagram of finger-type contact 201.Finger-type contact 201 comprises vertical stretch 201a, the 201b of horizontal-extending portion and fingertip 201c, all adopts conductive material to make.Vertical stretch 201 is fixed in the microscope carrier of test machine, connects the test circuit of test machine, and vertically extends up to the position that is higher than integrated circuit (IC) wafer; The 201b of horizontal-extending portion along continuous straight runs extends; Fingertip 201c along continuous straight runs extends, and end is bent downwardly.Under downward pressure effect, the horizontal-extending of fingertip 201c part can produce downward crooked deformation, and its end contacts with the pin of wafer.
Fig. 4 is the structural drawing that has adopted finger-type contact 201 integrated circuit (IC) wafer test machine afterwards.Shown in Fig. 4 A, wafer 202 is placed on the microscope carrier 204 of test machine, and finger-type contact 201 reclinate fingertip 201c ends extend to the top of wafer 202 pins among Fig. 3.Pressing plate 203 connects actuating units such as pneumatics cylinder and transmission shaft, perhaps can be by the downward pressing of operator's manual drives.Pressing plate 203 has two outstanding downwards briquettings, is used for contacting with the fingertip 201c of the finger-type contact 201 of both sides.When pressing plate 203 pressed down the fingertip 201c of finger-type contact 201, shown in Fig. 4 B, fingertip 201c was bent downwardly deformation, contacted until the pin with wafer 202, and the two contact back test machine can be to fingertip 201c energising, to detect wafer.Preferably, can regulate the 201b of horizontal-extending portion of finger-type contact 201 among Fig. 3, the bent back ends of fingertip 201c is contacted with the top of wafer pin, perhaps contact, thereby select the test point position with the bottom of pin.
Finger-type contact makes it to contact with the wafer pin with the power that applies downwards, can improve contacting of finger-type contact and wafer pin, avoids the wafer pin bending of exerting pressure and causing from left and right directions, saves the space of left and right directions.And finger-type contact of the present utility model need not baroque spring finger-type contact, reduced the cost of test machine, can also reach the effect more excellent, comprise not needing directly wafer to be exerted pressure, thereby the incidence of wafer fail in compression reduces than spring finger-type contact.
The above only is an embodiment of the present utility model.Protection domain of the present utility model is not limited thereto, and anyly is familiar with those skilled in the art in the technical scope that the utility model discloses, and the variation that can expect easily or replacement all should be encompassed within the protection domain of the present utility model.Therefore, protection domain of the present utility model should be as the criterion with the protection domain that claim was defined.
Claims (4)
1. a finger-type contact (201) is characterized in that: comprise vertical stretch (201a), horizontal-extending portion (201b) and fingertip (201c); Wherein vertical stretch (201a) is fixed in the microscope carrier of test machine and extends up to the position that is higher than integrated circuit (IC) wafer (202); Horizontal-extending portion (201b) along continuous straight runs extends; Fingertip (201c) along continuous straight runs extends and end is bent downwardly, but its horizontal-extending part deformation makes end contact with the pin of wafer (202) under pressure.
2. finger-type contact according to claim 1 (201) is characterized in that, described vertical stretch (201a) connects the test circuit of test machine.
3. finger-type contact according to claim 1 (201) is characterized in that, the horizontal level of the described fingertip of described horizontal-extending portion (201b) scalable (201c).
4. integrated circuit (IC) wafer test machine, comprise microscope carrier (204) and pressing plate (203), described microscope carrier (204) is used to place wafer (202), it is characterized in that: test machine has the described finger-type contact of above each claim (201), and described pressing plate (203) has two outstanding being used for and the contacted briquetting of described fingertip (201c) downwards.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201020290872 CN201876468U (en) | 2009-11-19 | 2010-08-05 | Digitiform contact and integrated circuit wafer testing machine with same |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200920256274 | 2009-11-19 | ||
| CN200920256274.1 | 2009-11-19 | ||
| CN 201020290872 CN201876468U (en) | 2009-11-19 | 2010-08-05 | Digitiform contact and integrated circuit wafer testing machine with same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201876468U true CN201876468U (en) | 2011-06-22 |
Family
ID=44164384
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201020290872 Expired - Fee Related CN201876468U (en) | 2009-11-19 | 2010-08-05 | Digitiform contact and integrated circuit wafer testing machine with same |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201876468U (en) |
-
2010
- 2010-08-05 CN CN 201020290872 patent/CN201876468U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110622 Termination date: 20130805 |