CN201858812U - Heat radiating system - Google Patents
Heat radiating system Download PDFInfo
- Publication number
- CN201858812U CN201858812U CN2009201674523U CN200920167452U CN201858812U CN 201858812 U CN201858812 U CN 201858812U CN 2009201674523 U CN2009201674523 U CN 2009201674523U CN 200920167452 U CN200920167452 U CN 200920167452U CN 201858812 U CN201858812 U CN 201858812U
- Authority
- CN
- China
- Prior art keywords
- radiator
- water
- water tank
- cooler
- water cooler
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model discloses a heat radiating system, which comprises a water tank (5), a water pump (4), a radiator (1) and a water cooler (6). The radiator (1) is made of aluminum profile and is fin-shaped, and the semiconductor cooler is adhered to the processing plane of the fin-shaped radiator made of aluminum profile; and the water pump (4) is arranged in the water tank (5) and is connected with one end of the radiator (1) through a connecting pipe (3), the other end of the radiator (1) is connected with the water cooler (6), and the water cooler (6) is connected in the water tank (5). The water cooler (6) is arranged between the radiator (1) and the water tank (5). The radiator (1) is respectively connected with the water cooler (6) and the connecting pipe (3) through a pipe connector (2). Since the radiator (1) is fin-shaped and is made of aluminum profile, and a water circulation system is additionally arranged for cooling, the heat radiating effect of the whole heat radiating system is greatly improved.
Description
Technical field
The utility model relates to a kind of cooling system, specifically a kind of cooling system that is applied to the semiconductor devices refrigeration system.
Background technology
Current in the semiconductor devices refrigerating field, extensive use be heat radiation of finned aluminium section bar contact and the heat pipe contact two kinds of forms of dispelling the heat, because the radiating effect of these two kinds of radiators is limited, make semiconductor cooling device owing to the restriction of radiating condition is greatly affected its efficient, thereby its application is restricted.
The utility model content
For overcoming the deficiencies in the prior art, provide a kind of cooling system that can improve the semiconductor cooling device radiating effect.
For achieving the above object, the utility model is implemented by following technical solution:
A kind of cooling system comprises water tank 5, water pump 4, radiator 1, water cooler 6; The finned shape that described radiator 1 is made for aluminium section bar, semiconductor cooling device are affixed on the processing plane of finned aluminium section bar radiator 1; Water pump 4 places in the water tank 5 and by tube connector 3 and is connected with an end of radiator 1, and the other end of radiator 1 connects water cooler 6, and water cooler 6 is linked into water tank 5.Described water cooler 6 is between radiator 1 and water tank 5.Described radiator 1 is connected with tube connector 3 with water cooler 6 respectively by pipe joint 2.
Compared with prior art, the beneficial effects of the utility model are: simple in structure, good refrigeration effect.
Description of drawings
For ease of understanding the utility model, the spy is further instruction in addition in conjunction with the accompanying drawings.
Fig. 1 is an overall structure schematic diagram of the present utility model.
The specific embodiment
For the ease of understanding the utility model, the spy is further described in conjunction with the specific embodiment, but present embodiment should not regarded as any restriction of the present utility model.
A kind of cooling system comprises water tank 5, water pump 4, radiator 1, water cooler 6; The finned shape that described radiator 1 is made for aluminium section bar, semiconductor cooling device are affixed on the processing plane of finned aluminium section bar radiator 1; Water pump 4 places in the water tank 5 and by tube connector 3 and is connected with an end of radiator 1, and the other end of radiator 1 connects water cooler 6, and water cooler 6 is linked into water tank 5.Described water cooler 6 is between radiator 1 and water tank 5.Described radiator 1 is connected with tube connector 3 with water cooler 6 respectively by pipe joint 2.
Semiconductor cooling device is affixed on the processing plane of finned aluminium section bar radiator 1, its surperficial heat cools off by finned aluminium section bar radiator 1, and the mode of cooling is to finish to the stack of cooling off dual mode that circulates of the water of water tank 5 through water flow passage in tube connector 3, pipe joint 2, finned aluminium section bar radiator 1 of the pressurization of water pump 4, water cooler 6 by the convection current of fin and air with by the water in the water tank 5 again.
Because radiator 1 adopts finned aluminium section bar to add the water circulation system cooling, the radiating effect of entire heat dissipation system is improved greatly, thereby make it to be applied in the semiconductor refrigeration system, the hot-side heat dissipation effect of conductor refrigeration sheet is obviously improved, the efficient of cooling piece improves synchronously, has broken through the temperature utmost point of conventional system.
Claims (3)
1. a cooling system comprises water tank (5), water pump (4), radiator (1), water cooler (6); It is characterized in that: the finned shape that described radiator (1) is made for aluminium section bar, a semiconductor cooling device is affixed on the processing plane of finned aluminium section bar radiator (1); Water pump (4) places in the water tank (5) and by tube connector (3) and is connected with an end of radiator (1), and the other end of radiator (1) connects water cooler (6), and water cooler (6) is linked into water tank (5).
2. cooling system according to claim 1 is characterized in that: described water cooler (6) is positioned between radiator (1) and the water tank (5).
3. cooling system according to claim 1 is characterized in that: described radiator (1) is connected with tube connector (3) with water cooler (6) respectively by pipe joint (2).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009201674523U CN201858812U (en) | 2009-07-24 | 2009-07-24 | Heat radiating system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009201674523U CN201858812U (en) | 2009-07-24 | 2009-07-24 | Heat radiating system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201858812U true CN201858812U (en) | 2011-06-08 |
Family
ID=44104617
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009201674523U Expired - Fee Related CN201858812U (en) | 2009-07-24 | 2009-07-24 | Heat radiating system |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201858812U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105627662A (en) * | 2016-03-15 | 2016-06-01 | 沈阳理工大学 | Portable semiconductor refrigerator |
| CN110160176A (en) * | 2018-02-16 | 2019-08-23 | 殷震雄 | A kind of light conditioner |
-
2009
- 2009-07-24 CN CN2009201674523U patent/CN201858812U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105627662A (en) * | 2016-03-15 | 2016-06-01 | 沈阳理工大学 | Portable semiconductor refrigerator |
| CN110160176A (en) * | 2018-02-16 | 2019-08-23 | 殷震雄 | A kind of light conditioner |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: NINGBO TINGWEI ELECTRIC TECHNOLOGY CO., LTD. Free format text: FORMER OWNER: CHEN JIANBO Effective date: 20120822 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20120822 Address after: 315300 Longshan Town (farms), Zhejiang, Cixi Province Patentee after: Ningbo Tingwei Electroc Technology Co., Ltd. Address before: 315300, Zhejiang, Cixi new town foreign dragon village 11 team Patentee before: Chen Jianbo |
|
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110608 Termination date: 20160724 |