CN201856051U - Gas supply device for wire welding device - Google Patents
Gas supply device for wire welding device Download PDFInfo
- Publication number
- CN201856051U CN201856051U CN2010205765454U CN201020576545U CN201856051U CN 201856051 U CN201856051 U CN 201856051U CN 2010205765454 U CN2010205765454 U CN 2010205765454U CN 201020576545 U CN201020576545 U CN 201020576545U CN 201856051 U CN201856051 U CN 201856051U
- Authority
- CN
- China
- Prior art keywords
- gas
- bonding wire
- hollow tube
- feeder
- discharging rod
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78301—Capillary
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/8512—Aligning
- H01L2224/85148—Aligning involving movement of a part of the bonding apparatus
- H01L2224/85169—Aligning involving movement of a part of the bonding apparatus being the upper part of the bonding apparatus, i.e. bonding head, e.g. capillary or wedge
- H01L2224/8518—Translational movements
- H01L2224/85181—Translational movements connecting first on the semiconductor or solid-state body, i.e. on-chip, regular stitch
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Abstract
The utility model relates to a gas supply device for a wire welding device, and the wire welding device comprises a welding needle and a discharge member which is assembled corresponding to the welding needle, wherein the discharge member comprises a discharge rod; and the gas supply device comprises a gas output device and a gas supply mechanism, wherein the gas output device comprises a hollow pipe, a through hole which penetrates the interior of the hollow pipe and corresponds to the welding needle is formed on the peripheral wall of the hollow pipe, and one end of the hollow pipe is used for enabling the discharge rod to penetrate; and the gas supply mechanism comprises a gas conveying pipe which is communicated with the other end of the hollow pipe and used for providing gas which is blown to the free end of the welding needle and then blown to the discharge rod. Therefore, the gas can be prevented from being hindered by the discharge rod, and enabling the effect of protecting a welding ball with the gas to be more significant.
Description
Technical field
The utility model relates to a kind of feeder, relates in particular to a kind of feeder that is used for bonding wire equipment.
Background technology
In semiconductor packaging process, the normal packaging conductive wire (or being called bonding wire) that uses proof gold, aluminium silicon, gold and silver, fine copper, copper facing or other kind, chip is electrically connected on circuit board or the pin in the wire bonds mode, and this kind production method major part all is to reach by a bonding wire equipment; Yet, these a little bonding wire equipment are for to have different setting in response to various different packaging conductive wire character, some packaging conductive wire very easily combines with airborne oxygen molecule and generates oxide, and some packaging conductive wire then easily produces matsurface on the soldered ball surface, or makes soldered ball produce problems such as deflection, distortion.
Existing be used for semi-conductive bonding wire equipment, TWI298915 discloses as TaiWan, China letters patent book number, and it mainly comprises a workbench, is equipped with the discharging rod that a capillary and corresponding capillary dispose above this workbench; All wire clamps are installed in capillary (or being called porcelain mouth, chopper) top in addition and send a wire agency of a bonding wire from tangent line folder and capillary center, wherein capillary can carry out multi-direction moving above workbench, discharging rod then can heat and form soldered ball to the bonding wire of sending from capillary, and then carries out wire bonds; So, to constitute a bonding wire equipment.
Yet, be used for semi-conductive bonding wire equipment, on using, reality still has following problem points, because it is to carry out in general air, heated the metal surface of the fusion soldered ball that is produced by the discharging rod point discharge at bonding wire, very easily form oxidation, cause the phenomenon that generates rough surface or non-balls such as the skew of generation soldered ball, distortion on the soldered ball surface with airborne oxygen molecule.
Therefore, develop and a kind of feeder that is used for bonding wire equipment, bonding wire equipment comprises the discharge member that a capillary and corresponding capillary set, the discharge member has a discharging rod, feeder comprises a gas follower and a gas supply mechanism, the gas follower has a stationary pipes and the binding stationary pipes that is fixed on described discharging rod and encircles and establish a nozzle that is formed at the discharging rod outer peripheral edges, and nozzle is a conical bend pipe again; Gas supply mechanism has an appendix that is communicated with stationary pipes, in order to the free-ended gas that flows out and blow to capillary from nozzle to be provided, by this, the interference of removing oxygen in the air makes it have antioxidation, can promote the cohesive force of soldered ball and increases the soldered ball surface smoothness, and then promotes welding performance.
Yet; gas blows out when brushing soldered ball from nozzle; can be subjected to discharging rod hinders; and make that the actual scope of brushing of gas is comprehensive inadequately; cause gas can't brush this soldered ball fully; the center line of soldered ball just can not overlap with the axial line of bonding wire and align, in addition, because of gas can't be fully and constantly brushing the soldered ball outer surface; it is incomplete to make soldered ball be subjected to the effect of gas shield; that is, make that the antioxidation of soldered ball and surface smoothness and cleanliness factor effect are not good, moreover; discharging rod can not move freely in being the nozzle of conical syphon shape; therefore, can't adjust the degree of bonding wire fusion, order uses the free degree on the category to be restricted.
The utility model content
Main purpose of the present utility model is to provide a kind of feeder that is used for bonding wire equipment, avoids gas to be subjected to discharging rod and hinders, and makes effect that soldered ball is subjected to gas shield more; In view of the above, the center line of this soldered ball is brushed by nitrogen or nitrogen hydrogen mixeding gas and can preferably overlap with the axial line of bonding wire to align fully, and, soldered ball is with nitrogen or nitrogen hydrogen mixeding gas brushing the soldered ball outer surface and have the antioxidation of lifting and can increase smoothness of the surface and cleanliness factor effectively fully and constantly, in addition, because of gas can be in the diffusion of perforation periphery, moreover, discharging rod can move freely at the hollow tube that is straight-tube shape, thereby can adjust the degree of bonding wire fusion, the free degree on the category is used in expansion.
To achieve the above object, the utility model provides a kind of feeder that is used for bonding wire equipment, and described bonding wire equipment comprises the discharge member that a capillary and corresponding described capillary set, and described discharge member has a discharging rod, and this feeder comprises
One gas follower comprises a hollow tube, offers the inside that connects this hollow tube and for a perforation of the free end correspondence of described capillary, described discharging rod is arranged in an end of this hollow tube in the perisporium of this hollow tube; And
One gas supply mechanism comprises an appendix that blows to the gas of described discharging rod behind the free end that blows to described capillary again in order to provide, and this appendix is communicated with the other end of this hollow tube.
The above-mentioned feeder that is used for bonding wire equipment, wherein, this hollow tube is the ceramic material spare with insulating properties.
The above-mentioned feeder that is used for bonding wire equipment, wherein, this hollow tube is straight-tube shape.
The above-mentioned feeder that is used for bonding wire equipment, wherein, this appendix of other end socket of this hollow tube.
The above-mentioned feeder that is used for bonding wire equipment, wherein, this gas follower also comprises pull a Airtight gasket between described discharging rod and this hollow tube of folder.
The above-mentioned feeder that is used for bonding wire equipment, wherein, this gas supply mechanism also comprises a gas receiver, a pressure regulator valve and an electric control unit, this pressure regulator valve and this electric control unit communicate with each other by this appendix and this gas receiver.
Compared to prior art, the utlity model has following effect:
When gas brushes soldered ball; can not be subjected to discharging rod hinders; in view of the above; the center line of this soldered ball is brushed by nitrogen or nitrogen hydrogen mixeding gas and can preferably overlap with the axial line of bonding wire to align fully; and; soldered ball is with nitrogen or nitrogen hydrogen mixeding gas brushing the soldered ball outer surface and have the antioxidation of lifting and can increase smoothness of the surface and cleanliness factor effectively fully and constantly; in addition; because of gas can be in the diffusion of perforation periphery; make effect that soldered ball is subjected to gas shield more, moreover discharging rod can move freely at the hollow tube that is straight-tube shape; thereby can adjust the degree of bonding wire fusion, the free degree on the category is used in expansion.
Below in conjunction with the drawings and specific embodiments the utility model is described in detail, but not as to qualification of the present utility model.
Description of drawings
Fig. 1 the utility model feeder and bonding wire equipment combination schematic diagram;
Fig. 2 gas follower of the present utility model and discharging rod and appendix combination appearance figure;
Fig. 3 gas follower of the present utility model and discharging rod and appendix assembled sectional view;
Fig. 4 gas follower of the present utility model and capillary, position of bonding wire graph of a relation;
Fig. 5 the utility model feeder is applied to bonding wire equipment user mode figure;
Fig. 6 bonding wire equipment is applied to substrate and the chip routing is made cardon ();
Fig. 7 bonding wire equipment is applied to substrate and the chip routing is made cardon (two);
Fig. 8 bonding wire equipment is applied to substrate and the chip routing is made cardon (three);
Fig. 9 bonding wire equipment is applied to substrate and the chip routing is made cardon (four).
Wherein, Reference numeral
10 gas followers
11 hollow tubes
12 perforations
13 Airtight gaskets
20 gas supply mechanisms
21 gas receivers
22 pressure regulator valves
23 electric control units
24 appendixs
6 bonding wire equipment
61 workbenches
62 capillaries
63 discharge members
631 discharging rods
632 discharging rod tips
64 tangent lines folder
7 bonding wires
8 substrates
81 pads
9 chips
The specific embodiment
In order further to understand feature of the present utility model and technology contents, see also following about detailed description of the present utility model and accompanying drawing, yet appended graphic only provide with reference to and the explanation usefulness, be not to be used for the utility model is limited.
See also Fig. 1 to shown in Figure 4, the utility model provides a kind of feeder that is used for bonding wire equipment, bonding wire equipment 6 can be used for encapsulation such as IC, LED or SAW, it mainly comprises the discharge member 63 that a workbench 61, a capillary 62 and corresponding capillary 62 set, the discharge member 63 of capillary 62 and 62 configurations of corresponding capillary is the tops that are provided in this workbench 61, and this discharge member 63 has a discharging rod (EFO) 631 and reaches from the discharging rod tip 632 that discharging rod 631 extends outward; In addition, all wire clamps 64 are installed above capillary 62 and send the wire agency (not shown) of a bonding wire 7 from tangent line folder 64 and capillary 62 centers, this bonding wire 7 can be the packaging conductive wire of proof gold, aluminium silicon, gold and silver, fine copper, copper facing or other kind, wherein capillary 62 can carry out multi-direction moving above workbench 61, and discharging rod most advanced and sophisticated 632 then can heat the bonding wire of sending from capillary 62 7.
Feeder of the present utility model comprises a gas follower 10 and a gas supply mechanism 20, the gas follower 10 of present embodiment comprises a hollow tube 11 and an Airtight gasket 13, it is made that this hollow tube 11 can be the ceramic material with insulating properties, but be not restriction with this material, hollow tube 11 is for being straight-tube shape again, one end of hollow tube 11 is to supply the discharging rod 631 of discharge member 63 to wear and fix, 13 of Airtight gaskets are that folder is pulled between discharging rod 631 and hollow tube 11, it has the function of fixing discharging rod 631 and reaches the effect of barrier gas (can do to describe explanation in subsequently), in addition, perisporium in hollow tube 11 offers inside that connects hollow tube 11 and a perforation 12 that supplies the free end correspondence of capillary 62, in this embodiment, discharging rod tip 632 only enters in the scope of perforation 12 a little.
See also shown in Figure 5, be to provide nitrogen or nitrogen hydrogen mixeding gas during use from gas receiver 21, these a little gases are flowed through in regular turn from appendix 24 behind pressure regulator valve 22 and the electric control unit 23, flow into hollow tube 11 inside again, and go out from perforation 12 dissipations, at this moment, the most advanced and sophisticated 632 pairs of bonding wires of sending from capillary 62 7 of discharging rod heat, to produce the spherical shape soldered ball of fusion at bonding wire 7 ends, and nitrogen or nitrogen and hydrogen mixture cognition are constantly being brushed soldered ball.
Because when gas brushes soldered ball; can not be subjected to discharging rod 631 hinders; in view of the above; the center line of this soldered ball is brushed fully by nitrogen or nitrogen hydrogen mixeding gas and can preferably overlap with the axial line of bonding wire 7 to align; and; soldered ball is with nitrogen or nitrogen hydrogen mixeding gas brushing the soldered ball outer surface and have the antioxidation of lifting and can increase smoothness of the surface and cleanliness factor effectively fully and constantly; in addition; because of gas can be in perforation 12 periphery diffusions; make effect that soldered ball is subjected to gas shield more; moreover; discharging rod 631 can move freely at the hollow tube 11 that is straight-tube shape; thereby can adjust the degree of bonding wire 7 fusions, the free degree on the category is used in expansion.
See also Fig. 6 to shown in Figure 9, respectively make cardon for what bonding wire equipment was applied to substrate and chip routing, behind the spherical shape soldered ball of finishing bonding wire 7 ends, can carry out routing with chip 9 to the substrate 8 that is seated in workbench 61 tops is connected, substrate 8 is provided with the fixed area of putting for chip 9, and be laid with pad (PAD) 81 in this fixed area outside, during capillary 62 starts be move to earlier chip 9 treat that soldered ball welds after, again by capillary 62 outwardly side shifting to pad 81 give solid welding and cut off.
Certainly; the utility model also can have other various embodiments; under the situation that does not deviate from the utility model spirit and essence thereof; those of ordinary skill in the art work as can make various corresponding changes and distortion according to the utility model, but these corresponding changes and distortion all should belong to the protection domain of the appended claim of the utility model.
Claims (6)
1. feeder that is used for bonding wire equipment, described bonding wire equipment comprise the discharge member that a capillary and corresponding described capillary set, and described discharge member has a discharging rod, it is characterized in that, this feeder comprises:
One gas follower comprises a hollow tube, offers the inside that connects this hollow tube and for a perforation of the free end correspondence of described capillary, described discharging rod is arranged in an end of this hollow tube in the perisporium of this hollow tube; And
One gas supply mechanism comprises an appendix that blows to the gas of described discharging rod behind the free end that blows to described capillary again in order to provide, and this appendix is communicated with the other end of this hollow tube.
2. the feeder that is used for bonding wire equipment according to claim 1 is characterized in that, this hollow tube is the ceramic material spare with insulating properties.
3. the feeder that is used for bonding wire equipment according to claim 1 is characterized in that this hollow tube is straight-tube shape.
4. the feeder that is used for bonding wire equipment according to claim 1 is characterized in that, this appendix of other end socket of this hollow tube.
5. the feeder that is used for bonding wire equipment according to claim 1 is characterized in that, this gas follower also comprises pull a Airtight gasket between described discharging rod and this hollow tube of folder.
6. the feeder that is used for bonding wire equipment according to claim 1, it is characterized in that, this gas supply mechanism also comprises a gas receiver, a pressure regulator valve and an electric control unit, and this pressure regulator valve and this electric control unit communicate with each other by this appendix and this gas receiver.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010205765454U CN201856051U (en) | 2010-10-20 | 2010-10-20 | Gas supply device for wire welding device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010205765454U CN201856051U (en) | 2010-10-20 | 2010-10-20 | Gas supply device for wire welding device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201856051U true CN201856051U (en) | 2011-06-08 |
Family
ID=44101868
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010205765454U Expired - Fee Related CN201856051U (en) | 2010-10-20 | 2010-10-20 | Gas supply device for wire welding device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201856051U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102259246A (en) * | 2011-07-19 | 2011-11-30 | 东莞佰鸿电子有限公司 | Light-emitting diode (LED) connecting line welding anti-oxidation device |
-
2010
- 2010-10-20 CN CN2010205765454U patent/CN201856051U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102259246A (en) * | 2011-07-19 | 2011-11-30 | 东莞佰鸿电子有限公司 | Light-emitting diode (LED) connecting line welding anti-oxidation device |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN201543975U (en) | Gas supply device for welding wire equipment | |
| CN107256834B (en) | A kind of bonding semiconductor technique based on palladium copper wire | |
| CN201856051U (en) | Gas supply device for wire welding device | |
| CN202539740U (en) | Air supply device for welding line equipment | |
| CN206241480U (en) | For the feeder of the improvement of bonding equipment | |
| CN200939535Y (en) | Circular hot air welding tip | |
| CN102950374A (en) | Tip contact type parallel electrode welding head | |
| CN102623363A (en) | Method for joining bonding wire, semiconductor device, and method for manufacturing semiconductor device | |
| CN205039011U (en) | Copper core wire drawing annealing integral type device | |
| TWM366073U (en) | Improved non-soldering assembly structure of IC substrate | |
| CN204348686U (en) | A kind of IC encapsulates copper wire bonding protective device | |
| CN207474452U (en) | A kind of lead frame of semiconductor packaging structure | |
| CN201247767Y (en) | Oxidation-proof protection device for automatic heat pressing ultrasound ball welder of integrated circuit | |
| CN205900811U (en) | Take over waterproof terminal in pyrocondensation of high tensile soldering tin ring | |
| CN201164920Y (en) | Tin-soldering electric soldering bit | |
| CN101431059A (en) | Routing structure and method thereof | |
| CN209731713U (en) | A kind of mostly folding lead ceramic shell pin configuration and encapsulating structure | |
| CN105870028B (en) | The method of molybdenum and silicon base welding in feds | |
| CN203218229U (en) | Copper wire bonding structure between chip pad points | |
| CN206662568U (en) | A kind of integrated circuit copper wire welding protection device | |
| CN204204843U (en) | Chip package structure | |
| CN212885577U (en) | Install vacuum generator's ASM equipment additional | |
| CN203804104U (en) | Copper wire welding equipment | |
| CN102554526A (en) | Copper ball protection method for copper wire bonding of semiconductor device and protection device thereof | |
| CN206834360U (en) | A kind of welding mechanism of connection |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110608 Termination date: 20191020 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |