CN201853182U - Multi-folded type radiating fin and electronic device adopting same - Google Patents
Multi-folded type radiating fin and electronic device adopting same Download PDFInfo
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- CN201853182U CN201853182U CN2010206145425U CN201020614542U CN201853182U CN 201853182 U CN201853182 U CN 201853182U CN 2010206145425 U CN2010206145425 U CN 2010206145425U CN 201020614542 U CN201020614542 U CN 201020614542U CN 201853182 U CN201853182 U CN 201853182U
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- lamellar body
- heat
- circuit board
- conducting block
- bended
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Abstract
The utility model discloses a multi-folded type radiating fin and an electronic device applying same. The electronic device comprises a circuit board, a keyboard module and the multi-folded type radiating fin, wherein a heating element is arranged at one side of the circuit board; the keyboard module is positioned at one side of the circuit board opposite to the heating element; the multi-folded type radiating fin comprises a first fin body, a second fin body and a connecting piece body; the first fin body is contacted with a first heating element; the second fin body is contacted with the keyboard module; and the two ends of the connecting piece body are respectively connected with the first fin body and the second fin body in an integrated molding way, and pass through an opening of the circuit board.
Description
Technical field
The utility model relates to a kind of heat radiator, particularly relates to a kind of multi-bended heat radiator and adopts the electronic installation of this multi-bended heat radiator.
Background technology
Traditional Thin Client (Thin Client) can be arranged at work chip (Chipset) motherboard top, and its main radiating mode is that the homonymy at motherboard is sticked a heat radiator on the chip of working.So, after heat radiator is shared heat energy equably, under the effect of natural convection, can make heat energy upwards be directed to air, and then leave Thin Client.
Yet,, also work chip (Chipset) might be arranged at the motherboard below when Thin Client during similar in appearance to the external form of mobile computer.So, even the homonymy at motherboard is sticked identical heat radiator on the work chip, heat radiator will be worked after heat energy that chip produced shares, heat energy on the heat radiator can be emitted under the natural convection effect in the air below the motherboard, but because air can be moved upward after meeting heat, therefore heat energy still accumulates on the motherboard below constantly, can't be apace with the heat energy band outside this Thin Client.
The utility model content
The utility model is the purpose electronic installation that is to disclose a kind of multi-bended heat radiator and adopts this multi-bended heat radiator wherein, in order to apace heat energy is guided in the outer air of electronic installation, avoid heat energy to accumulate on the motherboard below constantly, and then reduce electronic installation because of the overheated probability that influences usefulness.
The utility model comprises a circuit board, one first heater element, a Keysheet module and a multi-bended heat radiator according to the electronic installation that an embodiment is provided.Circuit board has an opening and relative first side and second side.First heater element is positioned at first side of circuit board.Keysheet module is positioned at second side of circuit board.Multi-bended heat radiator comprises that one first lamellar body, one second lamellar body and one first connect lamellar body.First lamellar body is positioned at first side of circuit board and contacts first heater element.Second lamellar body is positioned at second side and the contact-key disk module of circuit board.The first brace body is positioned between first lamellar body and second lamellar body, and first two ends that connect lamellar body are connected between first lamellar body and second lamellar body respectively one-body moldedly, and first connects the opening that lamellar body passes circuit board.
In this embodiment, multi-bended heat radiator also comprises one first heat-conducting block and one second heat-conducting block.First heat-conducting block is convexly set in the surface of the first lamellar body face circuit board, and contacts first heater element.Second heat-conducting block is convexly set in the surface of second lamellar body in the face of Keysheet module, and the contact-key disk module.
In addition, electronic installation also comprises one second heater element.Second heater element is positioned at first side of circuit board.Multi-bended heat radiator also comprises one the 3rd heat-conducting block.The 3rd heat-conducting block is convexly set in the surface of the first lamellar body face circuit board, and contacts second heater element.
Among the embodiment of the present utility model, Keysheet module comprises a key groups.One side of key groups has a plurality of metalworks, and the contact of second heat-conducting block is a metalwork wherein.
Among another embodiment of the present utility model, Keysheet module comprises a key groups and a keypad support frame.The keypad support chord position is between the key groups and second lamellar body, in order to fixing and support this key groups, and second heat-conducting block contact keyboard bracing frame.
Among the another embodiment of the present utility model, electronic installation also comprises a base, a display screen and a pivot member.Base containment circuit board, first heater element, Keysheet module and multi-bended heat radiator are in wherein.Pivot member articulates display screen and base.Simultaneously, multi-bended heat radiator comprises that also one the 3rd lamellar body, a pivot connection and one second connect lamellar body.The pivot connection is positioned at the surface of the 3rd lamellar body, and connects pivot member.The second brace body is positioned between second lamellar body and the 3rd lamellar body, and second both sides that connect lamellar body connect second lamellar body and the 3rd lamellar body respectively one-body moldedly, makes second lamellar body and the 3rd lamellar body be in Different Plane respectively.
The utility model is according to a kind of multi-bended heat radiator that another embodiment provided.Multi-bended heat radiator comprises that one first lamellar body, one second lamellar body, one the 3rd lamellar body, one first heat-conducting block, one second heat-conducting block, one first connect lamellar body, one second and connect a lamellar body and a pivot connection.First heat-conducting block is convexly set in the surface of first lamellar body, and in order to contact a heater.Second heat-conducting block is convexly set in the surface of second lamellar body, and in order to contact a radiator.First connects the lamellar body two ends is connected between first lamellar body and second lamellar body respectively one-body moldedly, makes first lamellar body and second lamellar body be in Different Plane respectively.The pivot connection is positioned at the surface of the 3rd lamellar body, in order to connect a pivot member.Second connects the lamellar body two ends is connected between second lamellar body and the 3rd lamellar body respectively one-body moldedly, makes second lamellar body and the 3rd lamellar body be in Different Plane.
In sum, by multi-bended heat radiator of the present utility model, the heat energy that pyrotoxin produced in the electronic installation can be apace through Keysheet module, and is directed in the air outside the electronic installation, and then keeps the due serviceability of electronic installation.
Description of drawings
For above-mentioned and other purpose of the present utility model, feature, advantage and embodiment can be become apparent, being described in detail as follows of appended accompanying drawing:
Fig. 1 illustrates the schematic appearance of the multi-bended heat radiator of the utility model;
Fig. 2 illustrates the generalized schematic of the utility model electronic installation;
Embodiment generalized schematic when Fig. 3 A illustrates the utility model electronic installation and is a mobile computer;
Fig. 3 B illustrates the partial enlarged drawing in the M1 zone of Fig. 3 A;
Another embodiment generalized schematic when Fig. 4 A illustrates the utility model electronic installation and is a mobile computer;
Fig. 4 B illustrates the partial enlarged drawing in the M2 zone of Fig. 4 A.
[main description of reference numerals]
100: multi-bended heat radiator 301,302: gim peg
101: first surface 310: circuit board
102: 311: the first sides of second surface
312: the second sides of 110: the first lamellar bodies
Heat-conducting block 313 in 111: the first: opening
320: the first heater elements of 112: the three heat-conducting blocks
330: the second heater elements of 120: the second lamellar bodies
Heat-conducting block 340 in 121: the second: Keysheet module
130: the first connection lamellar bodies 341: key groups
Lamellar body 342 in 140: the three: button
141: pivot connection 343: metalwork
150: the second connection lamellar bodies 344: keypad support frame
160: pilot hole 400: display screen
200: electronic installation 500: pivot member
201: mobile computer M1, M2: magnification region
300: base
Embodiment
Below will clearly demonstrate spirit of the present utility model with accompanying drawing and detailed description, as the person skilled in the art after understanding embodiment of the present utility model, when can be by the technology of the utility model institute teaching, change and modification, it does not break away from spirit of the present utility model and scope.
See also shown in Figure 1ly, Fig. 1 illustrates the schematic appearance of the multi-bended heat radiator of the utility model.The utility model provides a kind of multi-bended heat radiator 100.This multi-bended heat radiator 100 is stereo structure, is made more than twice through reflexed by a sheet metal.This multi-bended heat radiator 100 integrally has an opposite first 101 and a second surface 102, and multi-bended heat radiator 100 can be divided into one first lamellar body 110 at least, one second lamellar body 120 and one first connects lamellar body 130.
The first connection lamellar body 130 is between first lamellar body 110 and second lamellar body 120, and first two ends that connect lamellar body 130 connect first lamellar body 110 and second lamellar body 120 respectively one-body moldedly, make win lamellar body 110 and second lamellar body 120 can be in Different Plane respectively, meaning i.e. plane and the vertical height that the plane was separated by of second lamellar body 120 of first lamellar body 110 is first width that is connected lamellar body 130.
In other embodiments, first lamellar body 110 and second lamellar body 120 also can be distinguished oblique connection first and connect lamellar body 130, and the plane that makes the lamellar body 110 of winning and the vertical height that the plane was separated by of second lamellar body 120 are less than first width that is connected lamellar body 130.
In addition, has the surface that outstanding first heat-conducting block, 111, the first heat-conducting blocks 111 are convexly set in first lamellar body 110 on the first surface 101 of multi-bended heat radiator 100, so that first heat-conducting block 111 can contact a heater.Second heat-conducting block 121 has outstanding second heat-conducting block, 121, the second heat-conducting blocks 121 on the first surface 101 of multi-bended heat radiator 100 and is convexly set in the surface of second lamellar body 120, so that can contact a radiator.So, but the just thermal conductance heater and the radiator that connect the different vertical height of multi-bended heat radiator 100 carries out heat interchange each other to impel between this heater and this radiator.
In addition, multi-bended heat radiator 100 is " Z " font, and meaning i.e. first lamellar body 110 is connected lamellar body 1 30 from first respectively with second lamellar body 120 and extends in the opposite direction, with the cooperation heater allocation position corresponding with radiator.
Yet in order to cooperate heater and the radiator allocation position in other, among other embodiment, multi-bended heat radiator also can be " ㄈ " font, and meaning i.e. first lamellar body also can be connected lamellar body from first respectively with second lamellar body and extends in the same direction.
Consult shown in Figure 1 again, among the embodiment of the present utility model, because the area of first lamellar body 110 is greater than the area of second lamellar body 120, therefore also can have how outstanding heat-conducting block (back claims the 3rd heat-conducting block 112) on the multi-bended heat radiator 100, the 3rd heat-conducting block 112 is convexly set in the surface of first lamellar body 110, so that contact more heater, and then these heat energy are conducted to radiator through multi-bended heat radiator 100.
Yet, among other the embodiment, the utility model is not also got rid of the area (not shown) of the area of second lamellar body 120 more than or equal to first lamellar body 110, make multi-bended heat radiator 100 can provide how outstanding heat-conducting block on second lamellar body 120, so that these heat-conducting blocks are the identical or different radiator of contact in addition, increase more area of dissipation, and then improve the efficient of heat radiation.
Needing one at this, what carry is that it is identical or inequality with the material (for example copper coin or aluminium sheet) of multi-bended heat radiator 100 that the material of first heat-conducting block 111, second heat-conducting block 121 or the 3rd heat-conducting block 112 is not limit.Designer of the present utility model also can be in order to improve the heat conduction efficiency of first heat-conducting block 111, second heat-conducting block 121 or the 3rd heat-conducting block 112, and use the material of preferable transmissibility instead.
See also shown in Figure 2ly, Fig. 2 illustrates the local generalized schematic of the utility model electronic installation 200.The utility model provides a kind of electronic installation 200 that adopts above-mentioned multi-bended heat radiator 100 in addition.This electronic installation 200 comprises a circuit board 310, one first heater element 320, one second heater element 330, a Keysheet module 340 and above-mentioned multi-bended heat radiator 100.
This circuit board 310 is located in this electronic installation 200, and circuit board 310 has the first relative side 311 and second side 312.This circuit board 310 is a motherboard for example, and first side 311 for example is a downside, and second side 312 for example is a upside.
The one side of Keysheet module 340 exposes to the surface of electronic installation 200, and the another side of Keysheet module 340 is located in the electronic installation 200, and is positioned at second side, 312 tops of circuit board 310.
Above-mentioned multi-bended heat radiator 100 is located in this electronic installation 200, and the heater element 320,330 and the Keysheet module 340 of difference thermo-contact different vertical height.Specifically, an end of above-mentioned multi-bended heat radiator 100 is positioned at first side 311 of circuit board 310 and contacts first heater element 320.The other end of multi-bended heat radiator 100 is positioned at second side 312 and the contact-key disk module 340 of circuit board 310.Multi-bended heat radiator 310 also passes the opening 313 (for example perforate or breach) of circuit board 310.
Because the air of top exposed outside electronic installation 200 of Keysheet module 340, so, when the heat energy of first heater element 320, second heater element 330 is passed to Keysheet module 340 via multi-bended heat radiator 100, by the effect of natural convection, Keysheet module 340 can guide to heat energy in electronic installation 200 air outward.
Particularly, first lamellar body 110 of multi-bended heat radiator 100 is positioned at first side 311 of circuit board 310, and makes first heat-conducting block, 111 contacts, first heater element 320, and makes the 3rd heat-conducting block 112 contacts second heater element 330.Second lamellar body 120 of multi-bended heat radiator 100 is positioned at second side 312 of circuit board 310, and makes second heat-conducting block, 121 contact-key disk modules 340.First connects the opening 313 that 130 of lamellar bodies pass through circuit board 310, makes second side 312 of brace body 130 from first side, the 311 process circuit boards 310 of circuit board 310 of winning.
In other embodiments, first lamellar body also can directly contact first heater element.Second lamellar body is direct contact-key disk module also.
It should be noted that electronic installation 200 described in the utility model can be made a general reference any electronic installation 200 with button, for example mobile computer, personal digital assistant (Personal Digital Assistant; PDA), e-dictionary, game machine, mobile phone or other portable device or the like.
The utility model is following to be example by a mobile computer 201 (or Thin Client), so that the mutual relationship of multi-bended heat radiator 100 and mobile computer 201 more is described in detail in detail.
See also shown in Fig. 3 A and Fig. 3 B embodiment generalized schematic when Fig. 3 A illustrates the utility model electronic installation 200 and is a mobile computer 201.Fig. 3 B illustrates the partial enlarged drawing in the M1 zone of Fig. 3 A.
Among this embodiment, mobile computer 201 comprises a base 300, a display screen 400 and a pivot member 500.Pivot member 500 articulates display screen 400 and bases 300, makes display screen 400 to be rotated and is covered on the base 300, or be rotated and away from base 300.Base 300 for example is considered as a hollow shell, can hold above-mentioned circuit board 310, Keysheet module 340, each heater element and multi-bended heat radiator 100 in wherein.
Specifically, circuit board 310 is located in the base 300 with lying low.By gim peg 301, circuit board 310 interfixes with base 300.First lamellar body 110 of multi-bended heat radiator 100 is between circuit board 310 and base 300.By gim peg 302, gim peg 302 passes the pilot hole 160 of first lamellar body 110, makes that the lamellar body 110 of winning can be fixed on the base 300, on first side 311 of circuit board 310 or be fixed in simultaneously on base 300 or the circuit board 310.So, make win heat-conducting block 111 and the 3rd heat-conducting block 112 can more firmly contact first heater element 320 and second heater element 330 respectively, to keep its heat conducting efficient.
Because first lamellar body 110 of this multi-bended heat radiator 100 is fixed on the base 300, add that first lamellar body 110, first connects lamellar body 130 and second lamellar body 120 is one-body molded each other, so, second heat-conducting block 121 of second lamellar body 120 is contact-key disk module 340 firmly also, to keep its heat conducting efficient.
See also shown in Fig. 3 B, among this embodiment, Keysheet module 340 comprises a key groups 341.Key groups 341 comprises a plurality of spaced buttons 342, and each button 342 identical side all has a metalwork 343.The material of these metalworks 343 for example is the metal of tool good coefficient such as aluminium or copper.So, when second heat-conducting block, the 121 contact-key disk modules 340 of second lamellar body 120, second heat-conducting block 121 is one of them metalwork 343 of contact.Former, when the heat energy of each heater element was passed to the metalwork 343 of Keysheet module 340 via multi-bended heat radiator 100, by the effect of natural convection, metalwork 343 can upwards guide to heat energy in electronic installation 200 air outward.
See also shown in Fig. 4 A and Fig. 4 B.Another embodiment generalized schematic when Fig. 4 A illustrates the utility model electronic installation 200 and is a mobile computer 201.Fig. 4 B illustrates the partial enlarged drawing in the M2 zone of Fig. 4 A.
See also shown in Fig. 4 B, among this another embodiment, Keysheet module 340 comprises a key groups 341 and a keypad support frame 344.Key groups 341 comprises a plurality of spaced buttons 342, and each button 342 identical side all has a metalwork 343.Keypad support frame 344 is between the key groups 341 and second lamellar body 120, and in order to fixing and support the outside surface that this key groups 341 is positioned at this mobile computer 201, and the area of keypad support frame 344 is greater than the area of the metalwork 343 of each button 342.The material of keypad support frame 344 and these metalworks 343 for example is the metal of tool good coefficient such as aluminium or copper.So, when second heat-conducting block, the 121 contact-key disk modules 340 of second lamellar body 120, second heat-conducting block 121 is keypad support framves 344 of contact key groups 341.So above-mentioned each heater element 320,330 heat energy that transmitted just can be shared on keypad support frame 344 equably, and by the effect of natural convection, keypad support frame 344 is upwards guided in the air of heat energy to electronic installation 200.
Consult again shown in Fig. 1, Fig. 2 and Fig. 3 A, among another embodiment of the present utility model, multi-bended heat radiator 100 comprises that also one the 3rd lamellar body 140 and one second connects lamellar body 150.Second connects lamellar body 150 between second lamellar body 120 and the 3rd lamellar body 140, and second two ends that connect lamellar body 1 50 connect second lamellar body 120 and the 3rd lamellar body 140 respectively one-body moldedly, make second lamellar body 120 and the 3rd lamellar body 140 can be in Different Plane respectively.
In addition, multi-bended heat radiator 100 also comprises a pivot connection 141, pivot connection 141 is positioned at the surface of the 3rd lamellar body 140, and connect above-mentioned pivot member 500, whereby, the heat energy of above-mentioned each heater element 320,330 also can be conducted to pivot member 500 via the second connection lamellar body 150 and the 3rd lamellar body 140.Because the material of pivot member 500 is the metal of tool good coefficient such as aluminium or copper also for example, pivot member 500 also can help the conduction of heat energy.
In addition, generally speaking, the heat energy that light source produced for the display screen 400 that effectively leaves, display screen 400 also has its heat dissipation design (for example heat-dissipating casing), so, when the pivot connection 141 of multi-bended heat radiator 100 connected pivot member 500, multi-bended heat radiator 100 also can reach display screen 400 partially with above-mentioned each heater element 320,330 heat energy that produced, and helped multi-bended heat radiator 100 to dispel the heat by display screen 400.
Again, although above-mentioned each heater element 320,330 heat energy that transmitted are the effects (passive heat radiation) by natural convection, in the air of key groups 341 guiding heat energy to electronic installation 200, the utility model is not got rid of yet and is had active heat removal element (not shown) in the electronic installation, fan for example, also can strengthen discharging heat energy to electronic installation by the air-flow that fan is exported, alleviate the burden of multi-bended heat radiator.
In sum, multi-bended heat radiator of the present utility model can cooperate the heater and the radiator of different vertical height in the electronic installation, makes the heat energy that heater produced can be directed to radiator apace.In addition, because Keysheet module is arranged at the surface of electronic installation, the heat energy that heater produced just can be directed to outside the electronic installation more quickly, and then keeps the due serviceability of electronic installation.
The utility model discloses among as above each embodiment; be not in order to limit the utility model; any those of ordinary skills; in not breaking away from spirit and scope of the present utility model; when can being used for a variety of modifications and variations, therefore protection domain of the present utility model is as the criterion when looking the scope that the accompanying Claim book defined.
Claims (7)
1. an electronic installation is characterized in that, comprising:
One circuit board has the first relative side and second side, and has an opening;
One first heater element is positioned at this first side of this circuit board;
One Keysheet module is positioned at this second side of this circuit board; And
One multi-bended heat radiator comprises:
One first lamellar body is positioned at this first side of this circuit board and contacts this first heater element;
One second lamellar body is positioned at this second side of this circuit board and contacts this Keysheet module; And
One first connects lamellar body, and these first connection lamellar body two ends are connected between this first lamellar body and this second lamellar body respectively one-body moldedly, and this first connection lamellar body passes this opening of this circuit board.
2. electronic installation according to claim 1 is characterized in that, also comprises:
One base holds this circuit board, this first heater element, this Keysheet module and this multi-bended heat radiator;
One display screen;
One pivot member articulates this display screen and this base; And
This multi-bended heat radiator also comprises:
One the 3rd lamellar body;
One pivot connection is positioned at the surface of the 3rd lamellar body, and connects this pivot member; And
One second connects lamellar body, and these second connection lamellar body two ends are connected between this second lamellar body and the 3rd lamellar body respectively one-body moldedly, make this second lamellar body and the 3rd lamellar body be in Different Plane respectively.
3. electronic installation according to claim 1 is characterized in that, this multi-bended heat radiator also comprises:
One first heat-conducting block is convexly set in the surface of this first lamellar body in the face of this circuit board, and contacts this first heater element; And
One second heat-conducting block is convexly set in the surface of this second lamellar body in the face of this Keysheet module, and contacts this Keysheet module.
4. electronic installation according to claim 2 is characterized in that, this multi-bended heat radiator also comprises:
One first heat-conducting block is convexly set in the surface of this first lamellar body in the face of this circuit board, and contacts this first heater element; And
One second heat-conducting block is convexly set in the surface of this second lamellar body in the face of this Keysheet module, and contacts this Keysheet module.
5. electronic installation according to claim 4 is characterized in that, this Keysheet module comprises:
One key groups, the one side has a plurality of metalworks, and one of them of these a plurality of metalworks contacts this second heat-conducting block.
6. electronic installation according to claim 4 is characterized in that, this Keysheet module comprises:
One key groups; And
One keypad support frame, between this key groups and this second lamellar body, in order to fix and to support this key groups, wherein this second heat-conducting block contacts this keypad support frame.
7. a multi-bended heat radiator is characterized in that, comprising:
One first lamellar body;
One first heat-conducting block is convexly set in the surface of this first lamellar body, and in order to contact a heater;
One second lamellar body;
One second heat-conducting block is convexly set in the surface of this second lamellar body, and in order to contact a radiator;
One first connects lamellar body, and these first connection lamellar body two ends are connected between this first lamellar body and this second lamellar body respectively one-body moldedly, make this first lamellar body and this second lamellar body be in Different Plane respectively;
One the 3rd lamellar body;
One pivot connection is positioned at the surface of the 3rd lamellar body, in order to connect a pivot member; And
One second connects lamellar body, and these first connection lamellar body two ends are connected between this second lamellar body and the 3rd lamellar body respectively one-body moldedly, make this second lamellar body and the 3rd lamellar body be in Different Plane.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010206145425U CN201853182U (en) | 2010-11-17 | 2010-11-17 | Multi-folded type radiating fin and electronic device adopting same |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010206145425U CN201853182U (en) | 2010-11-17 | 2010-11-17 | Multi-folded type radiating fin and electronic device adopting same |
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| Publication Number | Publication Date |
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| CN201853182U true CN201853182U (en) | 2011-06-01 |
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| CN2010206145425U Expired - Fee Related CN201853182U (en) | 2010-11-17 | 2010-11-17 | Multi-folded type radiating fin and electronic device adopting same |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103841805A (en) * | 2012-11-27 | 2014-06-04 | 西门子公司 | Programmable controller having a heatsink |
-
2010
- 2010-11-17 CN CN2010206145425U patent/CN201853182U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103841805A (en) * | 2012-11-27 | 2014-06-04 | 西门子公司 | Programmable controller having a heatsink |
| CN103841805B (en) * | 2012-11-27 | 2017-04-12 | 西门子公司 | Programmable controller having a heatsink |
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Granted publication date: 20110601 Termination date: 20161117 |
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