CN201852858U - Semiconductor performance testing frame - Google Patents
Semiconductor performance testing frame Download PDFInfo
- Publication number
- CN201852858U CN201852858U CN 201020578497 CN201020578497U CN201852858U CN 201852858 U CN201852858 U CN 201852858U CN 201020578497 CN201020578497 CN 201020578497 CN 201020578497 U CN201020578497 U CN 201020578497U CN 201852858 U CN201852858 U CN 201852858U
- Authority
- CN
- China
- Prior art keywords
- contact disc
- base
- testing jig
- testing frame
- vertical rod
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Abstract
The utility model relates to a tool in the technical field of production of semiconductors, in particular to a semiconductor performance testing frame which comprises a testing frame body and is characterized in that the testing frame body comprises a base, wherein a vertical rod is arranged on the base; an extension structure is arranged on the vertical rod; an upper contact disc is connected to the extension structure; and a lower contact disc corresponding to the upper contact disc is further arranged on the base. Further, a semiconductor heating part is further arranged on the lower contact disc. The semiconductor performance testing frame has the advantages of being convenient to use and being high in testing efficiency.
Description
Technical field
The utility model relates to the instrument in semiconductor fabrication techniques field, particularly a kind of semiconducting behavior testing jig.
Background technology
Need after semiconductor is made its performance is tested, in the prior art, two patch conductor that are to use are contact jaw, the two ends of tablet contact semiconductor, such tablet is two free ends, will bother very much with manually making tablet and semi-conductive two end in contact during use.
Summary of the invention
The purpose of this utility model is exactly at above-mentioned shortcoming, and a kind of semiconducting behavior testing jig easy to use is provided.
The novel technical scheme of taking of this use is: the semiconducting behavior testing jig, comprise the testing jig body, it is characterized in that: described testing jig body has a base, a vertical rod is arranged on the base, have one in the vertical rod and stretch out structure, stretch out and be connected with contact disc on the structure, on base, also have the following contact disc of and last contact disc correspondence.
Say that further described also have a semiconductor heating member on the contact disc down.
The beneficial effects of the utility model are: such semiconducting behavior testing jig has easy to use, the advantage that testing efficiency is high.
Description of drawings
Fig. 1 is the structural representation of the utility model semiconducting behavior testing jig.
Wherein: 1, base 2, vertical rod 3, last contact disc 4, following contact disc
Specific embodiments:
Below in conjunction with accompanying drawing the utility model is further described.
As shown in Figure 1, the semiconducting behavior testing jig, comprise the testing jig body, it is characterized in that: described testing jig body has a base 1, a vertical rod 2 is arranged on the base 1, have one in the vertical rod 2 and stretch out structure, stretch out and be connected with contact disc 3 on the structure, on base, also have the following contact disc 4 of and last contact disc 3 correspondences.
Say that further described also have a semiconductor heating member on the contact disc 4 down.
Claims (2)
1. the semiconducting behavior testing jig comprises the testing jig body, it is characterized in that: described testing jig body has a base, a vertical rod is arranged on the base, have one in the vertical rod and stretch out structure, stretch out and be connected with contact disc on the structure, on base, also have the following contact disc of and last contact disc correspondence.
2. semiconducting behavior testing jig according to claim 1 is characterized in that also having a semiconductor heating member on the described following contact disc.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201020578497 CN201852858U (en) | 2010-10-27 | 2010-10-27 | Semiconductor performance testing frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201020578497 CN201852858U (en) | 2010-10-27 | 2010-10-27 | Semiconductor performance testing frame |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201852858U true CN201852858U (en) | 2011-06-01 |
Family
ID=44095246
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201020578497 Expired - Fee Related CN201852858U (en) | 2010-10-27 | 2010-10-27 | Semiconductor performance testing frame |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201852858U (en) |
-
2010
- 2010-10-27 CN CN 201020578497 patent/CN201852858U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110601 Termination date: 20111027 |