CN201838625U - 含荧光片的打线结构的发光二极管 - Google Patents
含荧光片的打线结构的发光二极管 Download PDFInfo
- Publication number
- CN201838625U CN201838625U CN2010205868145U CN201020586814U CN201838625U CN 201838625 U CN201838625 U CN 201838625U CN 2010205868145 U CN2010205868145 U CN 2010205868145U CN 201020586814 U CN201020586814 U CN 201020586814U CN 201838625 U CN201838625 U CN 201838625U
- Authority
- CN
- China
- Prior art keywords
- flourescent sheet
- light
- emitting diode
- led chip
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/49105—Connecting at different heights
- H01L2224/49107—Connecting at different heights on the semiconductor or solid-state body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
- H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Abstract
Description
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2010205868145U CN201838625U (zh) | 2010-11-02 | 2010-11-02 | 含荧光片的打线结构的发光二极管 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2010205868145U CN201838625U (zh) | 2010-11-02 | 2010-11-02 | 含荧光片的打线结构的发光二极管 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN201838625U true CN201838625U (zh) | 2011-05-18 |
Family
ID=44008727
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2010205868145U Expired - Lifetime CN201838625U (zh) | 2010-11-02 | 2010-11-02 | 含荧光片的打线结构的发光二极管 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN201838625U (zh) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103839937A (zh) * | 2012-11-23 | 2014-06-04 | 东贝光电科技股份有限公司 | 白光发光二极管模块 |
CN103943768A (zh) * | 2013-01-22 | 2014-07-23 | 立诚光电股份有限公司 | 发光二极管装置及散热基板的制造方法 |
CN112635901A (zh) * | 2020-12-28 | 2021-04-09 | 侯德智 | 荧光片贴电池盒、驱动电路及荧光片贴 |
-
2010
- 2010-11-02 CN CN2010205868145U patent/CN201838625U/zh not_active Expired - Lifetime
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103839937A (zh) * | 2012-11-23 | 2014-06-04 | 东贝光电科技股份有限公司 | 白光发光二极管模块 |
CN103943768A (zh) * | 2013-01-22 | 2014-07-23 | 立诚光电股份有限公司 | 发光二极管装置及散热基板的制造方法 |
CN112635901A (zh) * | 2020-12-28 | 2021-04-09 | 侯德智 | 荧光片贴电池盒、驱动电路及荧光片贴 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
EE01 | Entry into force of recordation of patent licensing contract |
Assignee: Yangzhou keen Sen Co., Ltd. Assignor: Edison Opto Corporation Contract record no.: 2012990000049 Denomination of utility model: Light emitting diode with striker wire structure having fluorescent chip Granted publication date: 20110518 License type: Exclusive License Record date: 20120209 |
|
EM01 | Change of recordation of patent licensing contract |
Change date: 20120327 Contract record no.: 2012990000049 Assignee after: Yangzhou Edison Opto Co., Ltd. Assignee before: Yangzhou keen Sen Co., Ltd. |
|
CX01 | Expiry of patent term |
Granted publication date: 20110518 |
|
CX01 | Expiry of patent term |