CN201833130U - Improved quartz table for welding chip - Google Patents
Improved quartz table for welding chip Download PDFInfo
- Publication number
- CN201833130U CN201833130U CN2010205647068U CN201020564706U CN201833130U CN 201833130 U CN201833130 U CN 201833130U CN 2010205647068 U CN2010205647068 U CN 2010205647068U CN 201020564706 U CN201020564706 U CN 201020564706U CN 201833130 U CN201833130 U CN 201833130U
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- China
- Prior art keywords
- vacuumizing
- welding
- quartzy
- chips welding
- table top
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- Expired - Fee Related
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Abstract
The utility model discloses an improved quartz table for welding a chip, comprising a quartz table top, a chip welding position, a vacuumizing groove, a vacuumizing port, and an air connection pipe, wherein the chip welding position is arranged above the quartz table top; the vacuumizing groove is arranged around the chip welding position; the vacuumizing port is positioned at the bottom of the vacuumizing groove and is communicated with the vacuumizing groove; and the air connection pipe is positioned inside the quartz table top and communicated with the vacuumizing port. A working plane of the improved quartz table for welding the chip is provided with the vacuumizing groove, and the vacuumizing port and the air connection pipe are arranged at the bottom of the vacuumizing groove, therefore, when the air connection pipe is used for exhausting air, the vacuumizing groove can generate negative pressure to even up an area to be welded on a flexible printed circuit board and fix the flat area to be welded, so that the problem that the position to be welded on the flexible printed circuit board deviates with exceeding the standard can be avoided.
Description
Technical field
The utility model relates to the quartzy platform of a kind of improvement that is used for chips welding, particularly relates to a kind ofly utilizing negative pressure of vacuum to fix to be positioned at FPC on the quartzy platform, to prevent that its welding position from the quartzy platform of the improvement that is used for chips welding of skew taking place.
Background technology
In traditional welding procedure, we need be with chips welding to FPC the time, generally take following welding step: at first, FPC to be welded is placed on the working face of quartzy platform, utilizes the support plate of FPC to make it keep formation state; Then, utilize again high temperature with chips welding to FPC.But, adopt above-mentioned welding method, machine is when looking for MARK point (to potential reference point), and FPC is not to be positioned fully and smooth state, so the machine pressure head is when welding chip, the soldered position on the FPC has certain off normal.
Because the side-play amount when we need be with chips welding is controlled at 5um once, so a point deformation of above-mentioned FPC just may cause welding off normal and cause product rejection greater than 5um as far as possible.
In sum, problem demanding prompt solution is, traditional welding procedure is with chips welding to FPC the time, and the soldered position on the FPC can produce the off normal that surpasses regulation.
The utility model content
Technical problem to be solved in the utility model is, a kind of quartzy platform of improvement that is used for chips welding is provided, and it can solve above-mentioned when chips welding, and the soldered position on the FPC can produce the problem of the off normal that surpasses regulation.
For solving the problems of the technologies described above, the technical solution adopted in the utility model is: a kind of quartzy platform of improvement that is used for chips welding comprises: quartzy table top; The chips welding position is arranged on the quartzy table top; In addition, also comprise: vacuumize poor, be arranged at the chips welding position around; Vacuum orifice is positioned at and vacuumizes poor bottom and vacuumize poor communicating; Trachea is positioned at the inside of quartzy table top, communicates with vacuum orifice.
Vacuumize the poor rectangle that is on the quartzy platform working face of the described improvement that is used for chips welding.
The poor bottom that vacuumizes on the quartzy platform working face of the described improvement that is used for chips welding is provided with a described vacuum orifice at least.
The utility model has the advantages that, be provided with and vacuumize poorly, vacuumize poor bottom and be provided with vacuum orifice and trachea because the utility model is used for the working face of the quartzy platform of the improvement of chips welding.Therefore, when bleeding by trachea, vacuumize and can produce negative pressure in poor and use to-be-welded region on the FPC to even up and it is fixed, thereby reach when preventing to be created in chips welding, the soldered position on the FPC can produce the problem of the off normal that surpasses regulation.
Description of drawings
Fig. 1 is used for the overall structure schematic diagram of the quartzy platform of improvement of chips welding for the utility model.
Fig. 2 is used for the side view of the quartzy platform of improvement of chips welding for the utility model.
The specific embodiment
For further disclosing the technical solution of the utility model, be described with reference to the accompanying drawings embodiment of the present utility model now.
Fig. 1 is used for the overall structure schematic diagram of the quartzy platform of improvement of chips welding for the utility model, and Fig. 2 is used for the side view of the quartzy platform of improvement of chips welding for the utility model.
Illustrate that below in conjunction with Fig. 1 and Fig. 2 the utility model is used for the structure and the correlation of the quartzy platform of improvement of chips welding.
The utility model has disclosed a kind of quartzy platform of improvement that is used for chips welding, comprising: quartzy table top 1; Chips welding position 5 is arranged on the quartzy table top 1; In addition, also comprise: vacuumize poor 4, be arranged at chips welding position 5 around; Vacuum orifice 2 is positioned at and vacuumizes poor 2 bottom and 4 communicate with vacuumizing to be pickled with grains or in wine; Trachea 3 is positioned at the inside of quartzy table top 1, communicates with vacuum orifice 2.Above-mentionedly vacuumize poor 4 and can make rectangle but be not limited to rectangle.In addition, vacuumize poor 4 bottom a described vacuum orifice 2 is set at least, in welding process, need to improve or when comparatively fast improving negative pressure value, can realize by the quantity that increases vacuum orifice 2.
Course of action when below a kind of quartzy platform of improvement that is used for chips welding of explanation the utility model is worked: during work, after on the working face that FPC to be welded is placed on quartzy table top 1, bleed by trachea 3, vacuumize this moment and can produce negative pressure in poor 2 and use to-be-welded region on the FPC to even up and it is fixed, reach and prevent that this to-be-welded region from the effect of skew taking place.
More than, basic design of the present utility model and basic principle have been set forth by description of listed embodiment.But the utility model never is limited to above-mentioned listed embodiment, and every equivalent variations, improvement and deliberately of inferior quality behavior of doing based on the technical solution of the utility model of change all should belong to protection domain of the present utility model.
Claims (3)
1. the quartzy platform of improvement that is used for chips welding comprises: quartzy table top (1); Chips welding position (5) is arranged on the described quartzy table top (1); It is characterized in that, also comprise: vacuumize poor (4), be arranged at described chips welding position (5) around; Vacuum orifice (2) is positioned at the described bottom that vacuumizes poor (2) and vacuumizes poor (4) and communicate with described; Trachea (3) is positioned at the inside of described quartzy table top (1), communicates with described vacuum orifice (2).
2. the quartzy platform of the improvement that is used for chips welding according to claim 1 is characterized in that, describedly vacuumizes poor (4) and is rectangle.
3. the quartzy platform of improvement that is used for chips welding according to claim 1 and 2 is characterized in that the described bottom that vacuumizes poor (4) is provided with a described vacuum orifice (2) at least.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2010205647068U CN201833130U (en) | 2010-10-18 | 2010-10-18 | Improved quartz table for welding chip |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2010205647068U CN201833130U (en) | 2010-10-18 | 2010-10-18 | Improved quartz table for welding chip |
Publications (1)
Publication Number | Publication Date |
---|---|
CN201833130U true CN201833130U (en) | 2011-05-18 |
Family
ID=44003226
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2010205647068U Expired - Fee Related CN201833130U (en) | 2010-10-18 | 2010-10-18 | Improved quartz table for welding chip |
Country Status (1)
Country | Link |
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CN (1) | CN201833130U (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101966635A (en) * | 2010-10-18 | 2011-02-09 | 卓盈微电子(昆山)有限公司 | Improved quartz table for use in chip welding |
CN103021886A (en) * | 2012-12-14 | 2013-04-03 | 重庆平伟实业股份有限公司 | Facing package diode welding process, multipoint dispensing tool for process and multipoint chip feeding tool |
-
2010
- 2010-10-18 CN CN2010205647068U patent/CN201833130U/en not_active Expired - Fee Related
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101966635A (en) * | 2010-10-18 | 2011-02-09 | 卓盈微电子(昆山)有限公司 | Improved quartz table for use in chip welding |
CN103021886A (en) * | 2012-12-14 | 2013-04-03 | 重庆平伟实业股份有限公司 | Facing package diode welding process, multipoint dispensing tool for process and multipoint chip feeding tool |
CN103021886B (en) * | 2012-12-14 | 2016-06-22 | 重庆平伟实业股份有限公司 | Multi-point adhesive frock used by surface-mounted diode welding procedure and technique and core frock on multiple spot |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110518 Termination date: 20141018 |
|
EXPY | Termination of patent right or utility model |