CN201821389U - Superimposition type mobile phone circuit board - Google Patents
Superimposition type mobile phone circuit board Download PDFInfo
- Publication number
- CN201821389U CN201821389U CN2010205436245U CN201020543624U CN201821389U CN 201821389 U CN201821389 U CN 201821389U CN 2010205436245 U CN2010205436245 U CN 2010205436245U CN 201020543624 U CN201020543624 U CN 201020543624U CN 201821389 U CN201821389 U CN 201821389U
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- Prior art keywords
- circuit board
- mobile phone
- board
- superposing type
- multilayer
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- Expired - Fee Related
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Abstract
The utility model discloses a superimposition type mobile phone circuit board which comprises a main circuit board with a multilayer blind/buried via structure, and a peripheral circuit board with a multilayer through-hole structure, wherein the main circuit board is connected with the peripheral circuit plate through a board to board connector. The superimposition type mobile phone circuit board adopts a mobile phone circuit board formed through superposition of the circuit board with the multilayer blind/buried via structure and the circuit board with the multilayer through-hole structure, so that the difficulty in manufacturing the phone circuit board is greatly reduced, the design period is shortened, the manufacturing cost is lower, and interferences among chips on the circuit board are avoided effectively.
Description
Technical field
The utility model relates to a kind of circuit board of mobile phone, relates in particular to a kind of superposing type circuit board of mobile phone.
Background technology
Modern mobile phone has comprised nearly all subsystem that can find in the portable device, as multiple radio-frequency module (comprising cellular, short-distance wireless transmission); Audio frequency, video signal subsystem; Special-purpose application processor etc.; And each subsystem all has the requirement of conflict each other.To in so small-sized space, integrate the subsystem of so many complexity, the reality of considering also embraces a wide spectrum of ideas, except being all between Radio Frequency Subsystem the issuable interference, may be between each different sub-systems by self running or the phase mutual interference that causes by wiring, electromagnetic interference problem etc.
The good circuit board of a design must farthest be brought into play and mount the performance of each assembly thereon, and avoids the interference between different system.Because if produce conflicting situation between each subsystem, the result must cause performance decrease.
Traditional mobile phone adopts eight layers busy buried via hole structure of a circuit board usually, because the restriction of the size of circuit board of mobile phone, and the circuit that is comprised in the modern circuit board of mobile phone is increasing, often the density of place and route is very high, so cause the design cycle very long, very difficult, and interference between signals is difficult to control; Though in addition for no other reason than that segment chip or the regional intensive blind buried via hole structure that just needs, other non-dense set parts can adopt the lower through-hole structure of cost fully, but because have only a circuit board, so the monoblock circuit board all must be processed according to blind buried via hole technology, thereby causes cost to increase greatly.
The utility model content
The purpose of this utility model provides a kind of superposing type circuit board of mobile phone, and the circuit board of mobile phone monoblock adopts blind buried via hole structure to cause manufacture difficulty big in the prior art in order to solve, and it is long that the cycle is set, and be difficult to the problem of the interference between the control signal.
Above-mentioned purpose of the present utility model is achieved through the following technical solutions:
A kind of superposing type circuit board of mobile phone wherein, comprises the blind buried via hole structure of multilayer main circuit board, the peripheral circuit plate of a multilayer through-hole structure, and described main circuit board links to each other by a board to board connector with described peripheral circuit plate.
Above-mentioned superposing type circuit board of mobile phone, wherein, described main circuit board is fixedly mounted on the described peripheral circuit plate by board to board connector, and described main circuit board parallels with described peripheral circuit plate.
Above-mentioned superposing type circuit board of mobile phone, wherein, described main circuit board is provided with baseband chip and internal layer chip.
Above-mentioned superposing type circuit board of mobile phone, wherein, described peripheral circuit plate is provided with power supply chip, radio frequency chip, audio chip, key circuit, liquid crystal display screen circuit, battery circuit.
Above-mentioned superposing type circuit board of mobile phone, wherein, the front of described main circuit board is relative with the reverse side of described peripheral circuit plate.
Above-mentioned superposing type circuit board of mobile phone, wherein, described main circuit board is eight layers of blind buried via hole structural circuit plate, described peripheral circuit plate is four layers of through-hole structure circuit board.
In sum, the utility model superposing type circuit board of mobile phone discloses a kind of multilayer blind buried via hole structural circuit plate and superimposed circuit board of mobile phone of multilayer through-hole structure circuit board of adopting, reduced the manufacture difficulty of circuit board of mobile phone, shortened the cycle of design, cost is cheaper, and has effectively avoided the interference of chip chamber on the circuit board.
Description of drawings
Fig. 1 is the structural representation of the utility model superposing type circuit board of mobile phone;
Fig. 2 is the structural representation of the embodiment two of the utility model superposing type circuit board of mobile phone.
Embodiment
Below in conjunction with accompanying drawing embodiment of the present utility model is further described:
Embodiment (one)
Fig. 1 is the structural representation of the utility model superposing type circuit board of mobile phone, see also Fig. 1, a kind of superposing type circuit board of mobile phone, comprise the blind buried via hole structure of multilayer main circuit board 2, the peripheral circuit plate 1 of one multilayer through-hole structure, main circuit board 2 links to each other by a board to board connector 3 with peripheral circuit 1 plate, the blind buried via hole structure of multilayer main circuit board 2 is used for welding the comparatively complicated master control chip of wiring, the peripheral circuit plate 1 of multilayer through-hole structure is used for welding the peripheral chip that wiring relatively simply is used for control peripheral devices, circuit board of mobile phone of the prior art is split into difficulty and the cycle that the blind buried via hole structure of multilayer main circuit board 2 and multilayer through-hole structure peripheral circuit plate 1 have reduced the circuit board of mobile phone wiring, effectively eliminated the phase mutual interference between the chip for cell phone, peripheral circuit plate 1 adopts cheap multilayer through hole circuit board, has reduced the cost of circuit board of mobile phone; The effect of board to board connector 3 is that main circuit board 2 is fixedlyed connected with peripheral circuit plate 1, and realizes the exchanges data between main circuit board 2 and the peripheral circuit plate 1.
The main circuit board 2 of the utility model superposing type circuit board of mobile phone is fixedly mounted on the peripheral circuit plate 1 by board to board connector 3, main circuit board 2 is parallel with peripheral circuit plate 1, make the easier for installation of the utility model superposing type circuit board, and reduce its shared space.
The main circuit board 2 of the utility model superposing type circuit board of mobile phone adopts eight layers of blind buried via hole structural circuit plate, and peripheral circuit plate 1 adopts four layers of through-hole structure circuit board.
The front of the main circuit board 2 in the foregoing description is relative with the reverse side of peripheral circuit plate 1; the front of circuit board is a part surface; the reverse side of circuit board is a solder side; the employing structure that the part surface of main circuit board 2 is relative with the solder side of peripheral circuit plate 1 makes the part of main circuit board 2 and peripheral circuit plate 1 be installed in the same side, and the chip of being convenient to take measures on the circuit board is protected.
Embodiment (two)
Fig. 2 is the structural representation of the embodiment two of the utility model superposing type circuit board of mobile phone, see also Fig. 2, on the basis of embodiment one, the main circuit board of the utility model superposing type circuit board of mobile phone is provided with baseband chip 201 and internal layer chip 202, wherein the effect of baseband chip 201 is data of handling mobile phone ancillary equipment, and internal layer chip 202 is used for the data in the memory mobile phone;
Peripheral circuit plate 1 is provided with power supply chip 101, radio frequency chip 102, audio chip 103, key circuit 104, liquid crystal display screen circuit 105, battery circuit 106, said chip is used for the ancillary equipment to mobile phone: power supply, signal receiver, receiver, loud speaker, button, liquid crystal display screen and battery detect and control, and by board to board connector 3 with transfer of data in baseband chip 201.
In sum, the utility model superposing type circuit board of mobile phone discloses a kind of circuit board of mobile phone that adopts multilayer blind buried via hole structural circuit plate and the stack of multilayer through-hole structure circuit board, reduced the manufacture difficulty of circuit board of mobile phone, shortened the cycle of design, cost is cheaper, and has effectively avoided the interference of chip chamber on the circuit board.
The foregoing description only is giving an example of the optional execution mode of the utility model, and its related feature only is used for explanation and sets forth the technical solution of the utility model, and is not used in qualification protection range of the present utility model.The utility model is not limited to the foregoing description, can change in many ways or improve.
Claims (6)
1. a superposing type circuit board of mobile phone is characterized in that, comprises the blind buried via hole structure of multilayer main circuit board, the peripheral circuit plate of a multilayer through-hole structure, and described main circuit board links to each other by a board to board connector with described peripheral circuit plate.
2. superposing type circuit board of mobile phone according to claim 1 is characterized in that, described main circuit board is fixedly mounted on the described peripheral circuit plate by board to board connector, and described main circuit board parallels with described peripheral circuit plate.
3. superposing type circuit board of mobile phone according to claim 1 is characterized in that, described main circuit board is provided with baseband chip and internal layer chip.
4. superposing type circuit board of mobile phone according to claim 1 is characterized in that, described peripheral circuit plate is provided with power supply chip, radio frequency chip, audio chip, key circuit, liquid crystal display screen circuit, battery circuit.
5. superposing type circuit board of mobile phone according to claim 2 is characterized in that, the front of described main circuit board is relative with the reverse side of described peripheral circuit plate.
6. superposing type circuit board of mobile phone according to claim 1 is characterized in that, described main circuit board is eight layers of blind buried via hole structural circuit plate, and described peripheral circuit plate is four layers of through-hole structure circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010205436245U CN201821389U (en) | 2010-09-27 | 2010-09-27 | Superimposition type mobile phone circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010205436245U CN201821389U (en) | 2010-09-27 | 2010-09-27 | Superimposition type mobile phone circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201821389U true CN201821389U (en) | 2011-05-04 |
Family
ID=43919331
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010205436245U Expired - Fee Related CN201821389U (en) | 2010-09-27 | 2010-09-27 | Superimposition type mobile phone circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201821389U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102883554A (en) * | 2012-09-03 | 2013-01-16 | 惠州Tcl移动通信有限公司 | Mobile phone circuit board manufacture method, mobile phone circuit board and mobile phone |
| CN103580709A (en) * | 2013-10-18 | 2014-02-12 | 南京移动卫星通信工程技术研究发展中心 | Mobile satellite communication system hand-held terminal |
| CN108512964A (en) * | 2018-05-14 | 2018-09-07 | 维沃移动通信有限公司 | The circuit board arrangement of mobile terminal and mobile terminal |
-
2010
- 2010-09-27 CN CN2010205436245U patent/CN201821389U/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102883554A (en) * | 2012-09-03 | 2013-01-16 | 惠州Tcl移动通信有限公司 | Mobile phone circuit board manufacture method, mobile phone circuit board and mobile phone |
| CN102883554B (en) * | 2012-09-03 | 2016-08-17 | 惠州Tcl移动通信有限公司 | Mobile phone circuit board fabrication method, circuit board of mobile phone and mobile phone |
| CN103580709A (en) * | 2013-10-18 | 2014-02-12 | 南京移动卫星通信工程技术研究发展中心 | Mobile satellite communication system hand-held terminal |
| CN108512964A (en) * | 2018-05-14 | 2018-09-07 | 维沃移动通信有限公司 | The circuit board arrangement of mobile terminal and mobile terminal |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110504 Termination date: 20140927 |
|
| EXPY | Termination of patent right or utility model |