CN201807492U - Glue spray device for micro machining of semiconductor - Google Patents
Glue spray device for micro machining of semiconductor Download PDFInfo
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- CN201807492U CN201807492U CN2010202288345U CN201020228834U CN201807492U CN 201807492 U CN201807492 U CN 201807492U CN 2010202288345 U CN2010202288345 U CN 2010202288345U CN 201020228834 U CN201020228834 U CN 201020228834U CN 201807492 U CN201807492 U CN 201807492U
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- wafer
- glue
- supporting platform
- spraying device
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Abstract
The utility model discloses a glue spray device for micro machining of a semiconductor, which comprises a horizontal movement mechanism, a linear motor, a bearing platform and a supporting arm, wherein the linear motor moves vertically; the bearing platform is used for allowing a supporting base to be placed; the supporting arm is used for supporting the bearing platform; a spray nozzle spraying glue to the processing surface of the supporting base is arranged on the horizontal movement mechanism; the glue spray device further comprises a first rotating motor, which is mounted on the linear motor and is connected with the supporting arm; the first rotating motor can drive the bearing platform to rotate along the axial line of the supporting arm, so as to further enable that the bearing platform downwardly faces to the spray nozzle. Owing to the technical scheme, coating material upwardly sprayed by the spray nozzle can be uniformly coated on turning corners and lateral walls of the uneven processing surface in the uniform-thickness manner under the action of gravity and surface tension. Therefore, the glue spray device provided by the utility model is particularly suitable for spraying the coating on the uneven processing surfaces or the structures with deep holes or grooves formed thereon, thereby meeting the technology requirement for micro machining.
Description
[technical field]
The utility model relates to the spray glue treatment technology of microfabrication in semiconductor, micro electronmechanical (MEMS), FPD and the LED lighting field, relate in particular to a kind of in surface undulation, deep hole is arranged or the evenly glue-spraying device of applying coating material is arranged on the machined surface of substrate of groove structure.
[background technology]
Please join shown in Fig. 1 (a) and Fig. 1 (b), in the fine process in existing semiconductor and field such as micro electronmechanical, in surface undulation, when deep hole being arranged or having the machined surface of the substrate 11 of groove structure 12 to apply coating material 14 such as photoresist or organic polymer, the mode that adopts substrate 11 machined surfaces to make progress, spraying from the top down, can not be at the turning 15 and sidewall 13 places form and the identical or consistent coat of other position thickness, technology is poor.
So be necessary to design a kind of glue-spraying device of semiconductor microactuator fining-off that is used for to solve the problems of the technologies described above.
[utility model content]
Technical problem to be solved in the utility model is to provide a kind of glue-spraying device that is used for microfabrication, with can be on the machined surface of the substrate of relief fabric applying coating equably, satisfy the technological requirement of microfabrication.
For solving the problems of the technologies described above, the utility model adopts following technical scheme: a kind of glue-spraying device that is used for the semiconductor microactuator fining-off, comprise horicontal motion mechanism, the linear electric motors that in the vertical direction moves, the support arm that is used to place the wafer-supporting platform of substrate and supports wafer-supporting platform, described horicontal motion mechanism is provided with at horizontal in-plane moving and sprays the nozzle of glue in order to the machined surface to substrate, described linear electric motors are in order to regulate the height of wafer-supporting platform, described glue-spraying device also is provided with first electric rotating machine that is installed on the linear electric motors and is connected in support arm, described wafer-supporting platform can be driven and be rotated down by first electric rotating machine, with directly towards the nozzle that is positioned at the wafer-supporting platform below.
As further improvement of the utility model, described glue-spraying device is provided with second electric rotating machine at the back side that is installed in wafer-supporting platform, and described second electric rotating machine is installed on the support arm hangingly; Described second electric rotating machine can drive wafer-supporting platform, in the plane at wafer-supporting platform place, rotates arbitrarily angled.
As further improvement of the utility model, described wafer-supporting platform is around the axis direction rotation of support arm, and rotating range is 0 ° to 180 °.
As further improvement of the utility model, described glue-spraying device is provided with equipment platform, and described horicontal motion mechanism and linear electric motors all are installed on the equipment platform, and the injection direction of described nozzle can carry out 360 ° of adjustings in perpendicular to the plane of equipment platform.
As further improvement of the utility model, described glue-spraying device is provided with and is placed in the wafer-supporting platform and in order to the heater of control underlayer temperature, and heater can carry out adjustment according to the temperature curve that sets.
As further improvement of the utility model, described glue-spraying device is provided with the vacuum suction structure that is placed on the wafer-supporting platform surface, and described vacuum suction structure can be adsorbed on substrate on the wafer-supporting platform, is unlikely to drop.
As further improvement of the utility model, described wafer-supporting platform level downwards or be tilted to down towards nozzle.
Compared to prior art, the utility model is by making wafer-supporting platform downwards in the face of nozzle, and then make nozzle upwards the coating material of ejection under gravity and capillary effect, can on the turning and sidewall of machined surface, apply one deck consistency of thickness or identical coating equably with height relief fabric.Be particularly suitable for rising and falling, deep hole is arranged or applying coating on the substrate of groove structure is arranged, satisfy the technological requirement of microfabrication at machined surface.
[description of drawings]
Fig. 1 (a) is the schematic diagram after the turning of the machined surface of substrate in first kind of prior art and sidewall are capped coating.
Fig. 1 (b) is the schematic diagram after the turning of the machined surface of substrate in second kind of prior art and sidewall are capped coating.
Fig. 2 is the vertical view of the utility model glue-spraying device.
Fig. 3 is the side view of the utility model glue-spraying device along A direction among Fig. 2.
Fig. 4 is the side view of the utility model glue-spraying device along B direction among Fig. 2.
Fig. 5 adopts the schematic diagram of glue-spraying device of the present utility model after seal coat on the turning of the machined surface of substrate and the sidewall.
[specific embodiment]
Please join Fig. 2 to shown in Figure 4, a kind of glue-spraying device 100 that is used for the semiconductor microactuator fining-off, it comprises: equipment platform 5, be installed on horicontal motion mechanism 2 and linear electric motors 7 on the equipment platform 5, be installed on first electric rotating machine 8 on the linear electric motors 7, be fixed in support arm 6 on first electric rotating machine 8, be installed in second electric rotating machine 3 on the support arm 6 hangingly, and the wafer-supporting platform 4 that is used to place substrate 9 (joining shown in Figure 5) that links to each other with second electric rotating machine 3.
Described horicontal motion mechanism 2 comprises can be at horizontal in-plane moving and in order to spray the nozzle 1 of glue to substrate 9.Described horicontal motion mechanism 2 adopts I shape or cross spindle arrangement, drives nozzle 1 and a bit moves with certain speed arbitrarily on horizontal plane.Described nozzle 1 can be selected binary nozzle, micro electronmechanical nozzle or ultrasonic nozzle etc. according to actual needs for use.Described nozzle 1 is done snake scan motion in horizontal plane, nozzle 1 ejects photoresist or materials such as organic polymer or organic mixture simultaneously, with it equably on the machined surface 93 (joining shown in Figure 5) attached to substrate 9.The injection direction of described nozzle 1 can carry out 360 ° of manual adjustings in perpendicular to the perpendicular of equipment platform 5.
Described second electric rotating machine 3 is installed on the back side of wafer-supporting platform 4, and second electric rotating machine 3 is installed on the end of support arm 6 hangingly.Described second electric rotating machine 3 is rotatable does 360 ° of rotations to drive wafer-supporting platform 4 in the plane at its place.
The other end along continuous straight runs of described support arm 6 is installed on first electric rotating machine 8.Described support arm 6 is made by metal material in the present embodiment.Certainly, in other embodiments, support arm 6 also can be made by other materials such as plastics, still, need possess enough intensity, in order to support second electric rotating machine 3 and wafer-supporting platform 4.
Described first electric rotating machine 8 can be by the rotation of support arm 6 control wafer-supporting platforms 4.Described wafer-supporting platform 4 is 0 ° to 180 ° around the rotating range of the horizontal axis rotation of support arm 6.Described first electric rotating machine 8 drives wafer-supporting platforms 4 and rotates a certain angle, make wafer-supporting platform 4 the working face level downwards or be tilted to down, and then make wafer-supporting platform 4 face nozzles 1 (joining shown in Figure 4) downwards.
Described linear electric motors 7 vertically are installed on the equipment platform 5, but it moves with respect to horicontal motion mechanism 2 in the vertical directions.Described linear electric motors 7 adopt the one dimension spindle arrangements, to adjust the height of described wafer-supporting platform 4 in the process of carrying out snake scan and injection at nozzle 1, make wafer-supporting platform 4 directly over the nozzle 1 a bit and the height between the described nozzle 1 remain unchanged.
When the machined surface 93 of substrate 9 is scanned and after injection finishes, substrate 9 along with the wafer-supporting platform 4 of placing substrate 9 under the drive of second electric rotating machine 3, carry out once the complete snakelike process of sweeping and spraying after rotating a certain angle again, repeat this process again until 360 ° of substrate 9 rotations.At last, first electric rotating machine, 8 drive wafer-supporting platforms 4 and substrate 9 reverse rotations are convenient to take off the substrate 9 of having finished microfabrication to initial position.
In addition, described glue-spraying device 100 also is provided with and is placed in the wafer-supporting platform 4 and in order to the heater (not shown) of control substrate 9 temperature, described temperature controlling scope is between 50 ℃ to 150 ℃, and heater can carry out adjustment according to the temperature curve that sets.
Described glue-spraying device 100 also is provided with the vacuum suction structure (not shown) that is placed on wafer-supporting platform 4 surfaces, and described vacuum suction structure can be adsorbed on substrate 9 on the wafer-supporting platform 4 firmly, is unlikely to drop.
Please join Fig. 2 to shown in Figure 5, the utility model glue-spraying device 100 can be used to the machined surface 93 of substrate 9 is carried out microfabrication.The difference of the material that this fine machining method applies according to the situation of substrate 9 to be processed and needs can be selected following several course of work.
The course of work one:
At first, provide above-mentioned glue-spraying device 100, under the initial position state, the working face level of wafer-supporting platform 4 upwards.Spray glue under the drive of horicontal motion mechanism 2, is positioned at the below of wafer-supporting platform 4 with nozzle 1, and manual adjustments keeps the injection direction of nozzle 1 downward.The machined surface 93 that needs is carried out the substrate 9 of microfabrication upwards is placed on the working face of wafer-supporting platform 4.The vacuum suction structure of opening glue-spraying device 100 is adsorbed on substrate 9 on the wafer-supporting platform 4 firmly.Linear electric motors 7 drive support arm 6 and wafer-supporting platform 4 drops in a certain plane of nozzle below 1, make the nozzle 1 and the plane at wafer-supporting platform 4 places keep certain clearance (being working depth).Horicontal motion mechanism 2 drives nozzles 1 and carry out the snake scan motion in horizontal plane, and nozzle 1 ejects photoresist or materials such as organic polymer or organic mixture simultaneously, and with it equably on the machined surface 93 attached to substrate 9.When the snake scan of finishing entire substrate 9 machined surfaces 93 with after spraying, substrate 9 along with the wafer-supporting platform 4 of placing substrate 9 under the drive of second electric rotating machine 3, (such as 90 ° or 60 °) rotate a certain angle, and then carry out once the complete snake scan and the process of spraying, repeat this process again until 360 ° of substrate 9 rotations.By repeatedly spraying, can guarantee the uniform coating 92 of machined surface 93 final coverings of substrate 9 from the machined surface 93 of different angles to substrate 9.
The course of work two:
At first, provide above-mentioned glue-spraying device 100, under the initial position state, the working face level of wafer-supporting platform 4 upwards.Spray glue under the drive of horicontal motion mechanism 2, is positioned at the below of wafer-supporting platform 4 with nozzle 1, and the injection direction that manual adjustments keeps nozzle 1 straight up or obliquely.The machined surface 93 that needs is carried out the substrate 9 of microfabrication upwards is placed on the working face of wafer-supporting platform 4.The vacuum suction structure of opening glue-spraying device 100 is adsorbed on substrate 9 on the wafer-supporting platform 4 firmly.High pulling torque is walked around motor 8 around 180 ° of horizontal rotational shaft, makes machined surface 93 levels of the working face of wafer-supporting platform 4 and substrate 9 downward.Linear electric motors 7 drive support arm 6 and wafer-supporting platform 4 drops in a certain plane of nozzle 1 top, make the nozzle 1 and the plane at wafer-supporting platform 4 places keep certain clearance (being working depth).Horicontal motion mechanism 2 drives nozzles 1 and carry out the snake scan motion in horizontal plane, and nozzle 1 upwards ejects photoresist or materials such as organic polymer or organic mixture simultaneously, and with it equably on the machined surface 93 attached to substrate 9.When the snake scan of finishing entire substrate 9 machined surfaces 93 with after spraying, substrate 9 along with the wafer-supporting platform 4 of placing substrate 9 under the drive of second electric rotating machine 3, (such as 90 ° or 60 °) rotate a certain angle, and then carry out once the complete snake scan and the process of spraying, repeat this process again until 9 360 ° (i.e. weeks) of rotation of substrate.At last, first electric rotating machine, 8 drive wafer-supporting platforms 4 and substrate 9 reverse rotations are convenient to take off the substrate 9 of having finished microfabrication to initial position.
The course of work three:
At first, provide above-mentioned glue-spraying device 100, under the initial position state, the working face level of wafer-supporting platform 4 upwards.Spray glue under the drive of horicontal motion mechanism 2, is positioned at the below of wafer-supporting platform 4 with nozzle 1, and the injection direction that manual adjustments keeps nozzle 1 straight up or obliquely.To need the machined surface 93 of the substrate 9 of microfabrication upwards to be placed on the wafer-supporting platform 4.The vacuum suction structure of opening glue-spraying device 100 is adsorbed on substrate 9 on the wafer-supporting platform 4 firmly.8 rotations of first electric rotating machine make the working face of wafer-supporting platform 4 and the machined surface 93 of substrate 9 be tilted to down.Linear electric motors 7 drive support arm 6 and wafer-supporting platform 4 drops in a certain plane of nozzle 1 top, make the nozzle 1 and the minimum point of wafer-supporting platform 4 keep certain interval, and setting this gap is working depth.Horicontal motion mechanism 2 drives nozzle 1 in horizontal plane, minimum point place by wafer-supporting platform 4 begins to carry out the snake scan motion, simultaneously nozzle 1 upwards ejects photoresist or materials such as organic polymer or organic mixture, and with it equably on the machined surface 93 attached to substrate 9.When nozzle 1 carried out snake scan, linear electric motors 7 drove wafer-supporting platforms 4 and descend gradually, and the height of wafer-supporting platform 4 between any and the described nozzle 1 directly over the nozzle 1 remained unchanged.When the snake scan of finishing entire substrate 9 machined surfaces 93 with after spraying, substrate 9 along with the wafer-supporting platform 4 of placing substrate 9 under the drive of second electric rotating machine 3, (such as 90 ° or 60 °) rotate a certain angle, and then carry out once the complete snake scan and the process of spraying, repeat this process again until 9 360 ° (i.e. weeks) of rotation of substrate.At last, first electric rotating machine, 8 drive wafer-supporting platforms 4 and substrate 9 reverse rotations are convenient to take off the substrate 9 of having finished microfabrication to initial position.
Compared with prior art, the utlity model has following beneficial effect:
Be tilted to down downwards or with certain angle by machined surface 93 levels substrate 9, the coating material that nozzle 1 upwards sprays is under gravity and capillary effect, can on the turning and sidewall of machined surface 93, apply one deck consistency of thickness or identical coating 92 equably with height relief fabric.Be particularly suitable for rising and falling, deep hole is arranged or applying coating 92 on the substrate 9 of groove structure 91 is arranged, and the thickness uniformity of coating 92, satisfy the technological requirement of microfabrication at machined surface 93.
The heater that is provided with in the wafer-supporting platform 4 can guarantee that wafer-supporting platform 4 is in heated condition always, be sprayed on materials such as photoresist, organic polymer or organic mixture on the machined surface 93 of substrate 9 by continuous forced evaporation solvent, and then coating 92 is solidified to prevent that coating 92 from flowing, and guaranteed the uniformity of coating 92 thickness rapidly.In addition, heater can heat wafer-supporting platform 4 according to the temperature curve of setting, and then can adopt different temperature in the different moment of spray-bonding craft, constantly change with the thickness that is applicable to spray-bonding craft process floating coat 92, also be applicable to the substrate 9 of different machined surfaces 93 and photoresist, organic polymer or the organic mixture of different materials, also be applicable to the final thickness of various coatings 92.
Spray glue adopts snakelike surface sweeping campaign with nozzle 1 in machined surface 93 scopes of substrate 9, each row snake scan route has certain spacing, this spacing can be carried out program and regulated automatically, guarantees that the every bit of substrate 9 machined surfaces 93 can spray the materials such as photoresist, organic polymer or mixture of equivalent equably.
After whenever finishing a snake scan and spraying, substrate 9 is along with wafer-supporting platform 4 rotates a certain angle under the drive of second electric rotating machine 3, and the snakelike spraying process of sweeping and retouch that tries again is until 360 ° of rotations.By repeatedly spraying, on all directions, all can be uniformly sprayed with the various relief fabrics that guarantee substrate 9 machined surfaces 93 from the machined surface 93 of different angles to substrate 9.
In addition, the spraying direction of nozzle 1 can be adjusted to machined surface 93 with the substrate 9 a certain angles beyond being 90 °, can be with some specific relief fabric on the machined surface 93 that guarantees substrate 9 (such as vertical dell inside, even the base angle is greater than 90 ° dell) by all even sprayings completely.
In sum, it below only is preferred embodiment of the present utility model, should not limit scope of the present utility model with this, be that every simple equivalent of being done according to the utility model claims and utility model description changes and modifies, all should still belong in the scope that the utility model patent contains.
Claims (7)
1. glue-spraying device that is used for the semiconductor microactuator fining-off, comprise horicontal motion mechanism, the linear electric motors that in the vertical direction moves, the support arm that is used to place the wafer-supporting platform of substrate and supports wafer-supporting platform, described horicontal motion mechanism is provided with at horizontal in-plane moving and sprays the nozzle of glue in order to the machined surface to substrate, described linear electric motors are in order to regulate the height of wafer-supporting platform, it is characterized in that: described glue-spraying device also is provided with first electric rotating machine that is installed on the linear electric motors and is connected in support arm, described wafer-supporting platform can be driven and be rotated down by first electric rotating machine, with directly towards the nozzle that is positioned at the wafer-supporting platform below.
2. glue-spraying device as claimed in claim 1 is characterized in that: described glue-spraying device is provided with second electric rotating machine at the back side that is installed in wafer-supporting platform, and described second electric rotating machine is installed on the support arm hangingly; Described second electric rotating machine can drive wafer-supporting platform, in the plane at wafer-supporting platform place, rotates arbitrarily angled.
3. glue-spraying device as claimed in claim 1 is characterized in that: described wafer-supporting platform is around the axis direction rotation of support arm, and rotating range is 0 ° to 180 °.
4. glue-spraying device as claimed in claim 1, it is characterized in that: described glue-spraying device is provided with equipment platform, described horicontal motion mechanism and linear electric motors all are installed on the equipment platform, and the injection direction of described nozzle can carry out 360 ° of adjustings in perpendicular to the plane of equipment platform.
5. glue-spraying device as claimed in claim 1 is characterized in that: described glue-spraying device is provided with and is placed in the wafer-supporting platform and in order to the heater of control underlayer temperature, and heater can carry out adjustment according to the temperature curve that sets.
6. glue-spraying device as claimed in claim 1 is characterized in that: described glue-spraying device is provided with the vacuum suction structure that is placed on the wafer-supporting platform surface, and described vacuum suction structure can be adsorbed on substrate on the wafer-supporting platform, is unlikely to drop.
7. glue-spraying device as claimed in claim 1 is characterized in that: described wafer-supporting platform level downwards or be tilted to down towards nozzle.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010202288345U CN201807492U (en) | 2010-06-18 | 2010-06-18 | Glue spray device for micro machining of semiconductor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010202288345U CN201807492U (en) | 2010-06-18 | 2010-06-18 | Glue spray device for micro machining of semiconductor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201807492U true CN201807492U (en) | 2011-04-27 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010202288345U Expired - Lifetime CN201807492U (en) | 2010-06-18 | 2010-06-18 | Glue spray device for micro machining of semiconductor |
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| Country | Link |
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| CN (1) | CN201807492U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102285628A (en) * | 2010-06-18 | 2011-12-21 | 王云翔 | Glue spraying device for micro processing of semiconductor and spray coating method for substrate |
| CN106890761A (en) * | 2017-03-14 | 2017-06-27 | 广东欧珀移动通信有限公司 | Point glue equipment and dispensing method |
| CN109772625A (en) * | 2019-02-28 | 2019-05-21 | 西部宝德科技股份有限公司 | A kind of wet spray membrane equipment |
-
2010
- 2010-06-18 CN CN2010202288345U patent/CN201807492U/en not_active Expired - Lifetime
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102285628A (en) * | 2010-06-18 | 2011-12-21 | 王云翔 | Glue spraying device for micro processing of semiconductor and spray coating method for substrate |
| CN106890761A (en) * | 2017-03-14 | 2017-06-27 | 广东欧珀移动通信有限公司 | Point glue equipment and dispensing method |
| CN109772625A (en) * | 2019-02-28 | 2019-05-21 | 西部宝德科技股份有限公司 | A kind of wet spray membrane equipment |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: SUZHOU MEMSTOOLS SEMICONDUCTOR TECHNOLOGY CO., LTD Free format text: FORMER OWNER: WANG YUNXIANG Effective date: 20131206 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: 215006 SUZHOU, JIANGSU PROVINCE TO: 215123 SUZHOU, JIANGSU PROVINCE |
|
| TR01 | Transfer of patent right |
Effective date of registration: 20131206 Address after: Xinghu Street Industrial Park of Suzhou city in Jiangsu province 215123 No. 218 BioBAY room A7-506 Patentee after: Suzhou beautiful figure semiconductor technology Co., Ltd Address before: Bridge Street in Suzhou City Industrial Park, Jiangsu province 215006 No. 133 building 13 room 2403 Patentee before: Wang Yunxiang |
|
| CX01 | Expiry of patent term |
Granted publication date: 20110427 |
|
| CX01 | Expiry of patent term |