CN201804716U - Isolated-type roller for local chemical plating of electronic ceramic surface - Google Patents
Isolated-type roller for local chemical plating of electronic ceramic surface Download PDFInfo
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- CN201804716U CN201804716U CN2010202185442U CN201020218544U CN201804716U CN 201804716 U CN201804716 U CN 201804716U CN 2010202185442 U CN2010202185442 U CN 2010202185442U CN 201020218544 U CN201020218544 U CN 201020218544U CN 201804716 U CN201804716 U CN 201804716U
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Abstract
Aiming at the manufacture of good ohmic contact electrodes of a ceramic dielectric capacitor, a thermistor and a piezoresistor, the utility model provides an isolated-type roller for the local chemical plating of an electronic ceramic surface. The chemical plating device comprises six parts such as a gear rotating device, a roller, a central rotating shaft, a roller lid with a central shaft, an inner bracket, and a baffle plate in the roller. With the characteristic of rough and uneven inner surface, during the deposition of metal on the surface of the thermistor, a plated part is guaranteed to be in contact with the roller in a point and line manner, so that the concentration polarization during the metal deposition process is eliminated, and the definition and the electrical property of the edge of a chemical plated layer are guaranteed. With the rotation of the roller, a layer of good ohmic contact Nip-Cu electrodes is uniformly deposited on the chemical plated part in the different positions of the roller. The plating solution decomposition (or pollution in the local chemical plating) caused by local overheat of the conventional roller due to plated part deposition is avoided.
Description
Technical field
The present invention relates to ceramic capacitor, thermistor, piezo-resistance forms the good ohmic contact electrode by local chemical plating.Be particularly related to a kind of isolated electronic ceramic surface local chemical plating cylinder.
Background technology
Ceramic capacitor, PTC, the formation of NTC thermistor and piezo-resistance metal electrode.90% above process using the fifties is from the silver-colored burning infiltration method of quilt of the former Soviet Union and East European countries' introduction.Over nearly 60 years, though silver-colored slurry formula has part to improve, but technology does not almost change; Promptly add organic solvent and additive with noble metal silver or its compound, ball milling becomes the slurry of thickness, and the method by silk screen printing is coated onto the metallized position of preceding porcelain body need then.After the drying through carrying out burning infiltration in 790-840 ℃ the scope.In order to make surface silver layer have certain thickness and evenly to adhere to, also need secondary or three burning infiltrations of three quilt silver.Sometimes in order to guarantee the manufacturing of thermistor good Ohmic contact electrode, also need printing aluminum slurry in advance.Ag-Zn slurry burning infiltration layer.Sometimes in order to satisfy the solderability of electrode for capacitors, soldering resistance also need electro-coppering on silver layer, tinning etc.Whole complex process costs an arm and a leg.The price of per kilogram silver slurry is approximately wantonly thousand yuan at present, and wherein solids only accounts for 60%, i.e. the simple substance silver that burning infiltration obtains is lower, so ceramic capacitor, thermistor, and the piezo-resistance market price is the bottleneck of restriction electronic component enterprise development always.That is to say, replace silver electrode imperative with low-cost copper or nickel electrode.
Since traditional by the silver process complexity, the cost height of stock silver slurry, and economic benefit is low, and is poor by the soldering resistance of silver layer simultaneously, and the congruent melting phenomenon is arranged; In the circuit midium or long term silver ion migration is arranged, and cause the electrical property of capacitor or thermistor to descend.Recent two decades comes, and the home and abroad has been carried out chemical nickel plating or copper electrode and replaced by the research of silver-colored burning infiltration electrode process.By Japan's exploitation, introduce China and use the eighties at first.It is to adopt traditional sensitization-activation method, then deposition layer of metal copper or nickel in chemical plating fluid.Behind cleaning-drying, grind off coating on every side with hollow grinding machine, use the wax of the bonding usefulness of organic solvent flush away at last, still have indivedual electron trades to use at present.Although the method can part can replace traditional silver electrode that is prepared by silver process with nickel plating or copper electrode, but this complex process only is suitable for flat shape electronic component, and in coating grinding process all round easily along surface pollution, thereby the generation insulation breakdown causes the thickness of matrix can not be too thin.In addition, the adhesive force that produces coating by traditional sensitization-activation method is not high, and the cleaning of last adhesive-wax also easily causes environmental pollution.
We have developed and have not had lead-in wire Leaded Ceramic Disc Capacitor chemical nickel plating and copper new technology (Chinese invention patent CN1057300A) by continuous exploration and the technological improvement of more than ten years.And factory applies at the portions of electronics element, and product has exported Southeast Asia and European countries.In recent years, we made the process of good ohmic contact electrode with this technological expansion to thermistor and piezo-resistance, and with PTC thermistor topochemistry copper-plating technique in the industrialization trial production of electronic component enterprise.Obtained satisfied electrical performance indexes and economic benefit (Chinese invention patent CN101429655A).The fact shows, the method technology maturation, and various electrical performance indexes satisfy the GB requirement.And production cost declines to a great extent.The applying of this technology can be electronic enterprise and brings considerable economic.But in the development process of this technology, we find that chemical plating cylinder traditionally can not satisfy the requirement of local chemical plating copper technologies such as PTC thermistor.Local overheating easily causes plating bath to decompose coating marginal definition variation.
Summary of the invention
In order to solve the deficiencies in the prior art, be equipped with the characteristics that good ohmic contacts the NiP-Cu combination electrode according to thermistor local chemical plating copper, design and make a kind of ceramic capacitor that is suitable for, the isolated cylinder of thermistor and piezo-resistance local chemical plating.Satisfy in the preparation process of electron trade electronic component metal electrode and use.We have developed a kind of isolated electronic ceramic surface local electroless copper or nickel cylinder.
The technical solution of the utility model is:
A kind of isolated electronic ceramic surface local chemical plating cylinder is characterized in that he is by gear driving device (1), cylinder (2), and central rotating shaft (3) contains the drum cover (4) of central shaft, and an internal stent (5) and a tube internal partition (6) are formed; Gear driving device is positioned on the cylinder skin; Internal stent is connected by the tube internal partition with cylinder; Cylinder (2) and the drum cover (4) by central rotating shaft are provided with many holes.
Described gear driving device is positioned on middle part, two ends or the central rotating shaft of cylinder.
Described cylinder column type or multiedge cylinder any.
Described cylinder (2) and contain that all to be covered with diameter on the drum cover (4) of central shaft be the 3-15mm circular hole.
Described internal stent (5) is five square bodies, hexagonal prism body or cylinder; The outer surface of internal stent is rough and uneven in surface.
The two sides of described dividing plate presents scraggly appearance structure, and its salient point can be selected tetragonal pyramid, cone or cubic trapezium structure; The concave point position is equally distributed circular hole.
Above-mentioned salient point is selected tetragonal pyramid, cone or cubic trapezium structure; Concave point position drill diameter is the circular hole of 4-10mm.
The material of described chemical plating cylinder is the non-conductive material of PVC, polymethyl methacrylate or polytetrafluoroethylene.
The beneficial effects of the utility model are: in the deposition process of electronical elements surface metal, chemical plating piece is at the diverse location depositing metal layers of cylinder.Having eliminated traditional cylinder piles up the plating bath that the local overheating cause causes because of plating piece and decomposes.Plating piece contacts with cylinder with the form of Points And lines simultaneously, rather than contacts with cylinder with the form of face, has eliminated the concentration polarization in the metal deposition process.Guarantee the definition and the electrical property at chemical deposit edge.
Description of drawings
Fig. 1 is the surface texture figure of the utility model cylinder;
Fig. 2 is the internal cross section structural map of the embodiment of utility model cylinder;
Fig. 3 (a) is the local chemical plating NiP-Cu alloy electrode appearing diagram that cylinder is finished;
Fig. 3 (b) is the local chemical plating NiP-Cu alloy electrode cutaway view that cylinder is finished.
Embodiment
Adopt isolated electronic ceramic surface local chemical plating cylinder, it is by gear driving device, cylinder, central rotating shaft, and six parts such as drum cover, internal stent and tube internal partition that contain central shaft are formed.And select PVC, polymethyl methacrylate, non-conductive material such as polytetrafluoroethylene are through machining with combine.Its structure can be any of column type or multiedge cylinder.Its inner surface presents scraggly feature, guaranteeing that in the deposition process of electronical elements surface metal plating piece contacts with cylinder with the form of Points And lines, rather than contacts with cylinder with the form of face.Eliminate the concentration polarization in the metal deposition process, guarantee chemical deposit (8) edge definition (as Fig. 3 (a) (b) shown in) and electrical property.Simultaneously, the effect of gear driving device is the gear interlock on external electric power gear and the cylinder and cylinder is rotated in chemical plating fluid.The position that cylinder cogs can be positioned at middle part (Fig. 1), on two ends or the central rotating shaft.External electric power gear rotating speed adjustable, easy to operate.All be covered with nicely rounded hole on cylinder, the drum cover that contains central shaft, dividing plate and internal stent, diameter is about 3-15mm.In electronic ceramic surface local chemical plating process, and plating bath flows by circular hole.The CONCENTRATION DISTRIBUTION uniformity that keeps plating bath.
The design feature of internal stent can be five square bodies (as Fig. 2), hexagonal prism body or cylinder.Structures such as and the outer surface of internal stent and the two sides of dividing plate all present scraggly appearance structure, and its salient point can be selected tetragonal pyramid, and cone or four directions are trapezoidal.And be the circular hole of 4-10mm at concave point position drill diameter.With dividing plate internal stent is connected with cylinder then.Cylinder is isolated into five identical zones.In the chemical deposition process, along with the rotation of cylinder, chemical plating piece is at the diverse location depositing metal layers of cylinder.Eliminated traditional cylinder and piled up the plating bath that the local overheating cause causes because of plating piece and decompose, perhaps the infection phenomenon in the local chemical plating.
At first the thermistor porcelain body water behind the high-temperature activation is cleaned up, to remove the active particles of adhering to a little less than the surface.To need the thermistor element equivalent of localized metallicization to place five Disengagement zone then.Through preplating Ni-P alloy-layer (9) afterwards, directly change in the chemical bronze plating liquid.In the rolling process of cylinder, the magnet (7) that contains the thermistor of pre-plating layer rolls in five different zones of cylinder (2), can avoid traditional cylinder thermistor porcelain spare only to pile up in the bottom of cylinder.Because of chemical reaction produces the local overheating phenomenon, cause the copper sedimentary deposit of chemical plating piece to infect.In addition, all present scraggly design feature, and have a large amount of pore structures to exist on five isolated area surfaces of cylinder.On the one hand, guarantee the thermistor magnet in the chemical deposition process, magnet is along rotating shaft opposite direction rolling-operation rather than slip.Avoided the friction between magnet and the cylinder.On the other hand, owing to five region surface bump structures of cylinder all constitute with cone or cubic cone.The magnet form with Points And lines in metal deposition process that has guaranteed thermistor contacts with drum inner surface.Eliminate near the generation of the concentration polarization phenomenon of magnet.And the flowing and the direction of rotation of rolling of plating bath in the coating bath guaranteed the homogeneity of bath concentration in the plating process.
If adopt traditional chemical plating cylinder, the inner surface of cylinder and internal partition all present planar structure, and the circular hole that does not also exist plating bath to flow on the dividing plate.In the deposition process of electronical elements surface metal, because of a large amount of plating pieces is piled up in the bottom of cylinder, the local overheating that causes owing to chemical reaction causes bath portion to decompose.Simultaneously plating piece closely contacts with cylinder with aspectant form, and along cylinder and sliding and running.The friction between magnet and cylinder, cause the bath concentration of long-time plating piece and the tight contact area of cylinder extremely low, the copper sedimentary deposit of chemical plating piece along the edge to outdiffusion.Here it is above-mentioned infection phenomenon.The chemical plating cylinder that adopts us to design has solved above-mentioned local chemical plating technical barrier.Eliminated the concentration polarization in the metal deposition process.Guarantee the definition and the electrical property at chemical deposit edge.
Claims (8)
1. an isolated electronic ceramic surface local chemical plating cylinder is characterized in that he is by gear driving device (1), cylinder (2), and central rotating shaft (3) contains the drum cover (4) of central shaft, and an internal stent (5) and a tube internal partition (6) are formed; Gear driving device is positioned on the cylinder skin; Internal stent is connected by the tube internal partition with cylinder; Cylinder (2) and the drum cover (4) by central rotating shaft are provided with many holes.
2. according to the described cylinder of claim 1, it is characterized in that described gear driving device is positioned on the middle part of cylinder, two ends or the central rotating shaft.
3. according to the described cylinder of claim 1, it is characterized in that any of described cylinder column type or multiedge cylinder.
4. according to the described cylinder of claim 1, it is characterized in that described cylinder (2) and contain that all to be covered with diameter on the drum cover (4) of central shaft be the 3-15mm circular hole.
5. according to the described cylinder of claim 1, it is characterized in that described internal stent (5) is five square bodies, hexagonal prism body or cylinder; The outer surface of internal stent is rough and uneven in surface.
6. according to the described cylinder of claim 1, it is characterized in that the two sides of described dividing plate presents scraggly appearance structure, its salient point can be selected tetragonal pyramid, cone or cubic trapezium structure; The concave point position is equally distributed circular hole.
7. according to the described cylinder of claim 6, it is characterized in that described concave point position drill diameter is the circular hole of 4-10mm.
8. according to the described cylinder of claim 1, the material that it is characterized in that described chemical plating cylinder is the non-conductive material of PVC, polymethyl methacrylate or polytetrafluoroethylene.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010202185442U CN201804716U (en) | 2010-06-08 | 2010-06-08 | Isolated-type roller for local chemical plating of electronic ceramic surface |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010202185442U CN201804716U (en) | 2010-06-08 | 2010-06-08 | Isolated-type roller for local chemical plating of electronic ceramic surface |
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| Publication Number | Publication Date |
|---|---|
| CN201804716U true CN201804716U (en) | 2011-04-20 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010202185442U Expired - Fee Related CN201804716U (en) | 2010-06-08 | 2010-06-08 | Isolated-type roller for local chemical plating of electronic ceramic surface |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110144572A (en) * | 2018-02-12 | 2019-08-20 | 威测国际能源材料有限公司 | The film plating process of metalwork |
| CN110144571A (en) * | 2018-02-12 | 2019-08-20 | 威测国际能源材料有限公司 | The filming equipment of metalwork |
-
2010
- 2010-06-08 CN CN2010202185442U patent/CN201804716U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110144572A (en) * | 2018-02-12 | 2019-08-20 | 威测国际能源材料有限公司 | The film plating process of metalwork |
| CN110144571A (en) * | 2018-02-12 | 2019-08-20 | 威测国际能源材料有限公司 | The filming equipment of metalwork |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110420 Termination date: 20150608 |
|
| EXPY | Termination of patent right or utility model |