CN201797647U - Multi-layer plate structure contributing to improving signal integrity - Google Patents
Multi-layer plate structure contributing to improving signal integrity Download PDFInfo
- Publication number
- CN201797647U CN201797647U CN2010205404013U CN201020540401U CN201797647U CN 201797647 U CN201797647 U CN 201797647U CN 2010205404013 U CN2010205404013 U CN 2010205404013U CN 201020540401 U CN201020540401 U CN 201020540401U CN 201797647 U CN201797647 U CN 201797647U
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- signal integrity
- layer
- reinforcing material
- bonding sheet
- improving signal
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Abstract
The utility model provides a multi-layer plate structure contributing to improving signal integrity, which comprises a bonding sheet layer, and a circuit layer and a ground layer respectively coated on upper and lower surfaces of the bonding sheet. The bonding sheet layer has at least one bonding sheet; the bonding sheet comprises a reinforcing material and resin attached to the reinforcing material by coating and drying, wherein the reinforcing material is glass fiber paper. Compared with a multi-layer plate structure with the same thickness made of glass fiber cloth, the multi-layer plate structure contributing to improving signal integrity has dielectric constant uniformity; therefore, characteristic impedance value and insertion loss consistency between different circuits can be provided, and the structure contributes to improving the signal integrity. In addition, the convenience of designing a printed circuit board (PCB) circuit can be improved.
Description
Technical field
The utility model relates to the printed wiring board technical field, relates in particular to a kind of multi-layer sheet structure that helps improving signal integrity.
Background technology
The all materials of printed wiring board mainly are as reinforcing material with glass fabric in the industry at present, glass fabric (being called for short glass cloth) has longitude and latitude gauze lattice structure (as shown in Figure 3), big at warp and weft interweaving point and centre position, space glass fiber content difference, make that resin content is inhomogeneous everywhere.This glass cloth is owing to its structural reason causes under the lead dielectric constant of bonding lamella inhomogeneous, thereby causes the characteristic impedance value of different circuits different, and the insertion loss is also different.Along with present line width is more and more littler, above-mentioned performance is more outstanding.
The utility model content
The purpose of this utility model is, a kind of multi-layer sheet structure that helps improving signal integrity is provided, and can guarantee the uniformity of dielectric constant, improves the convenience of PCB line design.
To achieve these goals, the utility model provides a kind of multi-layer sheet structure that helps improving signal integrity, it comprises: the bonding lamella, be laminated with in the line layer and the stratum of bonding lamella upper and lower surface respectively, this bonding lamella is at least one bonding sheet, bonding sheet comprises reinforcing material, and by applying the resin that is attached to after the drying on the reinforcing material, this reinforcing material is a glass paper.
Described reinforcing material is 25～105g/m
2Glass paper.
The resin content of described bonding sheet is 75～95%.
Described line layer comprises several circuits, and the stratum is a Copper Foil.
The beneficial effects of the utility model: the multi-layer sheet structure that helps improving signal integrity of the present utility model, multi-layer sheet structure compared to the use glass cloth of same thickness, has the dielectric constant uniformity, thereby characteristic impedance value and insertion loss consistency between the different circuits can be provided, be beneficial to and improve signal integrity; In addition, can improve the convenience of PCB line design.
In order further to understand feature of the present utility model and technology contents, see also following about detailed description of the present utility model and accompanying drawing, yet accompanying drawing only provide with reference to and the explanation usefulness, be not to be used for the utility model is limited.
Description of drawings
Below in conjunction with accompanying drawing,, will make the technical solution of the utility model and other beneficial effect apparent by embodiment of the present utility model is described in detail.
In the accompanying drawing,
Fig. 1 helps improving the structural representation of the multi-layer sheet structure of signal integrity for the utility model;
Fig. 2 is the part plan structural representation of reinforcing material in the utility model (glass paper);
Fig. 3 is the part plan structural representation of the existing glass cloth that uses.
Embodiment
Below in conjunction with accompanying drawing the utility model is described in detail.
As shown in Figure 1, the multi-layer sheet structure that helps improving signal integrity of the present utility model, it comprises: bonding lamella 20, be laminated with in the line layer 10 and the stratum 30 of bonding lamella 20 upper and lower surfaces respectively, this bonding lamella 20 is at least one bonding sheet, bonding sheet comprises reinforcing material, and by applying the resin that is attached to after the drying on the reinforcing material, this reinforcing material is a glass paper, and stratum 30 is a Copper Foil.Line layer 10 comprises several circuits.
Described reinforcing material 1 adopts 25～105g/m
2Glass paper.As shown in Figure 2, described glass paper has spongelike structure loose, porous, thereby has good adsorption resin ability, and can make the easier glass paper that soaks into of resin, compare glass cloth, this glass paper is not through braiding, identical with resin ratio everywhere on it, thus dielectric constant is also even.When described bonding sheet was made, on reinforcing material 1 (glass paper) two sides, resin also can be adsorbed in wherein by fine simultaneously, promptly makes behind the high-temperature baking semi-solid preparation with resin-coating.The resin content of the bonding sheet that makes is 75～95%.
As to use a multi-layer sheet of Fr-4 materials processing, outer-layer circuit width be 4mil (about 100 μ m), the thick about 35 μ m of outer copper.Outer copper foil is 80 μ m to the thickness requirement of time outer copper foil, and this dielectric thickness need use 1080 bonding sheets in the prior art.The about 250 μ m of the warp width of 1080 glass cloth, the about 250um of warp thread spacing.In the warp thread position because of glass yarn relative amount height, so the medium dielectric constant big (about 4.5) of this position circuit and ground interlayer (Copper Foil); Low in the warp thread interstitial site because of glass yarn relative amount, so the medium dielectric constant less (about 3.8) of this position circuit and ground interlayer.If two circuits, (about 56 Ω of its characteristic impedance above warp thread wherein, the about 15db of the Insertion Loss of 1M line length under the 3GHz frequency), other (about 60 Ω of its characteristic impedance above the warp thread gap, the about 13db of the Insertion Loss of 1M line length under the 3GHz frequency), the characteristic impedance value of these two circuits is different, and the insertion loss is also different, and can be more obvious along with the rising difference of frequency.And the multi-layer sheet structure that helps improving signal integrity of the present utility model, because of using glass paper, it is reinforcing material, identical with resin ratio everywhere in the glass paper, thereby dielectric constant is also even, the characteristic impedance value of the circuit of line layer 10 diverse locations is identical on the feasible multi-layer sheet structure that makes, and the insertion loss is also identical.
In sum, the multi-layer sheet structure that helps improving signal integrity of the present utility model, multi-layer sheet structure compared to the use glass cloth of same thickness, has the dielectric constant uniformity, thereby characteristic impedance value and insertion loss consistency between the different circuits can be provided, be beneficial to and improve signal integrity; In addition, can improve the convenience of PCB line design.
The above; for the person of ordinary skill of the art; can make other various corresponding changes and distortion according to the technical solution of the utility model and technical conceive, and all these changes and distortion all should belong to the protection range of the utility model claim.
Claims (4)
1. multi-layer sheet structure that helps improving signal integrity, it is characterized in that, it comprises: the bonding lamella, be laminated with in the line layer and the stratum of bonding lamella upper and lower surface respectively, this bonding lamella is at least one bonding sheet, bonding sheet comprises reinforcing material, and by applying the resin that is attached to after the drying on the reinforcing material, this reinforcing material is a glass paper.
2. the multi-layer sheet structure that helps improving signal integrity as claimed in claim 1 is characterized in that described reinforcing material is 25～105g/m
2Glass paper.
3. the multi-layer sheet structure that helps improving signal integrity as claimed in claim 1 is characterized in that the resin content of described bonding sheet is 75～95%.
4. the multi-layer sheet structure that helps improving signal integrity as claimed in claim 1 is characterized in that described line layer comprises several circuits, and the stratum is a Copper Foil.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010205404013U CN201797647U (en) | 2010-09-21 | 2010-09-21 | Multi-layer plate structure contributing to improving signal integrity |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010205404013U CN201797647U (en) | 2010-09-21 | 2010-09-21 | Multi-layer plate structure contributing to improving signal integrity |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201797647U true CN201797647U (en) | 2011-04-13 |
Family
ID=43852543
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010205404013U Expired - Lifetime CN201797647U (en) | 2010-09-21 | 2010-09-21 | Multi-layer plate structure contributing to improving signal integrity |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201797647U (en) |
-
2010
- 2010-09-21 CN CN2010205404013U patent/CN201797647U/en not_active Expired - Lifetime
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20110413 |