CN201791688U - Roller of silicon wafer horizontal cleaning machine - Google Patents

Roller of silicon wafer horizontal cleaning machine Download PDF

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Publication number
CN201791688U
CN201791688U CN2010201900673U CN201020190067U CN201791688U CN 201791688 U CN201791688 U CN 201791688U CN 2010201900673 U CN2010201900673 U CN 2010201900673U CN 201020190067 U CN201020190067 U CN 201020190067U CN 201791688 U CN201791688 U CN 201791688U
Authority
CN
China
Prior art keywords
roller
upper roller
silicon chip
cleaning machine
horizontal cleaning
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2010201900673U
Other languages
Chinese (zh)
Inventor
覃启东
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SUZHOU JUKING TECHNOLOGY Co Ltd
Original Assignee
SUZHOU JUKING TECHNOLOGY Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SUZHOU JUKING TECHNOLOGY Co Ltd filed Critical SUZHOU JUKING TECHNOLOGY Co Ltd
Priority to CN2010201900673U priority Critical patent/CN201791688U/en
Application granted granted Critical
Publication of CN201791688U publication Critical patent/CN201791688U/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Abstract

The utility model provides a roller of a silicon wafer horizontal cleaning machine. The roller of the silicon wafer horizontal cleaning machine drives silicon wafers to linearly move in constant speed, pressure of an upper roller and a lower roller to silicon wafers is moderate, and wafer jamming or wafer breakage can be avoided. The roller comprises at least one pair of rollers including the upper roller and the lower roller, the upper roller and the lower roller of each pair of rollers are opposite up to down, the lower roller is connected with a lower rotating shaft driving the lower roller to rotate, the roller further comprises an upper driving shaft used for driving the upper roller to rotate, cleaned silicon wafers are placed on the lower roller, the upper roller contacts with upper surfaces of the silicon wafers, and a clearance is radially reserved between the upper roller and the upper driving shaft.

Description

Roller of silicon wafer horizontal cleaning machine
Technical field
The utility model relates to the roller of silicon chip of solar cell horizontal cleaning machine.
Background technology
When the silicon chip of solar cell horizontal cleaning machine cleaned silicon chip of solar cell, silicon chip moved at the underwater along continuous straight runs, and the current of runner clean silicon chip.Roller in the silicon chip of solar cell horizontal cleaning machine is exactly to drive the mechanism that the silicon wafer horizontal straight line moves.
At least one pair of roller that existing roller is made up of upper roller, bottom roller, the upper roller in every pair roller is relative up and down with bottom roller, and bottom roller links to each other with the lower rotary shaft that drives its rotation; Upper roller or be fixed in the last rotating shaft that drives its rotation perhaps is free activity fully.
If upper roller is fixed on rotating shaft, because the distance between upper roller and the bottom roller is a definite value, when silicon chip is placed between upper roller and the bottom roller, upper roller contacts with lower surface with the upper surface of silicon chip respectively with bottom roller, upper roller and bottom roller all drive silicon chip by frictional force and move, the roller of this structure is prone to the fragment that dead pressure silicon chip (silicon chip can not move) or upper roller and bottom roller cause greatly the pressure of silicon chip when transmitting during silicon chip.But the advantage of this structure is can drive the silicon chip straight line to move.
If upper roller is free movable, when silicon chip is placed between upper roller and the bottom roller, upper roller only is to contact with the upper surface of silicon chip owing to gravity, the silicon chip that moves under the frictional force effect of bottom roller drives upper roller again and rotates, the roller of this structure is when transmitting during silicon chip, silicon chip wanders off easily in transmission (departing from mobile straight line) or skids, and a slice silicon chip is folded and the phenomenon of card mutually with inconsistent, the preceding a slice silicon chip of back a slice silicon chip translational speed and back a slice silicon chip before can occurring.
Summary of the invention
The purpose of this utility model provide a kind of drive silicon chip at the uniform velocity straight line move, upper roller and bottom roller to the moderate pressure of silicon chip, the silicon chip of solar cell horizontal cleaning machine roller of card or fragment phenomenon can not appear.
Roller of silicon wafer horizontal cleaning machine of the present utility model comprises at least one pair of roller of being made up of upper roller, bottom roller, and the upper roller in every pair roller is relative up and down with bottom roller, and bottom roller links to each other with the lower rotary shaft that drives its rotation; It also comprises the last driving shaft that is used to drive the upper roller rotation; The silicon chip that is cleaned is placed on the bottom roller, and upper roller contacts with the upper surface of silicon chip, and is gapped in radial direction between upper roller and the last driving shaft.
After adopting such structure, because gapped between upper roller and the last driving shaft, in the upper roller rotation, can easy on and off activity in the scope in gap, make upper roller certain pressure be arranged, avoided upper roller excessive and produce the silicon chip fragment the pressure of silicon chip to silicon chip.In the utility model, upper roller is not only to rely on gravity pressure to compress silicon chip, prevented that upper roller breaks away from silicon chip, simultaneously, last driving shaft can drive upper roller again and rotate, and upper roller drives silicon chip by frictional force and moves, can make silicon chip in transmission, move and can not wander off along straight line, also avoided the skidding between upper roller and the silicon chip, like this, preceding a slice silicon chip is consistent with back a slice silicon chip translational speed, can not occur before a slice silicon chip with back a slice silicon chip the folded mutually and phenomenon of card.
Above-mentioned roller of silicon wafer horizontal cleaning machine, it also comprises two blocks that are arranged on the driving shaft, upper roller is between two blocks, and is all gapped between upper roller and two blocks.Two blocks define the position that upper roller moves vertically, make that upper roller is free movable, better to the guide effect of silicon chip like this at specific axial location, makes silicon chip to move along straight line.
The structure of the last driving shaft that the drive upper roller rotates has varied, and the last driving shaft of fairly simple practicality comprises rotating shaft and the drive pin that radially extends along last rotating shaft; The endoporus of upper roller is passed in last rotating shaft; Have groove on the upper roller inner hole wall; Drive pin stretches in the groove; The width of drive pin is less than the width of groove, and the height of drive pin is less than the degree of depth of groove, and the external diameter of last rotating shaft is less than the diameter of bore of upper roller.Because the external diameter of last rotating shaft is less than the diameter of bore of upper roller, so gapped in radial direction between upper roller and last rotating shaft.Be used for the degree of depth of the height of drive pin, so gapped in radial direction between upper roller and drive pin less than groove.
Above-mentioned roller of silicon wafer horizontal cleaning machine, described roller have two pairs.Two pair rollers can drive a silicon chip respectively and move, and have so just improved operating efficiency.
Description of drawings
Fig. 1 is a front view of the present utility model.
Fig. 2 is the A-A cutaway view of Fig. 1.
Fig. 3 is the schematic diagram of upper roller.
Fig. 4 is the left view of Fig. 3.
Fig. 5 is the connection diagram of drive pin and right baffle plate.
Fig. 6 is the left view of Fig. 5.
The specific embodiment
Below in conjunction with the drawings and specific embodiments the utility model is described in further detail.
Referring to roller of silicon wafer horizontal cleaning machine shown in Figure 1, comprise two pair rollers 1, the upper roller 2 in every pair roller is relative up and down with bottom roller 3, and bottom roller 3 is one with the lower rotary shaft 4 that drives its rotation.
Be used to drive the last driving shaft 5 that upper roller 2 rotates and comprise rotating shaft 51 and two drive pins 52, drive pin 52 radially extends along last rotating shaft, the axis symmetry of two drive pin 52 above rotating shafts 51.The endoporus 21 of upper roller 2 is passed in last rotating shaft 51; Have two grooves 23 on the upper roller inner hole wall 22; Two grooves 23 are with endoporus 21 axis symmetries.Drive pin 52 stretches in the groove 23.
In last rotating shaft, also be fixed with two groups of blocks 6.Every group of block comprises left block 61, right block 62.Each upper roller 2 both sides has the left block 61, the right block 62 that are fixed in the rotating shaft respectively.Gapped J between upper roller and the left block 61, gapped K between upper roller and the right block 62.
The height H of drive pin is less than the degree of depth F of groove, between upper roller and the drive pin at the gapped G of radial direction.The width W of drive pin is less than the width U of groove, between upper roller and the drive pin with the perpendicular direction of radial direction on gapped V.The external diameter Z of last rotating shaft is less than the diameter X of the endoporus 21 of upper roller, between upper roller and the last rotating shaft at the gapped Y of radial direction.
When the silicon chip that is cleaned is placed between bottom roller and the upper roller, upper roller contacts with the upper surface of silicon chip, bottom roller contacts with the lower surface of silicon chip, upper roller that rotates under last drive pin 52 drives and the bottom roller that rotates under lower rotary shaft drives produce frictional force to silicon chip simultaneously, drive silicon chip and move forward.
In the present embodiment, drive pin 52 and right block 62 are fixed together.Certainly, drive pin 52 also can directly be fixed on rotating shaft 51 and need not to fixedly connected with right block 62.
Upper roller 2 has relative activity space with last driving shaft 5, avoids compressing silicon chip, simultaneously, prevents that also upper roller breaks away from silicon chip, makes silicon chip can not wander off or skid in transmission.And 5 pairs of upper rollers 2 of last driving shaft have the effect of driving, make upper roller 2 be driving wheel, have increased the frictional force to silicon chip, and a slice silicon chip is consistent with back a slice silicon chip speed before making, lamination card phenomenon before and after can not occurred.Since above-mentioned clearance G, V, Y, J, K are arranged, can be free movable in above-mentioned gap in upper roller 2 rotates.The rotating speed of bottom roller and the rotating speed of upper roller form certain relation, guarantee that upper roller, bottom roller equate with the linear velocity value of the contact point of silicon chip, like this, avoid the relative friction between upper roller and the bottom roller, guarantee chip transmission speed uniform and stable, reduce fragment.

Claims (4)

1. roller of silicon wafer horizontal cleaning machine comprises at least one pair of roller of being made up of upper roller, bottom roller, and the upper roller in every pair roller is relative up and down with bottom roller, and bottom roller links to each other with the lower rotary shaft that drives its rotation; It is characterized in that: further comprising and be used to drive the last driving shaft that upper roller rotates; The silicon chip that is cleaned is placed on the bottom roller, and upper roller contacts with the upper surface of silicon chip, and is gapped in radial direction between upper roller and the last driving shaft.
2. roller of silicon wafer horizontal cleaning machine as claimed in claim 1 it is characterized in that: further comprising two blocks that are arranged on the driving shaft, and upper roller is between two blocks, and is all gapped between upper roller and two blocks.
3. roller of silicon wafer horizontal cleaning machine as claimed in claim 2 is characterized in that: go up driving shaft and comprise rotating shaft and the drive pin that radially extends along last rotating shaft; The endoporus of upper roller is passed in last rotating shaft; Have groove on the upper roller inner hole wall; Drive pin stretches in the groove; The width of drive pin is less than the width of groove, and the height of drive pin is less than the degree of depth of groove, and the external diameter of last rotating shaft is less than the diameter of bore of upper roller.
4. roller of silicon wafer horizontal cleaning machine as claimed in claim 1 is characterized in that: described roller has two pairs.
CN2010201900673U 2010-05-14 2010-05-14 Roller of silicon wafer horizontal cleaning machine Expired - Fee Related CN201791688U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2010201900673U CN201791688U (en) 2010-05-14 2010-05-14 Roller of silicon wafer horizontal cleaning machine

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2010201900673U CN201791688U (en) 2010-05-14 2010-05-14 Roller of silicon wafer horizontal cleaning machine

Publications (1)

Publication Number Publication Date
CN201791688U true CN201791688U (en) 2011-04-13

Family

ID=43846608

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2010201900673U Expired - Fee Related CN201791688U (en) 2010-05-14 2010-05-14 Roller of silicon wafer horizontal cleaning machine

Country Status (1)

Country Link
CN (1) CN201791688U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107134428A (en) * 2017-06-20 2017-09-05 常州亿晶光电科技有限公司 Silicon wafer conveying device in texturing slot

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107134428A (en) * 2017-06-20 2017-09-05 常州亿晶光电科技有限公司 Silicon wafer conveying device in texturing slot
WO2018233501A1 (en) * 2017-06-20 2018-12-27 常州亿晶光电科技有限公司 Silicon wafer conveying device in texturing tank

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Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20110413

Termination date: 20150514

EXPY Termination of patent right or utility model