CN201773833U - Mold core for semiconductor plastic package mold - Google Patents
Mold core for semiconductor plastic package mold Download PDFInfo
- Publication number
- CN201773833U CN201773833U CN2010205127010U CN201020512701U CN201773833U CN 201773833 U CN201773833 U CN 201773833U CN 2010205127010 U CN2010205127010 U CN 2010205127010U CN 201020512701 U CN201020512701 U CN 201020512701U CN 201773833 U CN201773833 U CN 201773833U
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- CN
- China
- Prior art keywords
- nib
- lug
- plastic package
- standing part
- core
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Moulds For Moulding Plastics Or The Like (AREA)
Abstract
The utility model relates to the field of plastic package of semiconductors, in particular to a mold core for a semiconductor plastic package mold, comprising a fixed part and a working part which is connected with the fixed part, wherein the working part comprises a circular shaft and three convex edges, and the three convex edges are 120-degree arranged to each other along the circumference direction of the circular shaft; the fixed part and the convex edges are connected along the axial direction of the circular shaft; and the fixed part has the smallest outer diameter at the joint, which is equal to the diameter of a circumcircle where the convex edges are placed. The mold core for the semiconductor plastic package mold has little probability of breakage and high stability, thereby greatly reducing the maintenance cost of spare parts caused by breakage of the plastic package mold during use and improving the production efficiency and quality.
Description
Technical field
The utility model relates to the semiconductor plastic package field, more particularly, relates to a kind of core that is used for the semiconductor plastic package mould.
Background technology
In the plastic sealing semiconductor device mould, partly sealing of triode TO-126 requires the degree of the excessive plastic packaging material in fin (being slide glass) outside very little, therefore used three lobe cores of picture plum blossom shape (to be the plum blossom core again, as shown in Figure 1) support fin (being slide glass), improving the degree of excessive plastic packaging material greatly.The plum blossom core by working portion C be connected with working portion C and have in the bottom that the standing part A of holddown groove B forms.Working portion C comprises circular shaft and three lug, nibs that are 120 degree angles along the circular shaft direction mutually again, because the external diameter of standing part A is less than the diameter of the lug, nib place circular shaft of working portion C, therefore, the blossom type cored structure that uses has the defective that ruptures easily at D place when being subjected to the pressure of fin slide glass in the above, has influenced production efficiency and quality to a great extent.
The utility model content
The technical problems to be solved in the utility model is that the above-mentioned defective that ruptures easily in the junction of working portion and standing part at prior art proposes a kind of core that is used for the semiconductor plastic package mould.
The technical scheme that its technical problem that solves the utility model adopts is: comprise standing part and the working portion that is connected with described standing part, described working portion comprises that circular shaft and three circumferencial directions along described circular shaft are the lug, nib that 120 degree are arranged mutually, and described standing part and described lug, nib join along the circular shaft axial direction; Described standing part is in the external diameter minimum of joint, and with the equal diameters of described lug, nib place circumscribed circle.
At a kind of core that is used for the semiconductor plastic package mould of the utility model, described standing part bottom has also had the holddown groove of fixation.
At a kind of core that is used for the semiconductor plastic package mould of the utility model, described standing part comprises cylinder and is provided with on described cylinder excircle with described lug, nib joins and is connected lug, nib; The lateral surface of described connection lug, nib is the face of cylinder, the equal diameters of the diameter on the described face of cylinder and described lug, nib place circumscribed circle.
At a kind of core that is used for the semiconductor plastic package mould of the utility model, described standing part comprises cylinder and is provided with on described cylinder excircle with described lug, nib joins and is connected lug, nib; The lateral surface of described connection lug, nib is a taper seat, described connection lug, nib with the equal diameters of the external diameter of a circle and the described lug, nib place circumscribed circle of lug, nib joint.
At a kind of core that is used for the semiconductor plastic package mould of the utility model, described standing part is a cylinder, the equal diameters of described cylindrical diameter and described lug, nib place circumscribed circle.
Implement the utility model, have following beneficial effect: owing to adopt standing part and working portion not to have transitional structure, therefore the probability of fracture is very little, the steadiness height.Significantly reduce the spare part maintenance cost that plastic sealed mould in use ruptures and brought, improved production efficiency and quality.
Description of drawings
The utility model is described in further detail below in conjunction with drawings and Examples, in the accompanying drawing:
Fig. 1 is the structural representation of prior art plum blossom core;
Fig. 2 is the structural representation of first embodiment of the utility model core of being used for the semiconductor plastic package mould;
Fig. 3 is the structural representation of second embodiment of the utility model core of being used for the semiconductor plastic package mould;
Fig. 4 is the structural representation of the 3rd embodiment of the utility model core of being used for the semiconductor plastic package mould;
Fig. 5 is the user mode figure of the 3rd embodiment of the present utility model;
Fig. 6 is the structural representation of the 4th embodiment of the utility model core of being used for the semiconductor plastic package mould;
Figure number explanation: 1 standing part, 2 working portions, 3 holddown grooves, 4 lug, nibs, 5, circular shaft, E, forming cavity.
Embodiment
First kind of execution mode:
As shown in Figure 2, in the utility model first embodiment, the core that is used for the semiconductor plastic package mould comprises standing part 1 and working portion 2.Wherein working portion 2 comprises circular shaft 5 and is the lug, nibs 4 that 120 degree are arranged mutually along the circumferencial direction of circular shaft, and also has a holddown groove 3 in the bottom of standing part 1.Wherein lug, nib 4 also has draw taper.Working portion 2 is used for the forming cavity support fixation fin at plastic package die, and standing part 1 is used for support works part and plays fixation simultaneously.The holddown groove 3 of standing part 1 bottom is used for adorning to be hung bar and snaps on other parts to prevent that core from being extracted by the front from forming cavity when the product stripping of encapsulation.
In the present embodiment, with axial vertical direction, the cross sectional shape of standing part 1 is identical with the cross sectional shape of working portion 2, promptly standing part 1 is a cylinder, setting and lug, nib 4 join on the cylinder excircle is connected lug, nib; The lateral surface that connects lug, nib is the face of cylinder, and the equal diameters of the diameter on the face of cylinder and lug, nib 4 place circumscribed circles also extends to the bottom from joining part always, does not have transition structure, so greatly reduces the fracture probability of working portion 2.
Second kind of execution mode:
As shown in Figure 3, the structure of core various piece, connected mode and function have narration in first kind of execution mode, no longer repeat in this example.Standing part 1 is the circumscribed equal diameters in lug, nib 4 places of cylinder and cylindrical external diameter and working portion 2.Standing part 1 is whole shape with working portion 2, and this just makes core that good stressed load basis has been arranged and does not have transition structure, can reduce the possibility of working portion 2 fractures to a great extent.
The third execution mode:
As shown in Figure 4, the structure of core various piece, connected mode and function are same as the previously described embodiments, and the shape of standing part 1 still is a cylinder, are provided with lug, nib 4 joins to be connected lug, nib on the cylinder excircle.The lateral surface that connects lug, nib is a taper seat, connect lug, nib with the equal diameters of the external diameter of a circle and the lug, nib place circumscribed circle of lug, nib joint, promptly total has certain taper.Adopt this tapered configuration, can make whole core more firm.As shown in Figure 5, E is the forming cavity of plastic package die, and being in the forming cavity E is working portion 2.When utilizing holddown groove 3 to prevent that core from extracting from forming cavity E, because standing part 1 has certain taper, from forming cavity E, can not extract core, therefore make whole core firm more and be not easy fracture.In the present embodiment, holddown groove 3 also can not driven in the bottom of standing part 1, and the standing part 1 of cone can guarantee the firm of whole core.
The 4th kind of execution mode:
As shown in Figure 6, the structure of core various piece, connected mode and function are identical with first kind of execution mode.Different is that the lug, nib 4 of working portion 2 is not with draw taper.And the moulding of whole core time processing makes processing convenient on the basis that guarantees steadiness and minimizing fracture probability, can greatly enhance productivity.
It should be noted that the utility model is described by some embodiment, those skilled in the art know, under the situation that does not break away from spirit and scope of the present utility model, can carry out various changes or equivalence replacement to these features and embodiment.In addition, under instruction of the present utility model, can make amendment to these features and embodiment can not break away from spirit and scope of the present utility model to adapt to concrete situation and material.Therefore, the present invention is not subjected to the restriction of specific embodiment disclosed herein, and all interior embodiment of claim scope that fall into the application belong to protection range of the present utility model.
Claims (5)
1. core that is used for the semiconductor plastic package mould, comprise standing part and the working portion that is connected with described standing part, described working portion comprises that circular shaft and three circumferencial directions along described circular shaft are the lug, nib that 120 degree are arranged mutually, it is characterized in that described standing part and described lug, nib join along the circular shaft axial direction; Described standing part is in the external diameter minimum of joint, and with the equal diameters of described lug, nib place circumscribed circle.
2. the core that is used for the semiconductor plastic package mould according to claim 1 is characterized in that, described standing part bottom has also had the holddown groove of fixation.
3. the core that is used for the semiconductor plastic package mould according to claim 1 is characterized in that, described standing part comprises cylinder and is provided with on described cylinder excircle with described lug, nib joins and is connected lug, nib; The lateral surface of described connection lug, nib is the face of cylinder, the equal diameters of the diameter on the described face of cylinder and described lug, nib place circumscribed circle.
4. the core that is used for the semiconductor plastic package mould according to claim 1 is characterized in that, described standing part comprises cylinder and is provided with on described cylinder excircle with described lug, nib joins and is connected lug, nib; The lateral surface of described connection lug, nib is a taper seat, described connection lug, nib with the equal diameters of the external diameter of a circle and the described lug, nib place circumscribed circle of lug, nib joint.
5. the core that is used for the semiconductor plastic package mould according to claim 1 is characterized in that, described standing part is a cylinder, the equal diameters of described cylindrical diameter and described lug, nib place circumscribed circle.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010205127010U CN201773833U (en) | 2010-09-01 | 2010-09-01 | Mold core for semiconductor plastic package mold |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010205127010U CN201773833U (en) | 2010-09-01 | 2010-09-01 | Mold core for semiconductor plastic package mold |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201773833U true CN201773833U (en) | 2011-03-23 |
Family
ID=43753676
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010205127010U Expired - Fee Related CN201773833U (en) | 2010-09-01 | 2010-09-01 | Mold core for semiconductor plastic package mold |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201773833U (en) |
-
2010
- 2010-09-01 CN CN2010205127010U patent/CN201773833U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| EE01 | Entry into force of recordation of patent licensing contract |
Assignee: Shenzhen sky Technology Co., Ltd. Assignor: SHENZHEN HUALONG EXACTITUDE MOULD CO.,LTD.|Yang Yong|He Yong|Xu Yong Contract record no.: 2015440020121 Denomination of utility model: Mold core for semiconductor plastic package mold Granted publication date: 20110323 License type: Exclusive License Record date: 20150408 |
|
| LICC | Enforcement, change and cancellation of record of contracts on the licence for exploitation of a patent or utility model | ||
| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20160512 Address after: 522021 Renhe Industrial Park, fishing town, Jieyang Airport Economic Zone, Jieyang, Guangdong Patentee after: JIEYANG XIANJIE ELECTRONIC CO.,LTD. Address before: 518010, Guangdong, Shenzhen, Baoan District, Xixiang bell house, 70 buildings, three floors Patentee before: SHENZHEN HUALONG EXACTITUDE MOULD CO.,LTD. Patentee before: Yang Yong Patentee before: He Yong Patentee before: Xu Yong |
|
| CP01 | Change in the name or title of a patent holder | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 522021 Renhe Industrial Park, fishing town, Jieyang Airport Economic Zone, Jieyang, Guangdong Patentee after: GUANGDONG XIANJIE ELECTRONIC CO.,LTD. Address before: 522021 Renhe Industrial Park, fishing town, Jieyang Airport Economic Zone, Jieyang, Guangdong Patentee before: Guangdong Pioneer Technology Co.,Ltd. Address after: 522021 Renhe Industrial Park, fishing town, Jieyang Airport Economic Zone, Jieyang, Guangdong Patentee after: Guangdong Pioneer Technology Co.,Ltd. Address before: 522021 Renhe Industrial Park, fishing town, Jieyang Airport Economic Zone, Jieyang, Guangdong Patentee before: JIEYANG XIANJIE ELECTRONIC CO.,LTD. |
|
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110323 Termination date: 20180901 |