CN201742409U - Test circuit board for PON optical transceiver module - Google Patents

Test circuit board for PON optical transceiver module Download PDF

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Publication number
CN201742409U
CN201742409U CN2010201781566U CN201020178156U CN201742409U CN 201742409 U CN201742409 U CN 201742409U CN 2010201781566 U CN2010201781566 U CN 2010201781566U CN 201020178156 U CN201020178156 U CN 201020178156U CN 201742409 U CN201742409 U CN 201742409U
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China
Prior art keywords
interface
pon
electrical connection
circuit board
speed electric
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Expired - Fee Related
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CN2010201781566U
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Chinese (zh)
Inventor
杨先进
靳春华
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Dongguan Mentech Optical and Magnetic Co Ltd
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DONGGUAN MENTECH ELECTRONIC Co Ltd
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Abstract

The utility model discloses a test circuit board for a PON (passive optical network) optical transceiver module, which comprises a plurality of SFF (Set Flip-Flop) electric connection interfaces of an optical transceiver module, HF (High Frequency) differential signal input SMA interfaces, two multi-path high-speed electric switch chips, a plurality of electric current monitoring chips, an MCU, a USB interface J8 and a module-type optical switch S1, wherein the electric connection interfaces, the module-type optical switch S1 and the multi-path high-speed electric switch chips are connected with one another; the multi-path high-speed electric switch chips are connected with the MCU; and the MCU is connected with the USB interface J8. The test circuit board of PON optical transceiver module can test photoelectric property of the PON optical transceiver module, greatly reduces testing time, and saves test equipment, thereby lowering test cost and facilitating mass production.

Description

A kind of optical receiving-transmitting module test circuit board that is used for passive optical network PON
Technical field
The utility model relates to optical receiving-transmitting module test equipment, specifically is meant a kind of instrument that can detect a plurality of optical transceiver module PON.
Background technology
PON (Passive Optical Network) is the english abbreviation of passive optical-fiber network, compare with active smooth access technology, passive optical-fiber network PON is owing to the active equipment of having eliminated between local side and the user side, thereby make and safeguard simply, the reliability height, cost is low, it can save trunk optical fiber resource and network layer, under long Distance Transmission condition, can provide two-way high bandwidth capability, the access service kind is abundant, its telemanagement ability and passive light distribution network structure can significantly reduce O﹠M cost, therefore can support plurality of application scenes, be the main solution of following FTTH.Along with the progressively reduction of passive optical-fiber network PON cost, PON has had certain application market at FTTB/FTTC occasion passive optical-fiber network.It is several that present passive optical-fiber network PON technology mainly contains asynchronous transfer EPON APON, Ethernet passive optical network EPON and Gigabit Passive Optical Network GPON etc.At present, for the testing circuit board that uses in the research and development of the optical transceiver module among the passive optical-fiber network PON and the production process, a testing circuit board once can only be tested a PON optical transceiver module, and testing efficiency is low and be not easy to large-scale production.
The utility model content
The problem that the utility model need solve provides a kind of testing circuit board that can test simultaneously a plurality of passive optical network PON optical transceiver modules.
To achieve these goals, the utility model is designed a kind of optical receiving-transmitting module test circuit board that is used for passive optical network PON, described testing circuit board comprises several optical transceiver modules SFF electrical connection interface, high frequency difference frequency sub-signal input SMA interface TX+, TX-, high frequency difference frequency sub-signal output SMA interface RX+, RX-, multipath high-speed electric switch chip U2, U3,16 current monitoring chips, microprocessor controller MCU, usb communication interface J8 and modular optical switch S 1, the PON optical transceiver module light input/output port of pegging graft on the described electrical connection interface is connected with modular optical switch S 1, the high frequency difference frequency sub-signal lead-out terminal of electrical connection interface is connected with multipath high-speed electric switch chip U2, the high frequency difference frequency sub-signal input terminal of electrical connection interface is connected with multipath high-speed electric switch chip U3, multipath high-speed electric switch chip U2, U3 is connected with microprocessor controller MCU respectively, multipath high-speed electric switch chip U2 and high frequency difference frequency sub-signal output SMA interface RX+, RX-connects, multipath high-speed electric switch chip U3 and high frequency difference frequency sub-signal input SMA interface TX+, TX-connects, and microprocessor controller MCU is connected with usb communication interface J8.
Described electrical connection interface is 2 * 10 optical transceiver module SFF electrical connection interfaces; Described multipath high-speed electric switch chip U2, U3 are 8 * 1 multipath high-speed electric switch chips.
Described electrical connection interface is eight, is respectively electrical connection interface J0, J1, J2, J3, J4, J5, J6, J7.
Be connected in series a sampling resistor between the transmitting terminal power supply terminal of each electrical connection interface and DC power supply, each sampling resistor two ends connects the in-phase input end and the inverting input of a current monitoring chip respectively, constitutes transmitting terminal current monitoring module; Also be connected in series a sampling resistor between the receiving terminal power supply terminal of each electrical connection interface and the DC power supply, each sampling resistor two ends connects the in-phase input end and the inverting input of a current monitoring chip respectively, constitutes the arrival current monitoring modular.
Described microprocessor controller MCU is connected with high frequency difference frequency sub-signal input SMA interface TX current detection module with high frequency difference frequency sub-signal input SMA interface RX current detection module respectively.
The utility model is used for two 8 * 1 multipath high-speed electric switch chips of the optical receiving-transmitting module test circuit board of passive optical network PON, can realize the switching between eight road PON optical transceiver modules.The electric current precise monitoring function of eight road PON optical transceiver modules that described 16 current monitoring chips are perfect.The MCU controller has been integrated control, current monitoring information processing, module parameter data acquisition and the usb communication function of high speed electric switch.
The utility model is used for the optical receiving-transmitting module test circuit board of passive optical network PON have been realized simultaneously the photoelectric properties of eight optical transceiver module PON being tested on a testing circuit board, perfect especially electric current precise monitoring function, saved the testing time, saved testing equipment, reduce testing cost, be easy to carry out large-scale production.
The utility model is used for the optical receiving-transmitting module test circuit board of passive optical network PON especially in optical transceiver module PON research and development and production test procedure, to carry out the property at high and low temperature experiment to module, need the data parameters of test module on several temperature point, and high low temperature experimental box heats up and cooling and be stabilized in certain temperature spot and all need the regular hour, traditional optical transceiver module PON testing circuit board, once can only test an optical transceiver module PON, needs are finished the high low temperature test of eight optical transceiver module PON, the temperature of whole high low temperature experimental box rises and descends and also will repeat eight times, and is very time-consuming.The utility model is used for the optical receiving-transmitting module test circuit board of passive optical network PON, and an available testing circuit board is once finished the test of eight optical transceiver module PON simultaneously, has saved the testing time greatly, has saved testing equipment, thereby has reduced cost; On the other hand, in the production process of product, use the utility model optical transceiver module PON tester, be easier to realize large-scale production.
Description of drawings:
Fig. 1 is the optical receiving-transmitting module test circuit board composition functional-block diagram that the utility model is used for passive optical network PON.
Embodiment
For the ease of those skilled in the art's understanding, structural principle of the present utility model is described in further detail below in conjunction with specific embodiment and accompanying drawing:
As shown in Figure 1, disclosed the system principle block diagram that the utility model is used for the optical receiving-transmitting module test circuit board of passive optical network PON.It comprises eight 2 * 10 optical transceiver module SFF electrical connection interface J0, J1, J2, J3, J4, J5, J6, J7, high frequency difference frequency sub-signal input SMA interface TX+, TX-, high frequency difference frequency sub-signal output SMA interface RX+, RX-, two 8 * 1 multipath high-speed electric switch chip U2, U3, microprocessor controller MCU, usb communication interface J8 and modular optical switch S 1, the PON optical transceiver module light input/output port of pegging graft on the described electrical connection interface is connected with modular optical switch S 1, the high frequency difference frequency sub-signal lead-out terminal of electrical connection interface is connected with multipath high-speed electric switch chip U2, the high frequency difference frequency sub-signal input terminal of electrical connection interface is connected with multipath high-speed electric switch chip U3, multipath high-speed electric switch chip U2, U3 is connected with microprocessor controller MCU respectively, multipath high-speed electric switch chip U2 and high frequency difference frequency sub-signal output SMA interface RX+, RX-connects, multipath high-speed electric switch chip U3 and high frequency difference frequency sub-signal input SMA interface TX+, TX-connects, and microprocessor controller MCU is connected with usb communication interface J8.
Described microprocessor controller MCU is connected with high frequency difference frequency sub-signal input SMA interface TX current detection module with high frequency difference frequency sub-signal input SMA interface RX current detection module respectively.
The optical receiving-transmitting module test circuit board that the utility model is used for passive optical network PON is connected respectively with computer PC main frame, programmable power supply able to programme, oscilloscope, Bit Error Rate Analyzer, and wherein the input of the high frequency difference frequency sub-signal on circuit board SMA interface TX+, TX-are connected with Bit Error Rate Analyzer by cable with high frequency difference frequency sub-signal output SMA interface RX+, RX-; DC power supply input interface 1 on the circuit board, DC power supply input interface 2 are respectively by power line and programmable power supply able to programme; Usb communication interface J8 on the circuit board is connected with computer PC by the USB connecting line; Modular optical switch on the circuit board is connected with oscilloscope by single-fiber-optic two-way wavelength division multiplexing device WDM.
Described computer PC main frame, programmable power supply able to programme, oscilloscope, Bit Error Rate Analyzer are respectively arranged with the GPIB control card, and the GPIB control card on the computer PC main frame is connected with GPIB control card on programmable power supply able to programme, oscilloscope, the Bit Error Rate Analyzer by the GPIB cable respectively.
It is C8051F340 that microprocessor controller MCU U1 described in the utility model can select model for use, and the model that two 8 * 1 multipath high-speed electric switch chip U2, U3 select for use is VSC3208, and the model of selecting for use of 16 current monitoring chips is MAX4070.
Wherein, optical transceiver module SFF electrical connection interface J0, J1, J2, J3, J4, J5, J6 and J7, eight tested PON optical transceiver modules 0 are used to peg graft, PON optical transceiver module 1, PON optical transceiver module 2, PON optical transceiver module 3, PON optical transceiver module 4, PON optical transceiver module 5, PON optical transceiver module 6, PON optical transceiver module 7 has a pair of high frequency difference frequency sub-signal input terminal TX+ on each interface, TX-, a pair of high frequency difference frequency sub-signal lead-out terminal RX+, RX-, module connection status detection terminal MOD_ABS, the transmitting terminal power supply terminal, transmitting terminal faulty indication terminal TX_Fault, terminal TX_Disable is forbidden in transmitting terminal output, the receiving terminal power supply terminal, Received Loss Of Signal monitoring terminal RX_LOS, I2C serial communication terminal.
Wherein, one 1 * 8 modular optical switch S 1, eight road ports of optical switch are respectively applied for eight tested PON optical transceiver module tail optical fiber SC joints, and the single port of optical switch is used for the fine bidirectional wavelength division multiplexing device of order, realizes that the light end-grain cutting between eight PON optical transceiver modules is changed.
Wherein, 16 current monitoring chip MAX4070, be connected in series a sampling resistor between the transmitting terminal power supply terminal of every pair of SFF 2 * 10 electrical connection interfaces and the DC power supply, each sampling resistor two ends connects the in-phase input end and the inverting input of a current monitoring chip respectively, is used for monitoring the electric current of the PON module transmitting terminal of surveying; Also be connected in series a sampling resistor between the receiving terminal power supply terminal of every pair of SFF 2 * 10 electrical connection interfaces and the DC power supply, each sampling resistor two ends connects the in-phase input end and the inverting input of a current monitoring chip respectively, is used for monitoring the electric current of the PON module receiving terminal of surveying.
Wherein, a microprocessor controller MCU U1, A/D conversion input terminal is connected to the output of 16 current monitoring chips respectively, the serial communication terminal is connected to the serial communication terminal of two 8 * 1 multipath high-speed electric switch chip U2 and U3 and one 1 * 8 modular optical switch S 1 respectively, and the usb communication terminal is connected to usb communication interface J8.
Wherein, a pair of high frequency difference frequency sub-signal input SMA interface TX+, TX-, this interface is connected with a pair of high speed input terminal of one 8 * 1 multipath high-speed electric switch chip U3, and the input electrical signal of transmitting terminal is provided for the PON optical transceiver module by the high speed electric switch.
Wherein, a pair of high frequency difference frequency sub-signal output SMA interface RX+, RX-, this interface is connected with a pair of high-speed output end of another 8 * 1 multipath high-speed electric switch chip U2, and the signal of telecommunication that the light signal that receives for PON optical transceiver module receiving terminal by the high speed electric switch changes into provides output interface.
Wherein, two 8 * 1 multipath high-speed electric switch chip U2 and U3, the a pair of high-speed-differential lead-out terminal of one of them 8 * 1 multipath high-speed electric switch chip U2 is connected to the high frequency difference frequency sub-signal lead-out terminal that a pair of high frequency difference frequency sub-signal output SMA interface RX+, RX-, eight pairs of high-speed-differential input terminals are connected to described eight PON electrical connection interfaces respectively, the switching when realizing test receiving terminal parameter between the disparate modules; The a pair of high-speed-differential input terminal of another 8 * 1 multipath high-speed electric switch chip U3 is connected to the high frequency difference frequency sub-signal input terminal that a pair of high frequency difference frequency sub-signal input SMA interface TX+, TX-, eight pairs of high-speed-differential lead-out terminals are connected to described eight PON electrical connection interfaces respectively, switching when realizing test transmitting terminal parameter between the disparate modules, the I2C serial communication terminal of two high speed electric switches is connected to the I2C serial communication terminal of MCU controller U1.
Wherein, a usb communication interface J8 is connected to the USB terminal of MCU controller U1, is used to realize the communication between testing circuit board and the PC main frame.
Operation principle of the present utility model: eight road PON optical receiving-transmitting module test systems of connecting band optical switch, high-speed-differential input interface TX+ with test board, TX-and high-speed-differential output interface RX+, RX-is connected to the Data Out+ of Bit Error Rate Analyzer respectively with coaxial cable, Data Out-and Data In+, Data In-interface, the usb communication interface of test board links to each other with the PC main frame by the USB connecting line, after checking that the connection of whole test system circuit is entirely true, at eight couples of SFF, 2 * 10 electrical connection interface J0, J1, J2, J3, J4, J5, J6 and J7 plug tested PON optical transceiver module 0 respectively, PON optical transceiver module 1, PON optical transceiver module 2, PON optical transceiver module 3, PON optical transceiver module 4, PON optical transceiver module 5, PON optical transceiver module 6, PON optical transceiver module 7, the tail optical fiber SC joint of each PON optical transceiver module is connected on eight road ports of 1 * 8 modular optical switch S 1 respectively, the single port of 1 * 8 modular optical switch S 1 is connected to single-fiber-optic two-way wavelength division multiplexing device WDM, the two-way light of telling is connected to light source and oscillographic light input signal interface respectively, circuit board powers on, the PC main frame sends instruction, pass to MCU controller U1 by usb communication interface J8, by two high speed electric switch chip U2 of MCU controller U1 control and U3 and a modular optical switch S 1, determine the channel selecting of speed-sensitive switch, realize the switching between the different tested modules.After the speed-sensitive switch passage is selected, selected PON optical transceiver module transmitting terminal electric current and arrival current can be respectively obtained by the transmitting terminal current monitoring chip of correspondence and arrival current chip monitoring, pass to MCU controller U1, after the processing of MCU controller, be sent to the PC main frame by the usb communication interface, realize the current monitoring function; And transmitting terminal fault indication signal TX_Fault, the burst BEN of tested PON optical transceiver module, received signal monitor signal SD receive the I/O mouth of MCU controller U1 by terminal corresponding on SFF 2 * 10 electrical connection interfaces, be sent to the PC main frame by the usb communication interface again, thereby realized using the function of eight PON optical transceiver modules of a cover test system and test.
Foregoing is preferred embodiment of the present utility model only, is not to be used to limit embodiment of the present utility model, and those skilled in the art are according to design of the present utility model, and appropriate adaptation of having done or modification all should be within protection ranges of the present utility model.

Claims (5)

1. optical receiving-transmitting module test circuit board that is used for passive optical network PON, it is characterized in that: described testing circuit board comprises several optical transceiver modules SFF electrical connection interface, high frequency difference frequency sub-signal input SMA interface TX+, TX-, high frequency difference frequency sub-signal output SMA interface RX+, RX-, multipath high-speed electric switch chip U2, U3, microprocessor controller MCU, usb communication interface J8 and modular optical switch S 1, the PON optical transceiver module light input/output port of pegging graft on the described electrical connection interface is connected with modular optical switch S 1, the high frequency difference frequency sub-signal lead-out terminal of electrical connection interface is connected with multipath high-speed electric switch chip U2, the high frequency difference frequency sub-signal input terminal of electrical connection interface is connected with multipath high-speed electric switch chip U3, multipath high-speed electric switch chip U2, U3 is connected with microprocessor controller MCU respectively, multipath high-speed electric switch chip U2 and high frequency difference frequency sub-signal output SMA interface RX+, RX-connects, multipath high-speed electric switch chip U3 and high frequency difference frequency sub-signal input SMA interface TX+, TX-connects, and microprocessor controller MCU is connected with usb communication interface J8.
2. testing circuit board according to claim 1 is characterized in that: described electrical connection interface is 2 * 10 optical transceiver module SFF electrical connection interfaces; Described multipath high-speed electric switch chip U2, U3 are 8 * 1 multipath high-speed electric switch chips.
3. testing circuit board according to claim 1 and 2 is characterized in that: described electrical connection interface is eight, is respectively electrical connection interface J0, J1, J2, J3, J4, J5, J6, J7.
4. testing circuit board according to claim 3, it is characterized in that: between the transmitting terminal power supply terminal of each electrical connection interface and DC power supply, be connected in series a sampling resistor, each sampling resistor two ends connects the in-phase input end and the inverting input of a current monitoring chip respectively, constitutes transmitting terminal current monitoring module; Also be connected in series a sampling resistor between the receiving terminal power supply terminal of each PON electrical connection interface and the DC power supply, each sampling resistor two ends connects the in-phase input end and the inverting input of a current monitoring chip respectively, constitutes the arrival current monitoring modular.
5. testing circuit board according to claim 1 is characterized in that: described microprocessor controller MCU is connected with high frequency difference frequency sub-signal input SMA interface TX current detection module with high frequency difference frequency sub-signal input SMA interface RX current detection module respectively.
CN2010201781566U 2010-04-26 2010-04-26 Test circuit board for PON optical transceiver module Expired - Fee Related CN201742409U (en)

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101902272A (en) * 2010-07-07 2010-12-01 东莞市铭普实业有限公司 Optical transceiver module SFP tester
CN106597248A (en) * 2015-10-16 2017-04-26 惠州Tcl移动通信有限公司 Spliced plate detection device
CN109327256A (en) * 2018-11-22 2019-02-12 成都网动光电子技术股份有限公司 Optical module the high and low temperature test system based on photoswitch control
CN111123447A (en) * 2018-10-30 2020-05-08 富士通光器件株式会社 Optical transceiver, optical transceiver module using the same, and method for testing optical transceiver

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101902272A (en) * 2010-07-07 2010-12-01 东莞市铭普实业有限公司 Optical transceiver module SFP tester
CN106597248A (en) * 2015-10-16 2017-04-26 惠州Tcl移动通信有限公司 Spliced plate detection device
CN106597248B (en) * 2015-10-16 2019-11-29 惠州Tcl移动通信有限公司 A kind of jigsaw detection device
CN111123447A (en) * 2018-10-30 2020-05-08 富士通光器件株式会社 Optical transceiver, optical transceiver module using the same, and method for testing optical transceiver
CN111123447B (en) * 2018-10-30 2021-08-13 富士通光器件株式会社 Optical transceiver, optical transceiver module using the same, and method for testing optical transceiver
CN109327256A (en) * 2018-11-22 2019-02-12 成都网动光电子技术股份有限公司 Optical module the high and low temperature test system based on photoswitch control

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Owner name: DONGGUAN MENTECH OPTICAL + MAGNETIC CO., LTD.

Free format text: FORMER NAME: DONGGUAN MENTECH INDUSTRIAL CO., LTD.

CP01 Change in the name or title of a patent holder

Address after: 523000 Guangdong Province, Dongguan City Shek Pai Zhenmiao edge Shajing Village Road nine

Patentee after: Dongguan Mentech Optical & Magnetic Co., Ltd.

Address before: 523000 Guangdong Province, Dongguan City Shek Pai Zhenmiao edge Shajing Village Road nine

Patentee before: Dongguan Mentech Electronic Co., Ltd.

CF01 Termination of patent right due to non-payment of annual fee
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Granted publication date: 20110209

Termination date: 20190426