CN201704425U - Gold plating bath for printed circuit boards - Google Patents
Gold plating bath for printed circuit boards Download PDFInfo
- Publication number
- CN201704425U CN201704425U CN2010202027114U CN201020202711U CN201704425U CN 201704425 U CN201704425 U CN 201704425U CN 2010202027114 U CN2010202027114 U CN 2010202027114U CN 201020202711 U CN201020202711 U CN 201020202711U CN 201704425 U CN201704425 U CN 201704425U
- Authority
- CN
- China
- Prior art keywords
- printed circuit
- circuit board
- circuit boards
- gold plating
- cell body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model relates to a gold plating bath for printed circuit boards. Anode plates are arranged on both sides of a bath body, a cathode rod is arranged on the bath body, and baffles are arranged on both sides of the bottom of the bath body, and provided with slots. Since the utility model adopts the structure, when printed circuit boards are plated with gold, the baffles can effectively prevent the printed circuit board from touching the anode plates, thus ensuring plating reaction, and thereby the gold plating quality of the printed circuit boards is ensured.
Description
Technical field
The utility model relates to the gold-plated plating tank of a kind of plating tank, particularly a kind of used for printed circuit board.
Background technology
The anode of the gold-plated plating tank of existing used for printed circuit board is generally the ruthenium-iridium-tantalum net, and the ruthenium-iridium-tantalum net is located at the mid-way of plating tank two sides.Cathode rod is to make with stainless steel tube, cathode rod be positioned at cell body directly over, exceed the about 20cm of cell body.Hanger is provided with hook, printed circuit board is when electrogilding, hook on the hanger hangs over printed circuit board on the cathode rod, if the printed electronic circuit board size is bigger, printed circuit board is easy to generate swing and touches the ruthenium-iridium-tantalum net in plating tank, cause short circuit, influence the carrying out of electroplating reaction, had a strong impact on the quality of printed electronic circuit board electroplating.
Summary of the invention
The purpose of this utility model just provides and a kind ofly can prevent effectively that printed circuit board in the electrogilding process from running into the gold-plated plating tank of positive plate.
The utility model can be realized in the following way: the cell body two sides are provided with positive plate, and cathode rod is located on the cell body, and described cell body two bottom sides face is provided with baffle plate, and baffle plate is provided with slotted eye.
The utility model is owing to adopt said structure, and printed circuit board is when electrogilding, and baffle plate can prevent effectively that printed circuit board from touching positive plate, has guaranteed electroplating reaction, thereby has guaranteed the electrogilding quality of printed circuit board.
Description of drawings
Fig. 1 is a structural representation of the present utility model.
In the drawings: cell body 1, positive plate 2, baffle plate 3, slotted eye 4, cathode rod 5, hanger 6, printed circuit board 7.
Embodiment
Below in conjunction with embodiment, the utility model will be further described, but it is not represented as unique embodiment of the present utility model.
Please read Fig. 1, cell body 1 two sides are equipped with positive plate 2, and positive plate can be ruthenium-iridium-tantalum net, stainless steel plate or platinum net etc., cathode rod 5 is fixed on the cell body 1 by plastic stent, and cathode rod 5 exceeds the about 20cm of cell body, and cell body 1 two bottom sides face is fixed with baffle plate 3, be drilled with many slotted eyes 4 on the baffle plate 3
When the utility model is used for printed circuit board 7 electrogildings, the lower end of printed circuit board 7 is clipped in the bottom of hanger 6, the hanger 6 that has hook hangs on the cathode rod 5, because the height of baffle plate 3 is higher than the bottom of hanger 6, make printed circuit board 7 can't touch positive plate 2 owing to stopping of baffle plate 3 like this, avoid being short-circuited, be drilled with many slotted eyes 4 on the baffle plate 3, helping electroplate liquid evenly flows, guaranteed the useful area of positive plate, help electroplating reaction, thereby guaranteed the electrogilding quality of printed circuit board.
Claims (1)
1. the gold-plated plating tank of a used for printed circuit board, cell body (1) two sides are provided with positive plate (2), and cathode rod (5) is located on the cell body (1), it is characterized in that cell body (1) two bottom sides face is provided with baffle plate (3), and baffle plate (3) is provided with slotted eye (4).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010202027114U CN201704425U (en) | 2010-05-19 | 2010-05-19 | Gold plating bath for printed circuit boards |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010202027114U CN201704425U (en) | 2010-05-19 | 2010-05-19 | Gold plating bath for printed circuit boards |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201704425U true CN201704425U (en) | 2011-01-12 |
Family
ID=43441579
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010202027114U Expired - Fee Related CN201704425U (en) | 2010-05-19 | 2010-05-19 | Gold plating bath for printed circuit boards |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201704425U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105063709A (en) * | 2015-09-18 | 2015-11-18 | 安捷利电子科技（苏州）有限公司 | Electroplating device for printed circuit board |
| CN105648506A (en) * | 2014-11-27 | 2016-06-08 | Ykk株式会社 | Plating apparatus, plating unit and plating porduction line |
-
2010
- 2010-05-19 CN CN2010202027114U patent/CN201704425U/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105648506A (en) * | 2014-11-27 | 2016-06-08 | Ykk株式会社 | Plating apparatus, plating unit and plating porduction line |
| CN105648506B (en) * | 2014-11-27 | 2018-05-15 | Ykk株式会社 | Plating apparatus, plating unit and plating assembly line |
| CN105063709A (en) * | 2015-09-18 | 2015-11-18 | 安捷利电子科技（苏州）有限公司 | Electroplating device for printed circuit board |
| CN105063709B (en) * | 2015-09-18 | 2018-02-23 | 安捷利电子科技（苏州）有限公司 | Use in printed circuit board electroplanting device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee |
Owner name: BOMIN ELECTRONIC CO., LTD. Free format text: FORMER NAME: MEIZHOU BOMIN ELECTRONICS CO., LTD. |
|
| CP01 | Change in the name or title of a patent holder |
Address after: 514768 Guangdong city of Meizhou Province Dongsheng Industrial Park B District Patentee after: Bomin Electronic Co., Ltd. Address before: 514768 Guangdong city of Meizhou Province Dongsheng Industrial Park B District Patentee before: Meizhou Bomin Electronic Co., Ltd. |
|
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110112 Termination date: 20170519 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |