CN201699005U

CN201699005U - Radiating element for chips

Info

Publication number: CN201699005U
Application number: CN2010201695113U
Authority: CN
Inventors: 张育铭
Original assignee: SHIUH CHI PRECISION INDUSTRY Co Ltd
Current assignee: SHIUH CHI PRECISION INDUSTRY Co Ltd
Priority date: 2010-03-24
Filing date: 2010-03-24
Publication date: 2011-01-05
Anticipated expiration: 2020-03-24

Abstract

The utility model relates to the technical field of auxiliary radiating equipment, in particular to a radiating element for chips. The radiating element comprises a heat conducting base plate made of metal material and used for being propped against with a chip; and a plurality of radiating plates integrally extend from the periphery of the heat conducting base plate in the slant upward direction. By utilizing the radiating plates, the area of the radiating surface between the chip and the air is more reasonable and larger, so that the radiating efficiency of the radiating element can be further improved. Besides, the radiating element of the utility model has a very simple structure and is manufactured more easily; and the radiating plates can be manufactured only through simple blanking and bending processes, so that the production efficiency of products is improved, and the cost is reduced.

Description

The chip heat dissipation element

Technical field

The utility model relates to heat radiation auxiliary equipment art, refers in particular to a kind of simple in structure and have a chip heat dissipation element of preferable area of dissipation.

Background technology

Current, integrated circuit (IC) chip is widely used in the various electronic equipments, continuous development and progress along with electronic equipment, the function of electronic equipment is also constantly strengthening and is optimizing, therefore the speed and the efficient that require chip to carry out and calculate need more and more fast, to produce corresponding heat also higher for chip thus, if failing in time the heat that chip produced to be loose rapidly removes, then will have influence on the operation stability and the fail safe of electronic equipment.Therefore, for solving the high temperature heat dissipation problem that chip produced, at present, have multiple heat abstractor on the market and realize, in these heat abstractors, the heat dissipation element that is used for direct dissipate heat is one of important components wherein.Utilize heat dissipation element and chip to carry out contact heat conduction, and then the heat that chip produced can be diffused in the atmosphere as quickly as possible.According to radiator structure and radiating principle thereof, the radiating efficiency system of heat dissipation element is determined by two factors, be the coefficient of heat conduction and surperficial cross-ventilation speed thereof, wherein the coefficient of heat conduction is by the material decision of heat dissipation element, and its surperficial cross-ventilation speed is then decided according to the surface area of heat dissipation element.Yet the weak point of existing heat dissipation element is two aspects, and first complex structure, processing difficulties are unfavorable for producing in batches and promoting; Next is that the structural design of heat dissipation element is unreasonable, and the contact surface of heat dissipation element and air is long-pending still less, and then its radiating efficiency is restricted.

The utility model content

The utility model is at the disappearance of prior art existence, and its main purpose provides a kind of chip heat dissipation element, and it utilizes simple and easy structural design, makes the area of dissipation maximization of heat dissipation element, and then obtains preferable radiating efficiency.

For achieving the above object, the utility model adopts following technical scheme:

A kind of chip heat dissipation element includes one and is used for the heat-conducting substrate inconsistent with chip by what the heat-transfer metal material was made, in the periphery of this heat-conducting substrate obliquely one be extended with a plurality of fin.

As a kind of preferred version, described fin is two sheets, their distributions that is mutually symmetrical.

As a kind of preferred version, described fin is made up of a plurality of small pieces of arranging that closely stagger.

As a kind of preferred version, described fin is four sheets, their two one group distributions that is mutually symmetrical.

As a kind of preferred version, the center of described heat-conducting substrate is provided with the district that steps down that upwards is recessed to form.

As a kind of preferred version, be provided with louvre in the described district that steps down, this louvre is square opening, circular port or slotted eye.

As a kind of preferred version, described heat dissipation element is provided with a plurality of location holes, further is fitted with locking device corresponding to each location hole, locking device includes a pin and spring, the upper end of pin is an ailhead, and the lower end of pin is the elasticity button, and the elasticity button passes the location hole on the heat-conducting substrate; This spring housing is loaded on the pin, and an end of spring is butted on the ailhead, and the other end is butted on the upper surface that is pressed on heat-conducting substrate.

As a kind of preferred version, be densely covered with a plurality of inside or outside convex closures on the described fin.

As a kind of preferred version, be densely covered with a plurality of pricking pieces on the described fin.

As a kind of preferred version, described fin is a waveform.

The utility model compared with prior art has tangible advantage and beneficial effect, particularly, as shown from the above technical solution, it mainly lies in and sets out the extended fin of oblique one on the heat-conducting substrate, utilize this fin with more reasonable Yu the bigger area of dissipation between acquisition and the air, and then promote and improve the heat dissipation of heat dissipation element.In addition, the heat dissipation element structure of the utility model extremely simply is easier to make, and fin can be finished making by simple blanking and bending technique, helps improving the production efficiency of product, reduces cost.

For more clearly setting forth architectural feature of the present utility model and effect, come the utility model is elaborated below in conjunction with accompanying drawing and specific embodiment:

Description of drawings

Fig. 1 a is the stereochemical structure diagrammatic sketch of first kind of embodiment of the utility model;

Fig. 1 b is another stereochemical structure diagrammatic sketch of first kind of embodiment of the utility model;

Fig. 2 a is the stereochemical structure diagrammatic sketch of second kind of embodiment of the utility model;

Fig. 2 b is another stereochemical structure diagrammatic sketch of second kind of embodiment of the utility model;

Fig. 3 a is the stereochemical structure diagrammatic sketch of the third embodiment of the utility model;

Fig. 3 b is another stereochemical structure diagrammatic sketch of the third embodiment of the utility model;

Fig. 4 a is the stereochemical structure diagrammatic sketch of the 4th kind of embodiment of the utility model;

Fig. 4 b is another stereochemical structure diagrammatic sketch of the 4th kind of embodiment of the utility model;

Fig. 4 c is the another stereochemical structure diagrammatic sketch of the 4th kind of embodiment of the utility model;

Fig. 4 d is the stereochemical structure diagrammatic sketch again of the 4th kind of embodiment of the utility model;

Fig. 5 a is the assembling stereochemical structure diagrammatic sketch of the 5th kind of embodiment of the utility model;

Fig. 5 b is another visual angle assembling stereochemical structure diagrammatic sketch of the 5th kind of embodiment of the utility model;

Fig. 5 c is the exploded perspective configuration diagram of the 5th kind of embodiment of the utility model;

The accompanying drawing identifier declaration:

10, heat dissipation element 121, convex closure

11, heat-conducting substrate 122, pricking piece

111, step down the district 20, locking device

112, louvre 21, pin

123, location hole 22, spring

12, fin

Embodiment:

At first, please refer to shown in Fig. 1 a and Fig. 2 a, it has demonstrated the concrete structure of heat dissipation element of first kind of embodiment of the utility model, this heat dissipation element 10 includes a heat-conducting substrate 11 of being made by the heat-transfer metal material, this heat-conducting substrate 10 in the present embodiment is square, certainly it is not limited to square shown in the accompanying drawing, and it also can be designed to various geometries such as circle, ellipse, rhombus, does not exceed with it.In the both sides of this heat-conducting substrate 11 periphery respectively obliquely outwards one be extended with the fin 12 of two large stretch of types, this two fin 12 is mutually symmetrical is distributed in the both sides of heat-conducting substrate 11.Fin 12 is the best with the angle of heat-conducting substrate 11 with 45 degree, and its angle also can be done appropriateness adjustment according to the needs of product real space and structure certainly, does not exceed with it.

And a plurality of outside convex closures 121 that also gather on the fin 12 in the present embodiment utilize this convex closure 121 can increase the area of dissipation of fin 12.

In addition, the shape of this heat-radiating substrate 11 also can change according to the shape of chip, for example shown in Fig. 1 b, for the chip of the square projection of part, the center of heat-radiating substrate 11 also can be provided with a district 111 that steps down that upwards is recessed to form, and a plurality of louvres 112 that on this steps down district 111, gather, the shape of louvre 112 can be square opening, circular port or slotted eye etc. and diversified combination thereof.

During use, this heat-conducting substrate 11 can directly or utilize heat-conducting glue and chip to conflict, and the heat transferred that chip is produced when the work is utilized fin 12 to transmit then and diffused in the air to heat-conducting substrate 11, realizes quick heat radiating.

Then, please refer to shown in Fig. 2 a and Fig. 2 b, it demonstrates the concrete structure of second kind of embodiment of the utility model, the difference of present embodiment and aforementioned first kind of embodiment is, fin 12 in the present embodiment is four sheets, and they are one group with two and are mutually symmetrical and are distributed in the periphery of heat-conducting substrate 11.Wherein on the fin 12 of one group of symmetry except that being provided with as the convex closure 121 among first kind of embodiment, also further be provided with the pricking piece 122 that expands outwardly, and it is (certain to be provided with convex closure 121 in this pricking piece 122, may not be provided with convex closure on the pricking piece), utilize this pricking piece 122 in conjunction with the structure of convex closure 121 area of dissipation with further increasing fin 12.

Then, please refer to shown in Fig. 3 a and Fig. 3 b, it demonstrates the concrete structure of the third embodiment of the utility model, the difference of present embodiment and aforementioned second kind of embodiment is, fin 12 in the present embodiment be set to wavy, this wave system is combined to form by the horizontal tongue and groove that vertically joins continuously, utilizes this wave structure also to play the effect of the area of dissipation that increases fin 12 equally.

Then, please refer to shown in Fig. 4 a to Fig. 4 d, it demonstrates the concrete structure of the 4th kind of embodiment of the utility model, the difference of present embodiment and previous embodiment is: its fin 12 has carried out bigger change, this fin 12 is to be made up of a plurality of small pieces, and these small pieces closely stagger and arrange; And, further on the fin 12 of these small pieces, be densely covered with aforementioned convex closure 121 or pricking piece 122 structures with spline structure.Comparatively speaking, fin 12 structures of present embodiment have bigger area of dissipation than the fin in the previous embodiment, can obtain better radiating effect.

At last, please refer to shown in Fig. 5 a to Fig. 5 c, it demonstrates the concrete structure of the 5th kind of embodiment of the utility model, and the difference of present embodiment and aforementioned each embodiment is, for making things convenient for the dismounting of heat dissipation element better, it also can further dispose locking device 20.Present embodiment is provided with location hole 113 respectively in the place, position, four angles of the heat-conducting substrate 11 of heat dissipation element 10, and this locking device 20 is provided with corresponding to each location hole 113.Particularly, locking device 20 includes a pin 21 and spring 22, pin 21 preferably is to be made by plastic material, the upper end of pin 21 is an ailhead, the lower end of pin 21 is the elasticity button, the elasticity button passes the location hole 113 on the heat-conducting substrate 11, and the overhead kick that utilizes elasticity to buckle is buckled in the parts (these parts are not shown in figures, for example can be circuit boards etc.) that are used to install heat dissipation element; This spring 22 is set on the pin 21, and an end of spring is butted on the ailhead, and the other end is butted on the upper surface that is pressed on heat-conducting substrate, and the weak property thrust of heat-conducting substrate 11 is provided, and then heat dissipation element 10 lock onto mutually send on the parts.

In sum, design focal point of the present utility model is, it mainly lies in and sets out the extended fin of oblique one on the heat-conducting substrate, utilizes this fin with more reasonable Yu the bigger area of dissipation between acquisition and the air, and then promotes and improve the heat dissipation of heat dissipation element.In addition, the heat dissipation element structure of the utility model extremely simply is easier to make, and fin can be finished making by simple blanking and bending technique, helps improving the production efficiency of product, reduces cost.

The above, it only is preferred embodiment of the present utility model, be not that technical scope of the present utility model is imposed any restrictions, so every foundation technical spirit of the present utility model all still belongs in the scope of technical solutions of the utility model any trickle modification, equivalent variations and modification that above embodiment did.

Claims

1. chip heat dissipation element is characterized in that: include one and be used for the heat-conducting substrate inconsistent with chip by what the heat-transfer metal material was made, in the periphery of this heat-conducting substrate obliquely one be extended with a plurality of fin.

2. chip heat dissipation element according to claim 1 is characterized in that: described fin is two sheets, their distributions that is mutually symmetrical.

3. chip heat dissipation element according to claim 1 is characterized in that: described fin is made up of a plurality of small pieces of arranging that closely stagger.

4. chip heat dissipation element according to claim 1 is characterized in that: described fin is four sheets, their two one group distributions that is mutually symmetrical.

5. chip heat dissipation element according to claim 1 is characterized in that: the center of described heat-conducting substrate is provided with the district that steps down that upwards is recessed to form.

6. chip heat dissipation element according to claim 5 is characterized in that: be provided with louvre in the described district that steps down, this louvre is square opening, circular port or slotted eye.

7. chip heat dissipation element according to claim 1, it is characterized in that: described heat dissipation element is provided with a plurality of location holes, further be fitted with locking device corresponding to each location hole, locking device includes a pin and spring, the upper end of pin is an ailhead, the lower end of pin is the elasticity button, and the elasticity button passes the location hole on the heat-conducting substrate; This spring housing is loaded on the pin, and an end of spring is butted on the ailhead, and the other end is butted on the upper surface that is pressed on heat-conducting substrate.

8. according to any one described chip heat dissipation element in the claim 1 to 7, it is characterized in that: be densely covered with a plurality of inside or outside convex closures on the described fin.

9. according to any one described chip heat dissipation element in the claim 1 to 7, it is characterized in that: be densely covered with a plurality of pricking pieces on the described fin.

10. according to any one described chip heat dissipation element in the claim 1 to 7, it is characterized in that: described fin is a waveform.