CN201697513U - Cylindrical evaporation cavity special for semiconductor electronic refrigerating device - Google Patents
Cylindrical evaporation cavity special for semiconductor electronic refrigerating device Download PDFInfo
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- CN201697513U CN201697513U CN2010202430976U CN201020243097U CN201697513U CN 201697513 U CN201697513 U CN 201697513U CN 2010202430976 U CN2010202430976 U CN 2010202430976U CN 201020243097 U CN201020243097 U CN 201020243097U CN 201697513 U CN201697513 U CN 201697513U
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- cylindrical
- evaporation cavity
- cavity
- evaporation
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Abstract
The utility model belongs to the field of semiconductor electronic refrigeration and heat transmission, in particular to a cylindrical evaporation cavity matched with a semiconductor electronic refrigerating device for use. The evaporation cavity is in a hollow structure communicated with two ends of a heat pipe, and comprises a cylindrical body, convex edges that are integrally molded with the opening edge of the cylindrical body and distributed along the radial direction of the opening edge of the cylindrical body and a metal end cover encapsulated on the opening surface of the cylindrical body; and the evaporation cavity is made of steel and is wholly in a hollow cylindrical structure. The cylindrical evaporating cavity solves the problems of large heat resistance, complex production technology and low rate of finished products in the prior art, and has the advantages of small heat resistance, simple production technology, high rate of finished products and good heat exchanging effect and the like.
Description
Technical field
The utility model belongs to semiconductor electronic refrigeration and field of heat transfer, is meant a kind of especially and the matching used cylindrical evaporation chamber of semiconductor electronic freezing device.
Background technology
Heat-pipe radiator is mainly used in the energy release in semiconductor cooling device hot junction at present, its function is when semiconductor cooling device has electric current to pass through, the device hot junction can produce very high heat flow density in moment, the energy that discharges then relies on the evaporation cavity of heat-pipe radiator to absorb energy, liquid refrigerant in the evaporation cavity is vaporized rapidly, working medium after the vaporization is through airtight circulation line, heat is discharged in the ambient air, reach semiconductor cooler required requirement that releases energy in process of refrigerastion, and the design of heat-pipe radiator evaporation cavity and manufacture craft are diversified, conclude two types of main branches, a kind of is direct tube chamber formula, the design size of its evaporation cavity and the caliber size of heat dissipation pipeline are complementary, the steam flow flow direction is identical, the design of another kind of evaporation cavity then is through four mechanical stretchings sheet metal, make it form the trapezoidal square box shape of a kind of hollow, again through the large tracts of land welding, make trapezoidal square box shape evaporation cavity, and this evaporation cavity of two types, on the structure and manufacturing process of its design, all exist some defectives; Direct tube chamber formula evaporation cavity, though advantage such as to have that solder joint is few, steam flow flows unobstructed, heat exchange effect makes its heat exchange quantity not sufficient owing to be subjected to the restriction of caliber, radiating efficiency is low; And the structural design of the trapezoidal square box shape evaporation cavity of hollow, though overcome the defective of the heat exchange quantity not sufficient of direct tube chamber formula evaporation cavity, but owing to adopt repeatedly mechanical stretching, it is very complicated to exist manufacturing process, the defective that production efficiency is low and percent defective is high, unstable product quality etc. is difficult to overcome.
The utility model content
The purpose of this utility model is to provide a kind of cylindrical evaporation chamber specially used for semiconductor electronic freezing device that makes things convenient for moulding to make.
Overall technology design of the present utility model is:
Cylindrical evaporation chamber specially used for semiconductor electronic freezing device, evaporation cavity are the hollow structure that is communicated with the heat pipe two ends, comprise cylindrical shell, with cartridge openings edge integrated molding and along its radially-arranged convex edge, and the metal end that is packaged in the cartridge openings surface; Described evaporation cavity is a steel and the whole cavity structure that is hollow cylindrical.
Concrete structural design of the present utility model also has:
For further improving the heat exchange efficiency of evaporation cavity, prolong the service life of evaporation cavity, the cylinder inner surface matched in clearance of described evaporation cavity has mesh-like imbibition core.
Can it is evident that because the siphon effect that capillarity caused helps the heat exchange of the interior working medium of evaporation cavity by evaporation cavity chamber wall surface, described netted imbibition core adopts the silk screen with capillary microgap structure to make in order further to improve.
Be communicated with the installation of heat pipe for ease of evaporation cavity, embodiment preferred is, is fixedly connected with output channel on the metal end, and the heat pipe two ends are through output channel and evaporation cavity internal communication.
The obtained technological progress of the utility model is:
1, because the evaporation cavity of heat-pipe radiator adopts the structural design of hollow cylindrical, what make vaporization back working medium does not mobilely have a dead angle, and vaporization back working medium mobile unobstructed is so thermal resistance obviously reduces.
2, because the hollow cylindrical cylindrical shell of evaporation cavity can adopt disposable punching stretch forming, the production technology of cylindrical shell and evaporation cavity is significantly simplified, production efficiency is doubled and redoubled, and percent defective significantly reduces.
3, the structural design of the mesh-like imbibition core of evaporation cavity inwall, make heat-transfer area remove because of the discontented dry combustion method phenomenon that causes of liquid refrigerant filling, not only effectively improved the service life of device, heat exchange efficiency has improved 30 percent than existing naked heat exchange efficiency.
Description of drawings
Fig. 1 is an overall structure schematic diagram of the present utility model.
Fig. 2 is that the A-A of Fig. 1 is to view.
Reference numeral in the accompanying drawing is as follows:
1, convex edge 2, cylindrical shell 3, output channel 4, metal end 5, netted imbibition core
The specific embodiment
Do description particularly below in conjunction with the right embodiment of the present utility model of accompanying drawing; be not for qualification of the present utility model; protection domain of the present utility model is as the criterion with the content of claim record; any equivalence techniques means of having done according to the content of the utility model specification record are replaced and are modified neither disengaging protection domain of the present utility model.
The overall structure of present embodiment as shown, wherein evaporation cavity is the hollow structure that is communicated with the heat pipe two ends, comprise cylindrical shell, with cylindrical shell 2 opening edges along integrated molding and along its radially-arranged convex edge 1, and the metal end 4 that is packaged in cylindrical shell 2 open surfaces; Described evaporation cavity is a steel and the whole cavity structure that is hollow cylindrical.
The cylinder inner surface matched in clearance of evaporation cavity has mesh-like imbibition core 5.Netted imbibition core 5 adopts the silk screen with capillary microgap structure to make.
Present embodiment can adopt the high quality carbon steel plate when making be raw material, adopts the method moulding of a punching stretch.
Claims (4)
1. cylindrical evaporation chamber specially used for semiconductor electronic freezing device, evaporation cavity is the hollow structure that is communicated with the heat pipe two ends, comprise cylindrical shell (2), with cylindrical shell (2) opening edge along integrated molding and along its radially-arranged convex edge (1), and the metal end (4) that is packaged in cylindrical shell (2) open surfaces; It is characterized in that described evaporation cavity is a steel and the whole cavity structure that is hollow cylindrical.
2. conductor refrigeration device according to claim 1 is cylindrical evaporation chamber specially used, it is characterized in that cylindrical shell (2) internal surface gaps of described evaporation cavity is combined with mesh-like imbibition core (5).
3. conductor refrigeration device according to claim 2 is cylindrical evaporation chamber specially used, it is characterized in that described netted imbibition core (5) adopts the silk screen with capillary microgap structure to make.
4. conductor refrigeration device according to claim 1 is cylindrical evaporation chamber specially used, it is characterized in that being fixedly connected with on the described metal end (4) output channel (3), and the heat pipe two ends are through output channel (3) and evaporation cavity internal communication.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010202430976U CN201697513U (en) | 2010-07-01 | 2010-07-01 | Cylindrical evaporation cavity special for semiconductor electronic refrigerating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010202430976U CN201697513U (en) | 2010-07-01 | 2010-07-01 | Cylindrical evaporation cavity special for semiconductor electronic refrigerating device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201697513U true CN201697513U (en) | 2011-01-05 |
Family
ID=43398760
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010202430976U Expired - Fee Related CN201697513U (en) | 2010-07-01 | 2010-07-01 | Cylindrical evaporation cavity special for semiconductor electronic refrigerating device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201697513U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101881567A (en) * | 2010-07-01 | 2010-11-10 | 郭琛 | Cylindrical evaporation chamber specially used for semiconductor electronic freezing device and manufacture method thereof |
-
2010
- 2010-07-01 CN CN2010202430976U patent/CN201697513U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101881567A (en) * | 2010-07-01 | 2010-11-10 | 郭琛 | Cylindrical evaporation chamber specially used for semiconductor electronic freezing device and manufacture method thereof |
| CN101881567B (en) * | 2010-07-01 | 2013-03-20 | 郭琛 | Cylindrical evaporation chamber specially used for semiconductor electronic freezing device and manufacture method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110105 Termination date: 20140701 |
|
| EXPY | Termination of patent right or utility model |