CN201685181U - PCB metallographic slice grinding tool - Google Patents
PCB metallographic slice grinding tool Download PDFInfo
- Publication number
- CN201685181U CN201685181U CN2010201661831U CN201020166183U CN201685181U CN 201685181 U CN201685181 U CN 201685181U CN 2010201661831 U CN2010201661831 U CN 2010201661831U CN 201020166183 U CN201020166183 U CN 201020166183U CN 201685181 U CN201685181 U CN 201685181U
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- grinding tool
- pcb
- microsection
- metallographic
- utility
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Abstract
The utility model discloses a PCB metallographic slice grinding tool, including a metal or stone die base which is provided with a plurality of barrel body portions in different models; and the die base is provided with a die bottom with respect to each barrel body portion. The die base of the PCB metallographic slicing grinding tool is made of metal or stone material, thus guaranteeing non-deformation of the die base under the high temperature so as to ensure the flatness of the PCB metallographic slice; and additionally, barrel body portions in different models of the PCB metallographic slice grinding tool are respectively arranged on the same die base and the die bottoms with respect to the barrel body portions in different models are an integral body with a large area, accordingly, it is simple to extract the barrel body portions and is easy to extract the metallographic slice from the grinding tool.
Description
Technical field
The utility model relates to PCB and makes the field, relates in particular to a kind of PCB microsection grinding tool.
Background technology
At present in electron trade and mechanical industries such as circuit board, semiconductors, procuratorial work is carried out in cross section to material or device, generally be by use microsection grinding tool material or device to be cooked the microsection analysis, this kind measuring means is carried out quality control by the scene that is used in research and development in a large number and manufacture and is detected.
See also Fig. 1 to Fig. 3, it is existing a kind of PCB microsection grinding tool, make by hard or soft plastic material, comprise a grinding tool base 10 and the mould bucket 11 that is positioned on the grinding tool base 10, described grinding tool base 10 comprises a jut 101 and is dashed forward along portion 102 by the outwards outstanding sub-fraction that has of the lateral border of jut 101 that the edge of described grinding tool bucket 11 and described dashing forward match along portion 102.
Yet existing P CB microsection grinding tool adopts plastic production, has following shortcoming:
1) grinding tool weak point in service life only is one month, can produce high temperature owing to chemical reaction during microsection manufacture, meeting deformation projections in bottom behind the grinding tool high temperature that common plastics is made, the film tool after the distortion will influence the flatness of PCB microsection, in case the mold bottom distortion can not continue to use;
2),, be difficult for grinding tool base and grinding tool ladle body are separated, and the conference of exerting oneself is broken off with the fingers and thumb grinding tool bad so difficulty is big when getting section after section is solidified because outwards outstanding prominent less of mold bottom along portion 102;
When 3) existing mould uses, behind the liquid curing, jut 102 outers of mold base can pasted residual glue with prominent along portion's 102 diapires, are difficult to cleaning, as not thoroughly cleaning grinding tool bucket 101 is combined closely mutually with grinding tool base 102, not easy to clean and influence work limitation;
4) consider from security standpoint,, very easily hurt hand when firmly breaking off with the fingers and thumb with hand if be difficult to after section is solidified take out, dangerous;
5) existing die size is limited, limiting to some extent in the microsection manufacture at present, can not carry out the microsection of different size.
The utility model content
The technical problem that the utility model mainly solves provides a kind of PCB microsection grinding tool, long service life, and can satisfy the section integrality, and retract the section fairly simple.
For solving the problems of the technologies described above, the technical scheme that the utility model adopts is: a kind of PCB microsection grinding tool is provided, comprise metal or building stones mold base, described mold base is provided with the staving portion of a plurality of models that vary in size, and corresponding described each staving portion is equipped with a mold bottom on the described mold base.
Wherein, offer a plurality of flutings on the described mold base, described staving portion is located in the described fluting.
Wherein, described staving portion is cylindrical.
Wherein, described fluting is rounded.
Wherein, described fluting is square.
Wherein, described metal is an iron.
The beneficial effects of the utility model are: the PCB microsection grinding tool that is different from prior art adopts plastics to make, and service life is short, the easy projection in grinding tool bottom when resin carries out hot setting in the grinding tool, the situation of influence section planarization; The mold base of the utility model PCB microsection grinding tool adopts metal or building stones material to make, can guarantee at high-temperature condition bed die base indeformable, thereby can guarantee the planarization of PCB microsection, and the staving portion of a plurality of different models of the utility model PCB microsection grinding tool is and is positioned on the same mold base, the mold bottom of the staving portion correspondence of a plurality of different models is an integral body, area is big, and the staving portion of choosing is simple, and microsection is lighter taking out from grinding tool.
The mold base of the utility model PCB microsection grinding tool adopts metal or building stones material to make, and the base of grinding tool and staving portion sidewall be not with glued strong with joint efforts, and the cull after resin is heating and curing cleans easily, can increase work efficiency.
Description of drawings
Fig. 1 is the grinding tool understructure schematic diagram of existing PCB microsection grinding tool;
Fig. 2 is the grinding tool barrel structure schematic diagram of existing PCB microsection grinding tool;
Fig. 3 is the structural representation of existing PCB microsection grinding tool;
Fig. 4 is the structural representation of a kind of embodiment of the utility model PCB microsection grinding tool;
Fig. 5 is the structure cutaway view of the PCB microsection grinding tool among Fig. 4;
Fig. 6 is the structural representation of the another kind of embodiment of PCB microsection grinding tool.
The specific embodiment
By describing technology contents of the present utility model, structural feature in detail, realized purpose and effect, give explanation below in conjunction with embodiment and conjunction with figs. are detailed.
See also Fig. 4, Fig. 5, the utility model PCB microsection grinding tool comprises a grinding tool base 20, and described grinding tool base 20 is square.Described grinding tool base 20 is provided with three kinds of staving portions 21 that big ting model is different, and the staving portion 21 of described each not all right model uses corresponding respectively corresponding grinding tool bottom on grinding tool base 20.Three grinding tools bottom of the staving portion 21 of described corresponding three kinds of big ting models of difference all is positioned on the same grinding tool base 20, and is arranged in order in order, and the quantity of described grinding tool base 20 and described staving portion 21 is according to the operating position setting.Described staving portion 21 is cylindrical.In the present embodiment, offer a plurality of flutings 23 on the described grinding tool base 20, the staving portion 21 of described different model is put in the described fluting 23, and described grinding tool bottom is the bottom land wall of described fluting 23, and described fluting 23 is rounded or square.
See also Fig. 6, in another embodiment, described staving portion 21 is placed on the described grinding tool base 20.
The grinding tool base 20 of PCB microsection grinding tool described in the utility model adopts metal or building stones to make, and described grinding tool base 20 adopts CNC milling machine to process, and the actual size of grinding tool base 20 can be adjusted as required.
When doing the PCB microsection, the resin paste that evenly mixes and have a certain viscosity is poured in the utility model PCB microsection grinding tool, under the condition of room temperature or heating, resin paste polymerization in grinding tool hardens into the microsection resin mass, again with behind the resin mass grinding and buffing, make section, on microscope or special equipment, observe the surface condition in cross section.
The utility model PCB microsection grinding tool adopts metal or building stones to make, the long service life that adopt plastic cement to make with respect to prior art service life, and the utility model PCB microsection grinding tool was at least 1 year service life; And the utility model PCB microsection adopts metal such as steel or building stones and makes, can guarantee fully at high-temperature condition bed die base indeformable, thereby can guarantee the planarization of cutting into slices.
The mold bottom of the correspondence of a plurality of staving portion 21 of the utility model PCB microsection grinding tool is an integral body, all be positioned on the described same grinding tool base 20, area is big, and the staving portion of choosing is simple, so when getting section, can very easily the PCB microsection easily be taken off safe ready.
The utility model PCB microsection grinding tool adopts metal or building stones to make, and makes a concerted effort not by force with plastic bonding, can be easier to its cull that is pasting on the side of mold bottom and staving portion after solidifying is washed, and increases work efficiency.
The utility model PCB microsection grinding tool designs aspect size comprehensively, is designed to three kinds of sizes altogether, can satisfy the resin sample and use when a small amount of, uses in the time of satisfying most amount again, can play the effect that material reduces cost of manufacture of saving.
The PCB microsection grinding tool that is different from prior art adopts plastics to make, and service life is short, the easy projection in grinding tool bottom when resin carries out hot setting in the grinding tool, the situation of influence section planarization; The mold base of the utility model PCB microsection grinding tool adopts metal or building stones material to make, can guarantee at high-temperature condition bed die base indeformable, thereby can guarantee the planarization of PCB microsection, and the staving portion of a plurality of different models of the utility model PCB microsection grinding tool is and is positioned on the same mold base, the mold bottom of the staving portion correspondence of a plurality of different models is an integral body, area is big, and the staving portion of choosing is simple, and microsection is lighter taking out from grinding tool.
In sum, the utility model PCB microsection mill long service life, can guarantee at the high-temperature condition bed die indeformable, thereby can guarantee the planarization of microsection.
The above only is embodiment of the present utility model; be not so limit claim of the present utility model; every equivalent structure or equivalent flow process conversion that utilizes the utility model specification and accompanying drawing content to be done; or directly or indirectly be used in other relevant technical fields, all in like manner be included in the scope of patent protection of the present utility model.
Claims (6)
1. a PCB microsection grinding tool is characterized in that, comprises metal or building stones mold base, and described mold base is provided with the staving portion of a plurality of models that vary in size, and corresponding described each staving portion is equipped with a mold bottom on the described mold base.
2. PCB microsection grinding tool according to claim 1 is characterized in that, offers a plurality of flutings on the described mold base, and described staving portion is located in the described fluting.
3. PCB microsection grinding tool according to claim 2 is characterized in that, described staving portion is cylindrical.
4. PCB microsection grinding tool according to claim 2 is characterized in that described fluting is rounded.
5. PCB microsection grinding tool according to claim 2 is characterized in that described fluting is square.
6. PCB microsection grinding tool according to claim 2 is characterized in that described metal is an iron.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010201661831U CN201685181U (en) | 2010-04-15 | 2010-04-15 | PCB metallographic slice grinding tool |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010201661831U CN201685181U (en) | 2010-04-15 | 2010-04-15 | PCB metallographic slice grinding tool |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201685181U true CN201685181U (en) | 2010-12-29 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010201661831U Expired - Fee Related CN201685181U (en) | 2010-04-15 | 2010-04-15 | PCB metallographic slice grinding tool |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201685181U (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102879246A (en) * | 2012-09-28 | 2013-01-16 | 无锡江南计算技术研究所 | Metallographic sample preparation method and metallographic sample mould for packaged chips |
| CN103674633A (en) * | 2012-09-13 | 2014-03-26 | 揖斐电株式会社 | Reusable base board section die |
| CN103792119A (en) * | 2014-01-24 | 2014-05-14 | 清华大学 | Mold for metallographic sample preparation and metallographic sample preparation method |
| CN104309036A (en) * | 2014-08-20 | 2015-01-28 | 黄武 | A resin-saving slicing mould capable of being repeatedly used |
| CN105445074A (en) * | 2014-06-13 | 2016-03-30 | 中芯国际集成电路制造(上海)有限公司 | Polishing sample containing a plurality of wafer samples and preparation method thereof |
-
2010
- 2010-04-15 CN CN2010201661831U patent/CN201685181U/en not_active Expired - Fee Related
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103674633A (en) * | 2012-09-13 | 2014-03-26 | 揖斐电株式会社 | Reusable base board section die |
| CN102879246A (en) * | 2012-09-28 | 2013-01-16 | 无锡江南计算技术研究所 | Metallographic sample preparation method and metallographic sample mould for packaged chips |
| CN103792119A (en) * | 2014-01-24 | 2014-05-14 | 清华大学 | Mold for metallographic sample preparation and metallographic sample preparation method |
| CN105445074A (en) * | 2014-06-13 | 2016-03-30 | 中芯国际集成电路制造(上海)有限公司 | Polishing sample containing a plurality of wafer samples and preparation method thereof |
| CN105445074B (en) * | 2014-06-13 | 2018-06-22 | 中芯国际集成电路制造(上海)有限公司 | Polishing sample and preparation method containing multiple sample wafers |
| CN104309036A (en) * | 2014-08-20 | 2015-01-28 | 黄武 | A resin-saving slicing mould capable of being repeatedly used |
| CN104309036B (en) * | 2014-08-20 | 2016-08-10 | 田东县浙缘农业科技有限公司 | A kind of use repeatly wafer cutting die saving resin |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20101229 Termination date: 20130415 |