CN201681938U - 无基岛多圈脚无源器件封装结构 - Google Patents
无基岛多圈脚无源器件封装结构 Download PDFInfo
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Abstract
本实用新型涉及一种无基岛多圈脚无源器件封装结构,包括引脚(2)、不导电粘结物质(6)、芯片(7)、金属线(8)和有填料塑封料(9),所述引脚(2)设置有多圈,所述引脚(2)正面延伸到后续需装芯片的区域旁边,在所述引脚(2)外围的区域、后续需装芯片的区域以及引脚(2)与引脚(2)之间的区域嵌置有无填料的塑封料(3),所述无填料的塑封料(3)将引脚下部外围、所述引脚(2)正面延伸的背面以及引脚(2)下部与引脚(2)下部连接成一体,在所述后续需装芯片的区域正面通过不导电粘结物质(6)设置有芯片(7),在引脚(2)与引脚2之间跨接有无源器件(10),在所述引脚(2)的上部以及芯片(7)、金属线(8)和无源器件(10)外包封有填料塑封料(9)。本实用新型的有益效果是:塑封体与金属脚的束缚能力大、降低成本,节能减炭以及减少废弃物。
Description
(一)技术领域
本实用新型涉及一种封装结构。属于半导体封装技术领域。
(二)背景技术
传统的封装结构主要有二种:
第一种:
采用金属基板的正面进行化学蚀刻及表面电镀层后,在金属基板的背面贴上一层耐高温的胶膜形成可以进行封装过程的引线框载体(如图3所示)。
第二种:
采用金属基板的正面进行化学蚀刻及表面电镀层后,即完成引线框的制作(如图4所示)。而引线框的背面则在封装过程中再进行背面蚀刻。
而上述的二种引线框在封装过程中存在了以下的不足点:
第一种:
1)此种引线框架因背面必须要贴上一层昂贵可抗高温的胶膜。所以直接增加了高昂的成本。
2)也因为此种引线框架的背面必须要贴上一层可抗高温的胶膜,所以在封装过程中的装片工艺只能使用导电或是不导电的树脂工艺,而完全 不能采用共晶工艺以及软焊料的工艺进行装片,所以可选择的产品种类就有较大的局限性。
3)又因为此种引线框架的背面必须要贴上一层可抗高温的胶膜,而在封装过程中的球焊键合工艺中,因为此可抗高温的胶膜是软性材质,所以造成了球焊键合参数的不稳定,严重的影响了球焊的质量与产品可靠度的稳定性。
4)再因为此种引线框架的背面必须要贴上一层可抗高温的胶膜,而在封装过程中的塑封工艺过程,因为塑封的高压关系很容易造成引线框架与胶膜之间渗入塑封料,而将原本应属金属脚是导电的型态因为渗入了塑封料反而变成了绝缘脚(如图5所示)。
第二种:
此种引线框架结构在金属基板正面进行了半蚀刻工艺,虽然可以解决第一种引线框架的问题,但是因为只在金属基板正面进行了半蚀刻工作,而在塑封过程中塑封料只有包覆住半只脚的高度,所以塑封体与金属脚的束缚能力就变小了,如果塑封体贴片到PCB板上不是很好时,再进行返工重贴,就容易产生掉脚的问题(如图6所示)。
尤其塑封料的种类是采用有填料时候,因为材料在生产过程的环境与后续表面贴装的应力变化关系,会造成金属与塑封料产生垂直型的裂缝,其特性是填料比例越高则越硬越脆越容易产生裂缝。
另外,由于芯片与引脚之间的距离较远,如图7~8所示,金属线的长度较长,金属线成本较高(尤其是昂贵的纯金质的金属线);同样由于金属 线的长度较长,使得芯片的信号输出速度较慢(由其是存储类的产品以及需要大量数据的计算,更为突出);也同样由于金属线的长度较长,所以金属线所存在的寄生电阻/寄生电容与寄生电杆对信号的干扰也较高;再由于芯片与引脚之间的距离较远,使得封装的体积与面积较大,材料成本较高,废弃物较多。
(三)发明内容
本实用新型的目的在于克服上述不足,提供一种降低封装成本、可选择的产品种类广、球焊的质量与产品可靠度的稳定性好、塑封体与金属脚的束缚能力大的无基岛多圈脚无源器件封装结构。
本实用新型的目的是这样实现的:一种无基岛多圈脚无源器件封装结构,包括引脚、不导电粘结物质、芯片、金属线和有填料塑封料,所述引脚设置有多圈,所述引脚正面尽可能的延伸到后续需装芯片的区域旁边,在所述引脚的正面设置有第一金属层,在所述引脚的背面设置有第二金属层,在所述引脚外围的区域、后续需装芯片的区域以及引脚与引脚之间的区域嵌置有无填料的塑封料,所述无填料的塑封料将引脚下部外围、所述引脚正面延伸的背面以及引脚下部与引脚下部连接成一体,且使所述引脚背面尺寸小于引脚正面尺寸,形成上大下小的引脚结构,在所述后续需装芯片的区域正面通过不导电粘结物质设置有芯片,芯片正面与引脚正面第一金属层之间用金属线连接,在引脚与引脚之间跨接有无源器件,在所述引脚的上部以及芯片、金属线和无源器件外包封有填料塑封料。
本实用新型的有益效果是:
1)此种引线框的背面不须要贴上一层昂贵可抗高温的胶膜。所以直接降低了高昂的成本。
2)也因为此种引线框架的背面不须要贴上一层可抗高温的胶膜,所以在封装过程中的装片工艺除了能使用导电或是不导电的树脂工艺外,还能采用共晶工艺以及软焊料的工艺进行装片,所以可选择的产品种类就广。
3)又因为此种引线框架的背面不须要贴上一层可抗高温的胶膜,确保了球焊键合参数的稳定性,保证了球焊的质量与产品可靠度的稳定性。
4)再因为此种引线框架不须要贴上一层可抗高温的胶膜,而在封装过程中的塑封工艺过程,完全不会造成引线框与胶膜之间渗入塑封料。
5)由于在所述金属脚(引脚)与金属脚间的区域嵌置有无填料的软性填缝剂,该无填料的软性填缝剂与在塑封过程中的常规有填料塑封料一起包覆住整个金属脚的高度,所以塑封体与金属脚的束缚能力就变大了,不会再有产生掉脚的问题。
6)由于采用了正面与背面分开蚀刻作业的方法,所以在蚀刻作业中可形成背面静电释放圈的尺寸稍小而正面静电释放圈尺寸稍大的结构,而同个静电释放圈的上下大小不同尺寸在被无填料的塑封料所包覆的更紧更不容易产生滑动而掉脚。
7)由于应用了背面与正面分开蚀刻的技术,所以能够将引线框正面的引脚尽可能的延伸到芯片的旁边,促使芯片与引脚距离大幅的缩短,如此金属线的成本也可以大幅的降低(尤其是昂贵的纯金质的金属线)。
8)也因为金属线的缩短使得芯片的信号输出速度也大幅的增速(尤其存储类的产品以及需要大量数据的计算,更为突出),由于金属线的长度变短了,所以金属线所存在的寄生电阻/寄生电容与寄生电杆对信号的干扰也大幅度的降低。
9)因运用了引脚的延伸技术,所以可以容易的制作出高脚数与高密度的脚与脚之间的距离,使得封装的体积与面积可以大幅度的缩小。
10)因为将封装后的体积大幅度的缩小,更直接的体现出材料成本大幅度的下降与因为材料用量的减少也大幅度的减少废弃物环保的困扰。
(四)附图说明
图1为本实用新型无基岛多圈脚无源器件封装结构示意图。
图2为图1的俯视图。
图3为以往在金属基板的背面贴上一层耐高温的胶膜图作业。
图4为以往采用金属基板的正面进行化学蚀刻及表面电镀层作业图。
图5为以往形成绝缘脚示意图。
图6为以往形成的掉脚图。
图7为以往的封装结构示意图。
图8为图7的俯视图。
图中附图标记:
引脚2、无填料的塑封料3、第一金属层4、第二金属层5、不导电粘结物质6、芯片7、金属线8、有填料塑封料9、无源器件10。
(五)具体实施方式
参见图1~2,图1为本实用新型无基岛多圈脚无源器件封装结构示意图。图2为图1的俯视图。由图1~2可以看出,本实用新型无基岛多圈脚无源器件封装结构,包括引脚2、不导电粘结物质6、芯片7、金属线8和有填料塑封料9,所述引脚2设置有多圈,所述引脚2正面尽可能的延伸到后续需装芯片的区域旁,在所述引脚2的正面设置有第一金属层4,在所述引脚2的背面设置有第二金属层5,在所述引脚2外围的区域、后续需装芯片的区以及引脚2与引脚2之间的区域嵌置有无填料的塑封料3,所述无填料的塑封料3将引脚下部外围、所述引脚2正面延伸的背面以及引脚2下部与引脚2下部连接成一体,且使所述引脚背面尺寸小于引脚正面尺寸,形成上大下小的引脚结构,在所述后续需装芯片的区正面通过不导电粘结物质6设置有芯片7,芯片7正面与引脚2正面第一金属层4之间用金属线8连接,在引脚2与引脚2之间跨接有无源器件10,在所述引脚2的上部以及芯片7、金属线8和无源器件10外包封有填料塑封料9。
本实用新型可因芯片功能的需要在上述引脚2的正面进行全部区域电镀第一金属层4或是局部区域电镀第一金属层4的制作。
Claims (1)
1.一种无基岛多圈脚无源器件封装结构,包括引脚(2)、不导电粘结物质(6)、芯片(7)、金属线(8)和有填料塑封料(9),其特征在于:所述引脚(2)设置有多圈,所述引脚(2)正面延伸到后续需装芯片的区域旁边,在所述引脚(2)的正面设置有第一金属层(4),在所述引脚(2)的背面设置有第二金属层(5),在所述引脚(2)外围的区域、后续需装芯片的区域以及引脚(2)与引脚(2)之间的区域嵌置有无填料的塑封料(3),所述无填料的塑封料(3)将引脚下部外围、所述引脚(2)正面延伸的背面以及引脚(2)下部与引脚(2)下部连接成一体,且使所述引脚背面尺寸小于引脚正面尺寸,形成上大下小的引脚结构,在所述后续需装芯片的区域正面通过不导电粘结物质(6)设置有芯片(7),芯片(7)正面与引脚(2)正面第一金属层(4)之间用金属线(8)连接,在引脚(2)与引脚2之间跨接有无源器件(10),在所述引脚(2)的上部以及芯片(7)、金属线(8)和无源器件(10)外包封有填料塑封料(9),所述引脚(2)的正面设置的第一金属层(4)为全部区域电镀或是局部区域电镀。
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