CN201676164U - Miniature constant temperature box with movable base - Google Patents
Miniature constant temperature box with movable base Download PDFInfo
- Publication number
- CN201676164U CN201676164U CN2010201730263U CN201020173026U CN201676164U CN 201676164 U CN201676164 U CN 201676164U CN 2010201730263 U CN2010201730263 U CN 2010201730263U CN 201020173026 U CN201020173026 U CN 201020173026U CN 201676164 U CN201676164 U CN 201676164U
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- heat
- temperature
- constant temperature
- constant
- support unit
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Abstract
The utility model provides a miniature constant temperature box with a movable base, wherein a heat-preserving material sheath is internally provided with a constant temperature storing chamber with a heat-preserving inner cover, a heat conduction material base and a temperature sensor, wherein the heat conduction material base can be contacted with and matched with the cooling/heating surface or a heat-preserving base cushion of a movable semiconductor cooling/heating chip with a heat dissipating structure. The power-supplied semiconductor cooling/heating chip and the heat-preserving base cushion are arranged on one set of movement supporting units which can move along a guiding structure at intervals and in parallel, the movement supporting units are driven by a micromotor to do reciprocating movement through a driving structure, the finishing point of the reciprocating movement of the movement supporting units on the guiding structure is provided with a plurality of position switches which can be matched with one another, and a heat-dissipating and ventilating structure is arranged between the heat dissipating structure of the semiconductor cooling/heating chip and an external heat exchanging part. With the small volume, the miniature constant temperature box can not be influenced by the external temperature, leads the inner temperature of the constant temperature storing chamber to keep constant for a longer time, and is particularly suitable for carrying the small-quantity material such as medicines and the like which needs to be stored at low temperature and constant temperature such as the insulin and the like when going outside.
Description
Technical field
This utility model relates to a kind of constant temperature that can be used for and deposits micro constant-temperature box as a small amount of article such as medicine.
Background technology
In the daily life, many article, particularly some medicine must be deposited under constant temperature or specified temp, in order to avoid rotten or inefficacy.With the oral insulin is example, and it must be preserved under 2-8 ℃ cryogenic conditions, otherwise the activity of medicine can reduce even lose efficacy.Another characteristics of this medicine are, drug dosage is little, are worth highly, but to take 2-4 time every day, and should not break medicine with change dressings.This has been just for diabetics has brought great inconvenience, and particularly during the broiling summer, the outdoor activity of long period such as make working, go on business, travel, visit friends and relatives is greatly limited.
The utility model content
At above-mentioned situation, this utility model will provide a kind of micro constant-temperature box with form at the bottom of the movable seat, can be in a long time constant relatively, particularly preserve a spot of article at a lower temperature, to satisfy the needs under the particular case.
The basic structure of the micro constant-temperature box at the bottom of this utility model band movable seat, be in the insulation material overcoat, to be provided with one to have bottom insulation inner cap and the Heat Conduction Material and the constant temperature storage chamber of temperature sensor, its Heat Conduction Material bottom can contact cooperations with the refrigeration/hot side or the insulation heelpiece structure of the semiconductor refrigerating that movably has radiator structure/hot chip respectively, with realize respectively to this constant temperature storage chamber freeze/heat and making reach temperature required after warm insulation/constant temperature in the constant temperature storage chamber.Being arranged on one group by the semiconductor refrigerating/hot chip of power supply power supply and insulation material heelpiece structure in spacing mode arranged side by side can be along on the support unit that moves of guide frame displacement, do the shift reciprocately motion through drive mechanism by micro machine actuation movement support unit, between motion support unit shift reciprocately destination county on the guide frame and motion support unit, be provided with the travel switch that can cooperatively interact.Obviously, for the Heat Conduction Material bottom that makes this constant temperature storage chamber can contact cooperation with semiconductor refrigerating/hot chip or insulation heelpiece structure respectively, to realize to constant temperature storage chamber refrigeration/heat and insulation/homothermic purpose, said motion support unit is along the setting of the shift reciprocately of guide frame distance and displacement destination county travel control switch, should and spacing this semiconductor refrigerating/hot chip arranged side by side and the spacing that is provided with between the insulation heelpiece structure adapt.In addition, the radiator structure of semiconductor refrigerating/hot chip and outside also should be provided with between heat exchange portion as the airway that connects form or the heat radiation ventilation device of other appropriate format.
Utilizing semiconductor refrigerating/hot chip change or regulate local temperature, much more report and application are arranged at present, is the ten minutes mature technique.Its basic functional principle and process, be with a N-type semiconductor material and P-type semiconductor material be coupled to galvanic couple to after, connecting DC current in this circuit just can energy-producing transfer: when electric current flows to P type element by N type element, joint absorbs heat becomes cold junction; Flow to N type element by P type element, the joint release heat becomes the hot junction.The size of heat absorption and heat release depends on the size of electric current and/or the element logarithm of semi-conducting material N/P.This utility model is promptly used this principle and circuit structure, and by the refrigeration/hot merit energy of semiconductor refrigerating/hot chip, realization reaches the temperature of local subenvironment in this constant temperature storage chamber and is controlled in the needed scope.
In the said structure, for improving the heat-insulating property of this constant temperature storage chamber opening cap, a kind of optimal way is can adopt as shown in the Examples, and making said this insulation inner cap is the structure that is located at the plug formula inner cap form of insulation material enclosing cover medial surface.
Carry and use for more convenient, be advisable with the volume that reduces the above-mentioned micro constant-temperature box of this utility model as far as possible.Wherein, drive mechanism in the said structure between said micro machine and motion support unit, owing to need not too big displacement transmission distance, therefore can preferably adopt the form of screw-and-nut, but, adopt form by the threaded engagement seat of corresponding setting on the rotary screw structure of micro motor for driving and the motion support unit as mode in a reference example.
For improving the radiating effect of above-mentioned micro constant-temperature box in refrigeration/thermal process and improving the refrigeration/thermal efficiency, said structure
In have the motion support unit at the semiconductor refrigerating/hot chip place of radiator structure, be adopted as can with semiconductor refrigerating/
The heat-conducting metal nested structure that the radiator structure of hot chip closely contacts connection is good.
In addition, on above-mentioned micro constant-temperature box basic structure basis, the suitable position in the said insulation material overcoat outside can also be provided with the corresponding operating structures such as interior temperature display structure that have power supply/change-over switch and/or detect through temperature sensor.
During use, temperature according to ambient temperature (or interior temperature of this constant temperature storage chamber of temperature sensor demonstration) and required control, start on and off switch, make semiconductor refrigerating/hot chip lower the temperature to this constant temperature storage chamber or heat up, after reaching the temperature of required control, with manual switchover or through suitably control circuit automatic switchover, stop the lifting/lowering temperature of semiconductor chip, and startup micro machine, drive can be moved along the support unit that moves of guide frame displacement, cold/hot semiconductor chip is moved apart the bottom of constant temperature storage chamber, and insulation heelpiece structure is moved under the constant temperature storage chamber, with its bottom cover, can try one's best in order to temperature in the constant temperature storage chamber and to keep for a long time with constant.When interior temperature variation exceeds required scope, switch automatically by manual or circuit, at first start the micro machine reverse rotation, the insulation heelpiece is moved apart the bottom of constant temperature storage chamber, and cold/hot semiconductor chip is come back to move to constant temperature storage chamber below, and begin the constant temperature storage chamber is carried out the lifting/lowering temperature.
This shows, constant temperature box of the present utility model is simple in structure, and because the volume space of constant temperature storage chamber is very little, therefore the lifting/lowering temperature is rapidly quick, and can the long period keep constant, be particularly suitable for to as the medicine of need low temperature such as insulin or steady temperature preservation etc. on a small quantity article when going out, carry and use.
Below in conjunction with the specific embodiment of accompanying drawing illustrated embodiment, foregoing of the present utility model is described in further detail again.But this should be interpreted as that the scope of the above-mentioned theme of this utility model only limits to following example.Do not breaking away under the above-mentioned technological thought situation of this utility model, various replacements or change according to ordinary skill knowledge and customary means are made all should be included in the scope of the present utility model.
Description of drawings
Fig. 1 is a kind of structural representation of the micro constant-temperature box at the bottom of this utility model band movable seat.
Fig. 2 is the structural representation at the movable seat end among Fig. 1.
The sketch map of a kind of control circuit principle of Fig. 3 this utility model micro constant-temperature box.
The specific embodiment
A kind of version of the micro constant-temperature box at the bottom of illustrated in figures 1 and 2 is this utility model band movable seat.In adopting insulation material overcoats 2 such as using hard microporous foam always, be provided with the bottom of a tool heat conduction functional material such as metal and the constant temperature storage chamber 5 of temperature sensor, also be provided with the insulation inner cap 4 of an inner plug version on the correspondence position of insulation enclosing cover 3 medial surface of its peristome.The cooperation that can be respectively contacts of the metal bottom of this constant temperature storage chamber 5 with the refrigeration/hot side of a pair of semiconductor refrigerating/hot chip 16 that movably has a radiator structure 14 such as fin or insulation heelpiece structure 15.By the semiconductor refrigerating/hot chip 16 of power supply (as battery and/or external power interface) power supply and insulation material heelpiece structure 15 mode arranged side by side with spacing, be arranged on one group can move support unit 13 along 9 displacements of guide frames such as guide post and the metal shell type with heat sinking function on.This constant temperature box below, be provided with one with direct current micromotor 7 by the power supply power supply, the nut type threaded engagement seat of its rotary power output setting on a threaded screw drive mechanism 10 and syndeton 12 at motion support unit 13 cooperates do transmission, by micro machine 7 just/backward rotation, drive motion support units 13 and go up the semiconductor refrigerating/hot chip 16 and the insulation material heelpiece structure 15 that are provided with and do the shift reciprocately motion through this drive mechanism 10.On guide frame 9, between the shift reciprocately destination county and motion support unit 13 of this motion support unit 13, also be provided with press-type (or other appropriate format) travel switch 8,11 that can cooperatively interact.The reciprocating motion length of motion support unit 13 and said travel switch 8,11 the position is set, should with semiconductor refrigerating/hot chip 16 and insulation material heelpiece structure 15 to be set up in parallel spacing consistent.The radiator structure 14 of semiconductor refrigerating/hot chip 16 and outside also be provided with the heat radiation ventilation device 6 of forms such as through airway between heat exchange portion.In the appropriate position, the outside of insulation material overcoat 2, also be provided with the operating structure 1 that has power supply/change-over switch and/or temperature displaying structure.
Fig. 3 can realize that this utility model micro constant-temperature box freezes/heat and the structure of thermostatically controlled a kind of basic circuit.Temperature sensor among the figure can be adopted the negative tempperature coefficient thermistors (NTC) such as MF52 series of products of magnificent huge science and technology, and its resistance can change with variations in temperature on every side.It is that refrigerating capacity such as TES1-1701 is the core of 0.5～10W that semiconductor refrigerating/hot chip 16 can adopt the smart easily model of industry and trade company limited in Tianjin, by changing the polarity of its input voltage, can realize constant temperature storage chamber 5 refrigeration or heating.
U1A～U1D is the operational amplifier that all is adopted as LMV324MT, form temperature measuring circuit jointly with NTC, wherein U1A and U1D make voltage follower, voltage that NTC is gathered and reference voltage are delivered to U1C and are carried out difference and amplify, U1B also has been the signal amplification, by the cooperation of U1C and U1B, amplification multiple can be set more neatly.Switching Power Supply U2 adopts TPS62056, and output voltage 3.3V, maximum output current are 800mA, powers to micro machine 7 through adapter CN1; Switching Power Supply U4 adopts TPS62750, the output voltage adjustable size, maximum output current is 1.5A, power to semiconductor refrigerating/hot chip 16 through adapter CN2, and its enable pin 8 connects together with the input voltage (VIN) of taking from the system of cell voltage or AC adapter, all the time in running order, always to msp430F149 single-chip microcomputer U3 power supply, the control system operation.When the polarity of voltage that RELAY2 (relay 2) is used to control 1,2 feet of the direction of the polarity of voltage on two pins of CN1: CN1 changes, the corresponding change of rotation direction of the micro machine 7 that is attached thereto drives motion support unit 13 and the semiconductor refrigerating/hot chip 16 that upward is provided with and insulation material heelpiece structure 15 thereof through drive mechanism 10 and does corresponding shift reciprocately motion.RELAY3 (relay 3) is used to control the direction of the polarity of voltage on two pins of CN2, makes semiconductor refrigerating/hot chip 16 respectively to heat or refrigerating pattern work.
After the system power-up, temperature sensor (NTC) at first detects the temperature of constant temperature storage chamber 5.If temperature is lower than default temperature range lower limit (for example winter＜2 ℃ time), amplify output single-chip microcomputer U3 by U6A～U6D computing, by U3 according to the control sequence requirement of presetting, make RELAY1 (relay 1) adhesive, send 3.3V voltage to RELAY2 (relay 2), make direct current micromotor 7 rotations, semiconductor refrigerating/hot chip 16 is moved to constant temperature storage chamber 5 belows, after pressing travel switch 8, the motion support unit 13 that comes and goes RELAY1 can be disconnected, cut off the power supply of micro machine 7, stop to move.Switch on heating mode work to semiconductor refrigerating/hot chip 16 by RELAY3 (relay 3) simultaneously.When detecting constant temperature storage chamber 5 endogenous causes of ill, temperature sensor continues the default temperature upper limit (for example 8 ℃) of heat temperature raising arrival, then can be according to the requirement that is provided with of control sequence, put No. 4 pins of Switching Power Supply U4 low by single-chip microcomputer U3, make the input voltage vanishing of semiconductor refrigerating/hot chip 16, stop to heat.Make RELAY1 (relay 1) adhesive simultaneously, RELAY2 (relay 2) swings to, and makes the backward rotation of direct current micromotor 7, semiconductor refrigerating/hot chip 16 is removed, and made insulation material heelpiece structure 15 slide into the lower position of constant temperature storage chamber 5.After moving into place, the motion support unit 13 press-type travel switches 11 that come and go disconnect RELAY1 (relay 1) again, cut off the power supply of micro machine 7, stop to move.Constant temperature storage chamber 5 is in keeping warm mode at this moment.Decline gradually along with temperature in the constant temperature storage chamber 5, when the interior temperature that detects constant temperature storage chamber 5 as temperature sensor NTC is lower than default temperature range lower limit, repeat above process, again semiconductor refrigerating/hot chip 16 is moved to constant temperature storage chamber 5 belows, constant temperature storage chamber 5 is heated.So get final product so that the temperature of constant temperature storage chamber 5 remains in default temperature range (for example 2～8 ℃) scope.
Claims (6)
1. the micro constant-temperature box of band at the bottom of the movable seat, it is characterized in that being provided with in insulation material overcoat (2) one has bottom insulation inner cap (4) and the Heat Conduction Material and the constant temperature storage chamber (5) of temperature sensor, its Heat Conduction Material bottom contacts cooperation with the refrigeration/hot side or the insulation heelpiece structure (15) of the semiconductor refrigerating that movably has radiator structure (14)/hot chip (16), being arranged on one group by the semiconductor refrigerating/hot chip (16) of power supply power supply and insulation material heelpiece structure (15) in spacing mode arranged side by side can be along on the motion support unit (13) of guide frame (9) displacement, do the shift reciprocately motion through drive mechanism (10) by micro machine (7) actuation movement support unit (13), between motion support unit (13) shift reciprocately destination county on the guide frame (9) and motion support unit (13), be provided with the travel switch (8 that can cooperatively interact, 11), the radiator structure (14) of semiconductor refrigerating/hot chip (16) and outside be provided with heat radiation ventilation device (6) between heat exchange portion.
2. micro constant-temperature box as claimed in claim 1 is characterized in that said insulation inner cap (4) is for being located at the gag formula structure of insulation material enclosing cover (3) medial surface.
3. micro constant-temperature box as claimed in claim 1, it is characterized in that the drive mechanism (10) between said micro machine (7) and motion support unit (13), go up the form of the threaded engagement seat of corresponding setting for rotary screw structure and the motion support unit (13) that drives by micro machine (7).
4. micro constant-temperature box as claimed in claim 1 is characterized in that said motion support unit (13) is for closely contacting the heat-conducting metal nested structure that is connected with the radiator structure (14) of semiconductor refrigerating/hot chip (16).
5. micro constant-temperature box as claimed in claim 1 is characterized in that said heat radiation ventilation device (6) is the airway of perforation form.
6. as the described micro constant-temperature box of one of claim 1 to 5, it is characterized in that also being provided with the operating structure (1) that has power supply/change-over switch and/or temperature displaying structure in said insulation material overcoat (2) outside.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010201730263U CN201676164U (en) | 2010-04-28 | 2010-04-28 | Miniature constant temperature box with movable base |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010201730263U CN201676164U (en) | 2010-04-28 | 2010-04-28 | Miniature constant temperature box with movable base |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201676164U true CN201676164U (en) | 2010-12-22 |
Family
ID=43341228
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010201730263U Expired - Fee Related CN201676164U (en) | 2010-04-28 | 2010-04-28 | Miniature constant temperature box with movable base |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201676164U (en) |
-
2010
- 2010-04-28 CN CN2010201730263U patent/CN201676164U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| EE01 | Entry into force of recordation of patent licensing contract |
Assignee: Chengdu Jule Pharmaceutical Co., Ltd. Assignor: Yin Jin| Zhong Huajun Contract record no.: 2012510000028 Denomination of utility model: Miniature constant temperature box with movable base Granted publication date: 20101222 License type: Exclusive License Record date: 20120418 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20101222 Termination date: 20160428 |