CN201634787U - Minitype block electroplating clamp - Google Patents
Minitype block electroplating clamp Download PDFInfo
- Publication number
- CN201634787U CN201634787U CN2010201326890U CN201020132689U CN201634787U CN 201634787 U CN201634787 U CN 201634787U CN 2010201326890 U CN2010201326890 U CN 2010201326890U CN 201020132689 U CN201020132689 U CN 201020132689U CN 201634787 U CN201634787 U CN 201634787U
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- CN
- China
- Prior art keywords
- plating piece
- electroplating clamp
- electroplating
- micromodular
- clamp
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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Abstract
The utility model provides a minitype block electroplating clamp which is characterized in that two positioning blocks are fixed at two ends of two parallel plywoods; each positioning block is provided with an opening; the outer sides of the two parallel plywoods are symmetrically installed with n pairs of adjusting screws; the adjusting screws drive and adjust the sliding clamping columns arranged on the plywoods; and n is not less than 1. The electroplating clamp solves the problems that the minitype plated parts are easy to cover and impact to cause damage, and the thickness of the plating layer can not be controlled accurately.
Description
Technical field
The utility model relates to a kind of anchor clamps, relates in particular to a kind of anchor clamps that are used for the miniature block device of clamping in electroplating technology.
Background technology
Present existing electroplating clamp substantially all is at relatively large plating pieces such as wiring boards, and more small-sized plating piece adopts and roll or the method for oscillating plating.The carrier of laser apparatus is a kind of very little very thin oxygen-free copper block, and width has only several millimeters, and thickness needs two-sided plating scolder less than one millimeter, and electrolytic coating thickness needs accurately control, guarantees the electrolytic coating distributing homogeneity simultaneously.The blocked up meeting of electrolytic coating causes the laser tube core short circuit, thereby electrolytic coating is crossed and thin can be caused the laser tube core rosin joint to cause the overheated component failure that makes.If adopt to roll or method for oscillating electroplate, plating piece (oxygen-free copper block) runs foul of each other and can cause oxygen-free copper block edge major injury and can't use, and electroplating thickness and homogeneity all are difficult to accurate control.Adopt spring wire to make Small clamp at present, clamp plating piece, the method bunchiness that Small clamp is fastened on wire is electroplated with Small clamp, each plating back wire and Small clamp need erode coating, electroplate planimeter and do not calculate accurately really, plating piece hides collision easily mutually, and electrolytic coating thickness can not accurately be controlled.
The utility model content
The technical problems to be solved in the utility model is: by a kind of electroplating clamp is provided, it is wayward to solve the plating piece thickness of coating, and the low problem of electroplating efficiency.
For solving the problems of the technologies described above, technical solution adopted in the utility model is: a kind of micromodular electroplating clamp, be made by metal, wherein: two preset piecess are fixed on the two ends of two parallel splints, perforate is arranged on the preset pieces, the two parallel splints outside is symmetrically installed with n to set screw, and set screw drives regulates the slip clamp column that is arranged on the clamping plate; Wherein, n 〉=1.
Adopt the beneficial effect that technique scheme produced to be: plating piece is positioned no longer to fix with Small clamp and wire in the middle of the two slip clamp column, easy to operate like this; Can electroplate a plurality of plating pieces simultaneously, be arranged in parallel between the plating piece, noiseless each other, do not have again covering overlapping between the plating piece, therefore electroplating planimeter calculates accurately really, each plating piece electrolytic coating is evenly distributed, and thickness of plating layer is accurately controlled, and avoided with roll or method for oscillating when electroplating between the plating piece mutually collision cause damage.
Description of drawings
Fig. 1 is the structural representation of the micromodular electroplating clamp of the utility model;
Fig. 2 is each position structural representation of the utility model;
Fig. 3 is the structural representation of plating piece carrier;
Among the figure: 1-clamping plate, 11-set screw, 12-coupling screw, 2-preset pieces, the perforate on the 21-preset pieces, 3-slip clamp column, 4-plating piece carrier, 41-groove, 5-plating piece.
Embodiment
Below in conjunction with accompanying drawing the utility model is described in further detail.
Referring to Fig. 1, a kind of micromodular electroplating clamp is made by metal, and wherein: two preset piecess 2 are fixed on the two ends of two parallel splints 1, and preset pieces 2 is orthogonal with clamping plate 1; Perforate 21 is arranged on the preset pieces 2, be used for connecting outside lead, the position of perforate 21 on preset pieces 2 do not have strict the qualification, but in order when electroplating, to make whole electroplating clamp stressed evenly, keep good balance, the optimum seeking site of perforate 21 is arranged on the mid-way of preset pieces 2; Two parallel splints, 1 outside is symmetrically installed with n to set screw 11, promptly is equipped with n set screw 11 on each clamping plate 1, the set screw 11 on one of them clamping plate 1 all with another one clamping plate 1 on set screw 11 be symmetrical arranged one by one; Set screw 11 drives regulates the slip clamp column 3 that is arranged on the clamping plate 1; Wherein, n 〉=1.The n value is 10 in the present embodiment.Thereby screwing set screw 11 during assembling makes slip clamp column 3 closely contact fixedly plating piece 5 with plating piece 5.
Preset pieces 2 and clamping plate 1 are preferably the cuboid structure in the present embodiment, and connection so between the two is more firm.Can certainly be other shapes,, and guarantee that preset pieces 2 can connect together with clamping plate 1 and get final product as long as can guarantee set screw 11 and slip clamp column 3 can be set on clamping plate 1.
In the electroplating clamp that the utility model provides, also include plating piece carrier 4, fluted 41 are used for placing plating piece 5 on the plating piece carrier 4, and the size of groove 41 is set according to the size of plating piece 5, and this just needs plating piece carrier 4 that multiple shape and specification are arranged.Can plating piece 5 be placed in the groove 41 of plating piece carrier 4 earlier when plating piece 5 is installed, and then screw set screw 11, after set screw 11 is stable with plating piece 5 clampings, remove plating piece carrier 4 again.
Micromodular electroplating clamp slip clamp column 3 is spring or steel wire, is preferably spring in the present embodiment, because spring has very big elasticity, can not cause the damage of plating piece 5 when screwing set screw 11.Slip clamp column 3 is thinner, and end face is point, and holding force is less, can not make plating piece 5 distortion, and the slip clamp column is not influence each other, and a plurality of miniature plating pieces of a plurality of slip clamp column 3 clampings can be installed on two parallel splints 1 simultaneously.
When parallel splint (1) two ends use preset pieces (2) fixedly, can be fixing with coupling screw 12, also can the joggle mode fix, other can make the method for clamping plate 1 secured in parallel also can.Adopt coupling screw 12 fixed forms in the present embodiment, cleaning is convenient in the easier assembly and disassembly of this syndeton.
On whole micromodular electroplating clamp surface, the end face and the needs on the preset pieces 2 that need to connect plating piece 5 on slip clamp column 3 connect the perforate 21 of lead, apply the hanger insulation paste, play insulating effect, and the protection electroplating clamp is not electroplated when electroplating.Perforate 21 on the preset pieces 2 is used for connecting lead when electroplating.With in the electroplating clamp immersion plating liquid, the perforate 21 on the preset pieces 2 of electroplating clamp is electroplated by the negative electrode that lead is connected in direct supply behind the good plating piece 5 of clamping.
Claims (5)
1. micromodular electroplating clamp, be made by metal, it is characterized in that: two preset piecess (2) are fixed on the two ends of two parallel splints (1), perforate (21) is arranged on the preset pieces (2), two parallel splints (1) outside is symmetrically installed with n to set screw (11), and set screw (11) drives regulates the slip clamp column (3) that is arranged on the clamping plate (1); Wherein, n 〉=1.
2. micromodular electroplating clamp according to claim 1 is characterized in that also comprising plating piece carrier (4) in the above-mentioned electroplating clamp structure, and the groove (41) that is used for placing plating piece (5) is arranged on the plating piece carrier (4).
3. micromodular electroplating clamp according to claim 1 is characterized in that above-mentioned slip clamp column (3) is spring or steel wire.
4. micromodular electroplating clamp according to claim 1 is characterized in that adopting coupling screw (12) to fixedly connected between clamping plate (1) and the preset pieces (2).
5. micromodular electroplating clamp according to claim 1 is characterized in that whole electroplating clamp surface applies the hanger insulation paste except that the end face and the rest part of the perforate (21) on the preset pieces (2) of the connection plating piece (5) of slip clamp column (3).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010201326890U CN201634787U (en) | 2010-03-17 | 2010-03-17 | Minitype block electroplating clamp |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010201326890U CN201634787U (en) | 2010-03-17 | 2010-03-17 | Minitype block electroplating clamp |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201634787U true CN201634787U (en) | 2010-11-17 |
Family
ID=43079277
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010201326890U Expired - Lifetime CN201634787U (en) | 2010-03-17 | 2010-03-17 | Minitype block electroplating clamp |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201634787U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104600542A (en) * | 2015-01-15 | 2015-05-06 | 沈阳兴华航空电器有限责任公司 | Partial gold plating fixture for contact body |
| CN108360047A (en) * | 2018-04-11 | 2018-08-03 | 中国科学院半导体研究所 | A kind of electroplating clamp and its application method |
-
2010
- 2010-03-17 CN CN2010201326890U patent/CN201634787U/en not_active Expired - Lifetime
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104600542A (en) * | 2015-01-15 | 2015-05-06 | 沈阳兴华航空电器有限责任公司 | Partial gold plating fixture for contact body |
| CN108360047A (en) * | 2018-04-11 | 2018-08-03 | 中国科学院半导体研究所 | A kind of electroplating clamp and its application method |
| CN108360047B (en) * | 2018-04-11 | 2020-03-17 | 中国科学院半导体研究所 | Electroplating clamp and using method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20101117 |