CN108360047A - A kind of electroplating clamp and its application method - Google Patents
A kind of electroplating clamp and its application method Download PDFInfo
- Publication number
- CN108360047A CN108360047A CN201810324671.1A CN201810324671A CN108360047A CN 108360047 A CN108360047 A CN 108360047A CN 201810324671 A CN201810324671 A CN 201810324671A CN 108360047 A CN108360047 A CN 108360047A
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- Prior art keywords
- sliding block
- square opening
- rectangle square
- bottom sheet
- piece
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/06—Suspending or supporting devices for articles to be coated
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
Present disclose provides a kind of electroplating clamps, including：One bottom sheet, for placing indium part to be plated, there is one first rectangle square opening in centre, and electrode is provided in the second long side of the first rectangle square opening, a guide rail is provided in the first long side of the first rectangle square opening, is used to support indium part to be plated；Piece in one, described middle is L-shaped, and the L-shaped long side corresponds to the second long side side of the first rectangle square opening of the bottom sheet, and the L-shaped short side corresponds to the second short side side of the first rectangle square opening of the bottom sheet；One upper piece, upper piece the centre is provided with one second rectangle square opening, corresponding with the position of the first rectangle square opening；Described middle, the first sliding block and the second sliding block are set to piece, between bottom sheet, and with upper piece, bottom sheet be fixedly connected, the first sliding block and the second sliding block fix part to be electroplated for jam-packed.The compatible different sizes of the fixture and sample of different shapes realize and multiple unplated pieces are electroplated simultaneously, electroplating efficiency is high, and can reach good electroplating evenness.
Description
Technical field
This disclosure relates to semiconductor laser diode encapsulation technology field, more particularly to it is a kind of in electrode slice, it is excessively heat sink
Used stationary fixture and its application method when upper plated solder.
Background technology
High power laser diode be widely used it is general, such as pumping source, for material processing, medical treatment, infrared photograph
It is bright etc..When being packaged to high power laser bar items, it need to shift to an earlier date in electrode and prepare solder on excessively heat sink, is prepared by solder
Common method have evaporation, sputtering and plating.Evaporation, sputtering it is of high cost, time-consuming, and be electroplated have it is at low cost, efficient,
Feature easy to operate and convenient and efficient.The solder of high quality is the necessary condition for realizing high reliability packaging, electroplating clamp
It is the necessary condition for preparing high quality solder.In order to improve the efficiency and electroplating quality of plating, particularly with the smaller electricity of size
Pole and excessively heat sink, it is necessary to be fixed in electrodepositable solder above fixture by special designing.
Invention content
(1) technical problems to be solved
Present disclose provides a kind of electroplating clamp and its application methods, are asked with the technology at least partly solving set forth above
Topic.
(2) technical solution
According to one aspect of the disclosure, a kind of electroplating clamp is provided, including：One bottom sheet, for placing indium part to be plated,
There is one first rectangle square opening in centre, and electrode, the first length of the first rectangle square opening are set in the second long side of the first rectangle square opening
It is provided with a guide rail on side, is used to support indium part to be plated；Piece in one, described middle is L-shaped, described in the L-shaped long side correspondence
Second long side side of the first rectangle square opening of bottom sheet, the L-shaped short side correspond to the of the first rectangle square opening of the bottom sheet
Two short side sides；One upper piece, upper piece the centre is provided with one second rectangle square opening, the position with the first rectangle square opening
It is corresponding；Described middle, the first sliding block and the second sliding block are set to piece, between bottom sheet, and with upper piece, bottom sheet be fixedly connected,
One sliding block and the second sliding block fix part to be electroplated for jam-packed.
In the disclosure some embodiments, first sliding block is located at the first short side side of the first rectangle square opening, and stretches
Enter the hollow space of the L-shaped middle formation, second sliding block is located at the second short side side of the first rectangle square opening, and stretches
Enter the hollow space that piece is formed in the L-shaped.
In the disclosure some embodiments, the both ends of the second rectangle square opening are provided with the first rectangular channel and the second rectangular channel, use
In the placement entrance as indium part to be plated, first rectangular channel and the second rectangular channel are connected to the second rectangle square opening in " work " word
Shape.
In the disclosure some embodiments, one end of the bottom sheet also opens that there are one the first grooves, with the first rectangle square opening
It is connected；The middle on piece is provided with a third groove；It opens there are one the 4th groove described upper piece one end；Wherein, the described 4th
Groove, the first groove, third groove location correspond to, hole of the composition for the extraction of electrode 6.
It in the disclosure some embodiments, opens that there are one the second grooves on the inside of the middle long side, is set to piece in L-shaped
Long side and short side junction, are used for placement positioning sliding block.
In the disclosure some embodiments, there are one first boss and a second boss for the upper surface of the bottom sheet, use
In support upper piece.
In the disclosure some embodiments, the first boss is set to the first long side of rectangle square opening and is connect with the second long side
Side, the second boss is set to the side of the first long side of rectangle square opening.
In the disclosure some embodiments, it is respectively arranged with mounting hole on bottom sheet, middle and upper piece corresponding position, one
Screw passes through the mounting hole, by bottom sheet, middle and upper piece fixation；Have for for screw on first sliding block and the second sliding block
The opening passed through.
In the disclosure some embodiments, bottom sheet, middle, upper piece, the first sliding block, the second sliding block, screw and guide rail adopt
Use insulating materials.
A kind of application method of electroplating clamp another aspect of the present disclosure provides, including：Successively by bottom sheet,
Middle and upper piece stack in order and with screw pass through fix, then by electrode strip be inserted into bottom sheet and upper piece between groove in simultaneously
It is fixed, and bottom sheet and upper piece between be inserted into sliding block and sliding block, be used in combination screw to pass through the opening of sliding block；By multiple indium parts to be plated
It is sequentially placed into from the first rectangular channel or the second rectangular channel, it is arranged side by side that indium part to be plated one end is taken on the electrode wherein, and one
End rides on guide rail, after putting well successively, the second sliding block jam-packed of side, and side sliding block jam-packed, according to the quantity of indium part to be plated
The position that the first sliding block and the second sliding block are adjusted with size after position is adjusted, tightens screw and realizes fixation successively；It is multiple
After unplated piece fixes, the plating window formed by the first rectangle square opening and the second rectangle square opening carries out two-sided plating.
(3) advantageous effect
It can be seen from the above technical proposal that the electroplating clamp of the disclosure at least has the advantages that one of them：
(1) electroplating clamp of the disclosure, particularly with the smaller electrode of size or heat sink, can reach it is good fixed and
The effect of power-up realizes and multiple unplated pieces is electroplated simultaneously that electroplating efficiency is high, and it is uniform to reach plating well
Property；
(2) clamp structure is simple, easy to operate, and electroplating efficiency is high, and electroplating evenness is good, can be to multiple samples simultaneously
It is electroplated, the compatible different sizes of the fixture and sample of different shapes.
Description of the drawings
Fig. 1 is the structural schematic diagram of embodiment of the present disclosure plating folder.
Fig. 2 is the structural schematic diagram of embodiment of the present disclosure bottom sheet.
Fig. 3 is the structural schematic diagram of piece in the embodiment of the present disclosure.
Fig. 4 is the structural schematic diagram of the embodiment of the present disclosure upper piece.
Fig. 5 is that the embodiment of the present disclosure fills sample guide rail schematic diagram.
【Embodiment of the present disclosure main element symbol description in attached drawing】
1, bottom sheet；
11, first boss 12, second boss
13, the first mounting hole 14, the first groove
15, the first rectangle square opening
2, middle
21,22 third groove of the second groove
23, the second mounting hole
3, upper piece；
31 first rectangular channel, 32 second rectangular channel
The 4th groove of 33 third mounting hole 34
35 second rectangle square openings
4, the first sliding block
5, the second sliding block；6, electrode strip
7, screw；8, guide rail.
Specific implementation mode
To make the purpose, technical scheme and advantage of the disclosure be more clearly understood, below in conjunction with specific embodiment, and reference
The disclosure is further described in attached drawing.
Disclosure some embodiments will be done with reference to appended attached drawing in rear and more comprehensively describe to property, some of but not complete
The embodiment in portion will be shown.In fact, the various embodiments of the disclosure can be realized in many different forms, and should not be construed
To be limited to this several illustrated embodiment；Relatively, these embodiments are provided so that the disclosure meets applicable legal requirement.
In first exemplary embodiment of the disclosure, a kind of electroplating clamp is provided.Fig. 1 is implemented for the disclosure first
The structural schematic diagram of example electroplating clamp.As shown in Figure 1, disclosure electroplating clamp includes：Bottom sheet 1, middle 2, upper piece 3, first slide
Block 4, the second sliding block 5, electrode strip 6, screw 7 and guide rail 8.Wherein, bottom sheet 1 is provided with rectangle square opening on 3 with upper piece, guide rail 8 and the
Two sliding blocks 5 are located at the first long side side of rectangle square opening, and electrode strip 6 is located at the second long side side of rectangle square opening, the first sliding block 4
Positioned at the first short side side of rectangle square opening.After indium part to be plated is sequentially placed into, one end rides over 6 top of electrode, and one end rides over guide rail 8
Top, after indium part to be plated is put well successively, side 5 jam-packed of the second sliding block, side 4 jam-packed of sliding block,
Each component part of the present embodiment electroplating clamp is described in detail individually below.
One bottom sheet 1, preferably insulating materials, for placing indium part to be plated, the surface of the bottom sheet 1 is smooth as possible,
To realize the contact of uniform close with sample to be electroplated.
In the present embodiment, the bottom sheet 1 is rectangle, and there is one first rectangle square opening 15 in centre, for being used as indium part to be plated
The edge of the window of plating, the first rectangle square opening 15 is provided with 10 the first mounting holes 13, for upper piece, middle fixation.It is preferred that
Ground, first mounting hole 13 are circular hole.
There are one first boss 11 and a second boss for the upper surface of 1 first long side of the bottom sheet and/or the first short side
12, pieces 3 are used to support, the first boss 11 and second boss 12 can be the different shapes such as rectangle, circle, polygon
Shape.Particularly, the first boss 11 is set to the first long side of rectangle square opening and the second short side junction, and the second boss is set
It is placed in the first long side of rectangle square opening.
One end of the bottom sheet 1 is also opened there are one the first groove 14, is connected with the first rectangle square opening 15, for that will be arranged
In the extraction of the electrode 6 in the second long side of the first rectangle square opening 15.It is additionally provided in first long side of the first rectangle square opening 15
One guide rail 8 is used to support indium part to be plated.
Piece 2 in one, preferably insulating materials, described middle 2 is L-shaped, and the L-shaped long side corresponds to the of the bottom sheet 1
It is second short to correspond to the first rectangle square opening 15 of the bottom sheet 1 for second long side side of one rectangle square opening 15, the L-shaped short side
Side side is provided with 6 the second mounting holes 23 on described middle 2, with the first mounting hole 13 and upper piece circle on 3 in bottom sheet 1
Hole 33 is corresponding.Preferably, second mounting hole 23 is circular hole.
It is opened on the inside of middle 2 long sides there are one the second groove 21, is set to piece long side and short side junction in L-shaped,
For placement positioning sliding block (not shown).
While it being provided with a third groove 22 on described middle 2, it is set to the inside of middle 2 long sides, with described first
The position of groove 14 is opposite, is used for the extraction of electrode 6.
One upper piece 3, it is provided with 10 third mounting holes 33, preferably insulating materials.Upper piece 3 centre is provided with one
The both ends of two rectangle square openings 35, the second rectangle square opening 35 are provided with the first rectangular channel 31 and the second rectangular channel 32, are used for indium part to be plated
Placement entrance, first rectangular channel, 31 and second rectangular channel 32 is connected in the shape of an " I " with the second rectangle square opening 35 so that
The to be plated indium part more slightly larger than rectangle square opening 35 can be placed into.Described upper piece 3 one end is opened there are one the 4th groove 34, position with
First groove 14, third groove 22 correspond to, for the extraction of electrode 6.
One screw 7, pass through first mounting hole 13, the second mounting hole 23 and third mounting hole 33, for by bottom sheet 1,
Middle 2 and upper piece 3 fix, to fixed electroplating clamp.
First sliding block 4 and the second sliding block 5 are set to bottom sheet 1 and upper piece between 3, and part to be electroplated is fixed for jam-packed.First
There is the opening for being passed through for screw, first sliding block 4 to be located at the first rectangle square opening 15 on sliding block 4 and the second sliding block 5
First short side side, and the hollow space that piece 2 is formed in the L-shaped is stretched into, second sliding block 5 is located at the first rectangle square opening 15
The first long side side, and stretch into the hollow space that piece 2 in the L-shaped is formed.
One electrode strip 6 is set to the long side of piece 2 and hollow space adjacent in L-shaped, recessed by the first groove 14, third
The hole of slot 22 and the 4th groove 34 composition stretches out, electrode when for as plating.
One guide rail 8 is set in the first long side of the first rectangle square opening 15, is used to support indium part to be plated.
The electroplating clamp is other than electrode strip 6, remaining component first choice insulating materials, such as ceramics, polytetrafluoro etc..
In second exemplary embodiment of the disclosure, a kind of application method of electroplating clamp is provided, including：
First, successively by bottom sheet 1, middle 2 and upper piece 3 stack in order and approximately fixed with screw 7, then by electrode strip
6 are inserted into bottom sheet 1 and upper piece groove between 3 and fixed, are inserted into sliding block 4 and sliding block 5, screw is used in combination to pass through the opening of sliding block,
Keep its approximately fixed.
Multiple indium parts to be plated are sequentially placed into from the first rectangular channel 31 or the second rectangular channel 32, it is arranged side by side in bottom sheet
On, indium part to be plated one end is taken on the electrode 6, and one end rides on guide rail 8, after putting well successively, side 5 jam-packed of the second sliding block, and one
Side 4 jam-packed of sliding block, the position of the first sliding block 4 and the second sliding block 5, position tune are adjusted according to the quantity of indium part to be plated and size
It is whole it is good after, tighten screw successively and realize and fix.After multiple unplated pieces fix, the first rectangle square opening 15 and the second square can be passed through
The plating window that shape square opening 35 is formed carries out two-sided plating.
The electroplating clamp has simple in structure, and easy to operate, electroplating efficiency is high, and electroplating evenness is good, handling ease etc.
Feature.Particularly with the smaller electrode of size or heat sink, it can achieve the effect that well fixed and power-up, realize simultaneously to more
A unplated piece carries out two-sided plating, and electroplating efficiency is high, and can reach good electroplating evenness.
Certainly, according to actual needs, the preparation method of disclosure display device also includes other techniques and step, due to
Innovation with the disclosure is unrelated, and details are not described herein again.
In order to achieve the purpose that brief description, in above-described embodiment 1, any technical characteristic narration for making same application is all
And in this, without repeating identical narration.
So far, attached drawing is had been combined the embodiment of the present disclosure is described in detail.It should be noted that in attached drawing or saying
In bright book text, the realization method for not being painted or describing is form known to a person of ordinary skill in the art in technical field, and
It is not described in detail.In addition, the above-mentioned definition to each element and method be not limited in mentioning in embodiment it is various specific
Structure, shape or mode, those of ordinary skill in the art simply can be changed or replaced to it.
It should also be noted that, the direction term mentioned in embodiment, for example, "upper", "lower", "front", "rear", " left side ",
" right side " etc. is only the direction of refer to the attached drawing, not is used for limiting the protection domain of the disclosure.Through attached drawing, identical element by
Same or similar reference numeral indicates.When that understanding of this disclosure may be caused to cause to obscure, conventional structure will be omitted
Or construction.
And the shape and size of each component do not reflect actual size and ratio in figure, and only illustrate the embodiment of the present disclosure
Content.In addition, in the claims, any reference mark between bracket should not be configured to the limit to claim
System.
It unless there are known entitled phase otherwise anticipates, the numerical parameter in this specification and appended claims is approximation, energy
Enough required characteristic changings according to as obtained by content of this disclosure.Specifically, all be used in specification and claim
The number of the middle content for indicating composition, reaction condition etc., it is thus understood that repaiied by the term of " about " in all situations
Decorations.Under normal circumstances, the meaning expressed refers to including by specific quantity ± 10% variation in some embodiments, at some
± 5% variation in embodiment, ± 1% variation in some embodiments, in some embodiments ± 0.5% variation.
Furthermore word "comprising" does not exclude the presence of element or step not listed in the claims.Before element
Word "a" or "an" does not exclude the presence of multiple such elements.
The word of specification and ordinal number such as " first ", " second ", " third " etc. used in claim, with modification
Corresponding element, itself is not meant to that the element has any ordinal number, does not also represent the suitable of a certain element and another element
Sequence in sequence or manufacturing method, the use of those ordinal numbers are only used for enabling the element with certain name and another tool
There is the element of identical name that can make clear differentiation.
In addition, unless specifically described or the step of must sequentially occur, there is no restriction in the above institute for the sequence of above-mentioned steps
Row, and can change or rearrange according to required design.And above-described embodiment can be based on the considerations of design and reliability, that
This mix and match is used using or with other embodiment mix and match, i.e., the technical characteristic in different embodiments can be freely combined
Form more embodiments.
Those skilled in the art, which are appreciated that, to carry out adaptively the module in the equipment in embodiment
Change and they are arranged in the one or more equipment different from the embodiment.It can be the module or list in embodiment
Member or component be combined into a module or unit or component, and can be divided into addition multiple submodule or subelement or
Sub-component.Other than such feature and/or at least some of process or unit exclude each other, it may be used any
Combination is disclosed to all features disclosed in this specification (including adjoint claim, abstract and attached drawing) and so to appoint
Where all processes or unit of method or equipment are combined.Unless expressly stated otherwise, this specification (including adjoint power
Profit requires, abstract and attached drawing) disclosed in each feature can be by providing the alternative features of identical, equivalent or similar purpose come generation
It replaces.Also, in the unit claims listing several devices, several in these devices can be by same hard
Part item embodies.
Similarly, it should be understood that in order to simplify the disclosure and help to understand one or more of each open aspect,
Above in the description of the exemplary embodiment of the disclosure, each feature of the disclosure is grouped together into single implementation sometimes
In example, figure or descriptions thereof.However, the method for the disclosure should be construed to reflect following intention：It is i.e. required to protect
The disclosure of shield requires features more more than the feature being expressly recited in each claim.More precisely, as following
Claims reflect as, open aspect is all features less than single embodiment disclosed above.Therefore,
Thus the claims for following specific implementation mode are expressly incorporated in the specific implementation mode, wherein each claim itself
All as the separate embodiments of the disclosure.
Particular embodiments described above has carried out further in detail the purpose, technical solution and advantageous effect of the disclosure
It describes in detail bright, it should be understood that the foregoing is merely the specific embodiment of the disclosure, is not limited to the disclosure, it is all
Within the spirit and principle of the disclosure, any modification, equivalent substitution, improvement and etc. done should be included in the guarantor of the disclosure
Within the scope of shield.
Claims (10)
1. a kind of electroplating clamp, including：
One bottom sheet, for placing indium part to be plated, there is one first rectangle square opening in centre, is arranged in the second long side of the first rectangle square opening
There is an electrode, a guide rail is provided in the first long side of the first rectangle square opening, is used to support indium part to be plated；
Piece in one, described middle is L-shaped, and the L-shaped long side corresponds to the second long side one of the first rectangle square opening of the bottom sheet
Side, the L-shaped short side correspond to the second short side side of the first rectangle square opening of the bottom sheet；
One upper piece, upper piece the centre is provided with one second rectangle square opening, corresponding with the position of the first rectangle square opening；
Described middle, the first sliding block and the second sliding block are set to piece, between bottom sheet, and with upper piece, bottom sheet be fixedly connected, first
Sliding block and the second sliding block fix part to be electroplated for jam-packed.
2. electroplating clamp according to claim 1, wherein first sliding block is located at the first short side of the first rectangle square opening
Side, and the hollow space of the L-shaped middle formation is stretched into, second sliding block is located at the second short side of the first rectangle square opening
Side, and stretch into the hollow space that piece is formed in the L-shaped.
3. electroplating clamp according to claim 1, wherein the both ends of the second rectangle square opening are provided with the first rectangular channel and second
Rectangular channel, for the placement entrance as indium part to be plated, first rectangular channel and the second rectangular channel and the second rectangle square opening connect
It is logical in the shape of an " I ".
4. electroplating clamp according to any one of claims 1 to 3, wherein also open there are one first one end of the bottom sheet
Groove is connected with the first rectangle square opening；The middle on piece is provided with a third groove；It opens there are one the 4th described upper piece one end
Groove；
Wherein, the 4th groove, the first groove, third groove location correspond to, hole of the composition for the extraction of electrode 6.
5. electroplating clamp according to claim 4, wherein the second groove there are one being opened on the inside of the middle long side, if
It is placed in piece long side and short side junction in L-shaped, is used for placement positioning sliding block.
6. electroplating clamp according to any one of claims 1 to 3, wherein the upper surface of the bottom sheet is convex there are one first
Platform and a second boss, are used to support piece.
7. electroplating clamp according to claim 6, wherein the first boss is set to the first long side of rectangle square opening and the
The side of two long sides connection, the second boss are set to the side of the first long side of rectangle square opening.
8. electroplating clamp according to any one of claims 1 to 3, wherein on bottom sheet, middle and upper piece corresponding position
It is respectively arranged with mounting hole, a screw passes through the mounting hole, by bottom sheet, middle and upper piece fixation；
There is the opening for being passed through for screw on first sliding block and the second sliding block.
9. electroplating clamp according to any one of claims 1 to 3, wherein bottom sheet, middle, upper piece, the first sliding block, second
Sliding block, screw and guide rail are all made of insulating materials.
10. a kind of application method of such as claim 1-9 any one of them electroplating clamps, including：
Successively by bottom sheet, middle and upper piece stack and passed through with screw in order and fixed, electrode strip is then inserted into bottom sheet and upper
It is in groove between piece and fixed, and bottom sheet and upper piece between be inserted into sliding block and sliding block, be used in combination screw to pass through opening for sliding block
Mouthful；
Multiple indium parts to be plated are sequentially placed into from the first rectangular channel or the second rectangular channel, it is arranged side by side wherein, indium to be plated
Part one end is taken on the electrode, and one end rides on guide rail, after putting well successively, the second sliding block jam-packed of side, and side sliding block jam-packed,
The position of the first sliding block and the second sliding block is adjusted according to the quantity of indium part to be plated and size, after position is adjusted, is twisted successively
Tight screw, which is realized, to be fixed；
After multiple unplated pieces fix, the plating window formed by the first rectangle square opening and the second rectangle square opening carries out two-sided electricity
Plating.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810324671.1A CN108360047B (en) | 2018-04-11 | 2018-04-11 | Electroplating clamp and using method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810324671.1A CN108360047B (en) | 2018-04-11 | 2018-04-11 | Electroplating clamp and using method thereof |
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| Publication Number | Publication Date |
|---|---|
| CN108360047A true CN108360047A (en) | 2018-08-03 |
| CN108360047B CN108360047B (en) | 2020-03-17 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810324671.1A Active CN108360047B (en) | 2018-04-11 | 2018-04-11 | Electroplating clamp and using method thereof |
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Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2651264Y (en) * | 2003-06-23 | 2004-10-27 | 中国科学院半导体研究所 | Coating film rack with guides |
| CN201634787U (en) * | 2010-03-17 | 2010-11-17 | 中国电子科技集团公司第十三研究所 | Minitype block electroplating clamp |
| CN102936745A (en) * | 2012-11-02 | 2013-02-20 | 毕翊 | Fixture for plating semiconductor lead frame and plating method thereof |
| CN203307469U (en) * | 2013-06-19 | 2013-11-27 | 天津市汉沽新立电镀厂 | Hanger for electroplating |
| CN103590079A (en) * | 2012-08-14 | 2014-02-19 | 亚洲电镀器材有限公司 | Electroplating method |
| CN203747237U (en) * | 2014-03-27 | 2014-07-30 | 北京牡丹电子集团有限责任公司 | Novel semiconductor laser cavity surface film-coating clamp |
| CN105938976A (en) * | 2016-03-08 | 2016-09-14 | 北京工业大学 | Semiconductor laser cavity surface coating clamp |
| CN205811273U (en) * | 2016-06-30 | 2016-12-14 | 西安立芯光电科技有限公司 | Semiconductor laser chip cavity surface film coating fixture |
-
2018
- 2018-04-11 CN CN201810324671.1A patent/CN108360047B/en active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2651264Y (en) * | 2003-06-23 | 2004-10-27 | 中国科学院半导体研究所 | Coating film rack with guides |
| CN201634787U (en) * | 2010-03-17 | 2010-11-17 | 中国电子科技集团公司第十三研究所 | Minitype block electroplating clamp |
| CN103590079A (en) * | 2012-08-14 | 2014-02-19 | 亚洲电镀器材有限公司 | Electroplating method |
| CN102936745A (en) * | 2012-11-02 | 2013-02-20 | 毕翊 | Fixture for plating semiconductor lead frame and plating method thereof |
| CN203307469U (en) * | 2013-06-19 | 2013-11-27 | 天津市汉沽新立电镀厂 | Hanger for electroplating |
| CN203747237U (en) * | 2014-03-27 | 2014-07-30 | 北京牡丹电子集团有限责任公司 | Novel semiconductor laser cavity surface film-coating clamp |
| CN105938976A (en) * | 2016-03-08 | 2016-09-14 | 北京工业大学 | Semiconductor laser cavity surface coating clamp |
| CN205811273U (en) * | 2016-06-30 | 2016-12-14 | 西安立芯光电科技有限公司 | Semiconductor laser chip cavity surface film coating fixture |
Also Published As
| Publication number | Publication date |
|---|---|
| CN108360047B (en) | 2020-03-17 |
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