CN201623015U - Mold easy to place crystal blocks - Google Patents
Mold easy to place crystal blocks Download PDFInfo
- Publication number
- CN201623015U CN201623015U CN2010201498026U CN201020149802U CN201623015U CN 201623015 U CN201623015 U CN 201623015U CN 2010201498026 U CN2010201498026 U CN 2010201498026U CN 201020149802 U CN201020149802 U CN 201020149802U CN 201623015 U CN201623015 U CN 201623015U
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Abstract
The utility model relates to the field of semiconductor processing, in particular to a mold for arranging crystal grains. The mold easy to place crystal blocks comprises a mold body, wherein holes for placing wafers are arranged on the mold body. The mold is characterized in that the hole is in a funnel-shaped structure with large top and small bottom, and the lower part of the hole is in a cuboid shape, and the cross-section and longitudinal section of the upper part are in an isosceles trapezoid shape, or the lower part of the hole is in a cuboid shape, and the cross-section and longitudinal section of the upper part are in a right-angled trapezoid shape, or the lower part of the hole is cylindrical, and the cross-section and longitudinal section of the upper part are in an isosceles trapezoid shape. The mold easy to place crystal blocks has the effect of easily placing semiconductor crystal blocks, thereby greatly improving production efficiency.
Description
Technical field
The present invention relates to field of semiconductor processing, specifically relate to a kind of mould of arranging crystal grain.
Background technology
In semiconductor fabrication processes, a plurality of crystal grain fitly need be lined up, employed instrument is exactly a mould, and mould is middle structure with a plurality of holes, and semiconductor wafer is just in these holes when putting; These holes have up and down with all cross sections, so the difficult playback of wafer has and uses the shortcoming that bothers in the prior art.
Summary of the invention
Purpose of the present invention is exactly at above-mentioned shortcoming, and a kind of semiconductor crystal block mould of easily putting of playback easily is provided.
Technical scheme of the present invention is achieved in that the mould of easily putting crystal block, comprises die ontology, has the hole of putting wafer on the die ontology, it is characterized in that: described hole has up big and down small funnel-shaped structure.
Say that further bottom, described hole is a cuboid, the cross section on top and longitudinal section are isosceles trapezoids.
Say that further bottom, described hole is a cuboid, the cross section on top and longitudinal section are right-angled trapezium.
It is circular also having a kind of crystal block of putting, and in this case, bottom, described hole is columniform, and the cross section on top and longitudinal section are isosceles trapezoids.
The beneficial effects of the utility model are: so mould of easily putting crystal block has the effect of putting the semiconductor crystal block easily, has improved production efficiency greatly.
Description of drawings
Fig. 1 is the structural representation that the utility model is easily put one of them hole of mould of crystal block
Fig. 2 is the A-A tangent plane structural representation of Fig. 1
Fig. 3 is the B-B tangent plane structural representation of Fig. 1
Wherein: 1, die ontology 2, hole 3, bottom 4, top
Embodiment
The utility model will be further described below in conjunction with accompanying drawing.
As shown in Figure 1, easily put the mould of crystal block, comprise die ontology 1, have the hole 2 of putting wafer on the die ontology 1, it is characterized in that: described hole 2 has up big and down small funnel-shaped structure.
Say that further the bottom 3 in described hole 2 is cuboids, the cross section on top 4 and longitudinal section are isosceles trapezoids.
Say that further the bottom 3 in described hole 2 is cuboids, the cross section on top 4 and longitudinal section are right-angled trapezium, as shown in Figures 2 and 3.
It is circular also having a kind of crystal block of putting, and in this case, bottom, described hole 3 is columniform, and the cross section on top 4 and longitudinal section are isosceles trapezoids.
When using this mould, because it has up big and down small structure, crystal block is concluded in the hole easily, thereby enhances productivity.
Claims (4)
1. a mould of easily putting crystal block comprises die ontology, has the hole of putting wafer on the die ontology, it is characterized in that: described hole has up big and down small funnel-shaped structure.
2. mould according to claim 1 is characterized in that: bottom, described hole is a cuboid, and the cross section on top and longitudinal section are isosceles trapezoids.
3. mould according to claim 1 is characterized in that: bottom, described hole is a cuboid, and the cross section on top and longitudinal section are right-angled trapezium.
4. mould according to claim 1 is characterized in that: bottom, described hole is columniform, and the cross section on top and longitudinal section are isosceles trapezoids.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010201498026U CN201623015U (en) | 2010-04-06 | 2010-04-06 | Mold easy to place crystal blocks |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010201498026U CN201623015U (en) | 2010-04-06 | 2010-04-06 | Mold easy to place crystal blocks |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201623015U true CN201623015U (en) | 2010-11-03 |
Family
ID=43026471
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010201498026U Expired - Fee Related CN201623015U (en) | 2010-04-06 | 2010-04-06 | Mold easy to place crystal blocks |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201623015U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102862396A (en) * | 2012-08-04 | 2013-01-09 | 江苏吉星新材料有限公司 | Chip marking positioning die |
-
2010
- 2010-04-06 CN CN2010201498026U patent/CN201623015U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102862396A (en) * | 2012-08-04 | 2013-01-09 | 江苏吉星新材料有限公司 | Chip marking positioning die |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20101103 Termination date: 20110406 |