CN201611679U - Installation structure of a dielectric resonator - Google Patents
Installation structure of a dielectric resonator Download PDFInfo
- Publication number
- CN201611679U CN201611679U CN2010201199151U CN201020119915U CN201611679U CN 201611679 U CN201611679 U CN 201611679U CN 2010201199151 U CN2010201199151 U CN 2010201199151U CN 201020119915 U CN201020119915 U CN 201020119915U CN 201611679 U CN201611679 U CN 201611679U
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- Prior art keywords
- dielectric resonator
- cavity
- metal temperature
- temperature buffer
- thermal expansion
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Abstract
The utility model relates to an installation structure of a dielectric resonator, comprising a dielectric resonator and a cavity, characterized in that: a metal temperature buffer slice is arranged between the dielectric resonator and the cavity and the thermal expansion coefficient of the metal temperature buffer slice is between the thermal expansion coefficient of the dielectric resonator and the thermal expansion coefficient of the cavity. The installation structure of the dielectric resonator is designed by the thermal conduction and thermal expansion theory and the principle that different thermal expansion coefficients of different materials result into different thermal expansion states. The metal temperature buffer slice with relatively good conductivity performance and thermal expansion coefficient between that of the dielectric resonator and the cavity is arranged between the dielectric resonator and the cavity and after high, low temperature recycling, its deformation degree is between that of the medium material and the cavity material, to play the buffer function. The dielectric resonator is newer, better and has more stable performance and the stability of the product is greatly increased compared with the traditional design.
Description
Technical field
The utility model relates to the dielectric resonator in microwave communication field, relates in particular to the mounting structure of dielectric resonator.
Background technology
Existing dielectric filter has various modes, and wherein the dielectric filter of TM pattern often is welded direct to dielectric resonator on the cavity, as Fig. 5, shown in Figure 6, can maximally utilise the Q value of dielectric resonator like this.Yet because the thermal coefficient of expansion of dielectric material and cavity material differs bigger, through the circulation of high low temperature, dielectric material and cavity material deformation quantity are inconsistent, cause dielectric resonator crackle or fracture to occur, thereby have influence on the overall performance of dielectric filter.
Summary of the invention
The purpose of this utility model is the deficiency that exists in the above-mentioned background technology in order to solve, and proposes a kind of simple in structurely, easy for installation, can prevent that the mounting structure of the dielectric resonator of crackle or fracture from appearring in dielectric resonator through the circulation of high low temperature.
For achieving the above object, the utility model adopts following mounting means: a kind of mounting structure of dielectric resonator, comprise dielectric resonator and cavity, it is characterized in that, be provided with the metal temperature buffer substrate tablet between dielectric resonator and cavity, the hot swollen account coefficient of this metal temperature buffer substrate tablet is between the hot swollen account coefficient of the hot swollen account coefficient of dielectric resonator and cavity.
The shape of cross section of described metal temperature buffer substrate tablet is corresponding with the dielectric resonator shape of cross section, and the cross-sectional area of metal temperature buffer substrate tablet is not more than the cross-sectional area of dielectric resonator.
The tangent plane that described dielectric resonator is connected with the metal temperature buffer substrate tablet can adopt the method for welding to link together with the tangent plane that the metal temperature buffer substrate tablet is connected with cavity.
But one side sintered copper or silver that described dielectric resonator is connected with the metal temperature buffer substrate tablet.
The thickness of described metal temperature buffer substrate tablet is preferably less than the height of dielectric resonator.
The utility model is according to heat conduction and thermal expansion theory, the inconsistent different principle design of thermal expansion situation that causes of the hot swollen account coefficient of different materials.Add thermal coefficient of expansion between and the better metal temperature buffer substrate tablet of electric conductivity between dielectric resonator and cavity, through high low temperature circulation, its deformation degree is between dielectric material and cavity material, to play cushioning effect.Realize that a kind of renewal is more excellent and performance is more stable dielectric filter, with respect to traditional design, improve the stability of product greatly.
Description of drawings
Fig. 1 is the stereogram of embodiment cavity.
Fig. 2 is the stereogram of embodiment dielectric resonator.
Fig. 3 is the stereogram of embodiment metal temperature buffer substrate tablet.
Fig. 4 is the stereogram after embodiment assembles
Fig. 5 is the longitudinal sectional view of Fig. 4.
Fig. 6 is the stereogram of traditional sucrose resonator mounting structure.
Fig. 7 is the longitudinal sectional view of Fig. 6.
Embodiment
Embodiment: referring to figs. 1 through Fig. 5.Present embodiment mainly is made up of main components such as dielectric resonator 1, metal temperature buffer substrate tablet 3, cavitys 2.With reference to Fig. 4, Fig. 5, in the middle of dielectric resonator 1 and cavity 2, fix a metal temperature buffer substrate tablet with the soldering paste welding, and sintered copper that is connected with the metal temperature buffer substrate tablet at dielectric resonator or silver.The shape of metal temperature buffer substrate tablet is the disk shape as shown in Figure 3, and material is electric conductivity preferred metal such as iron, copper, and its hot swollen account coefficient is between dielectric resonator and cavity, and its thickness is less than dielectric resonator.The shape of dielectric resonator as shown in Figure 2, for cylindric, material is a pottery, its cross section radius is identical with metal temperature buffer substrate tablet cross section radius or less than metal temperature buffer substrate tablet cross section radius, as shown in Figure 4.The shape of cavity as shown in Figure 1, it is made by metal material.
Claims (5)
1. the mounting structure of a dielectric resonator, comprise dielectric resonator and cavity, it is characterized in that, be provided with the metal temperature buffer substrate tablet between dielectric resonator and cavity, the hot swollen account coefficient of this metal temperature buffer substrate tablet is between the hot swollen account coefficient of the hot swollen account coefficient of dielectric resonator and cavity.
2. the mounting structure of dielectric resonator according to claim 1, the shape of cross section that it is characterized in that described metal temperature buffer substrate tablet is corresponding with the dielectric resonator shape of cross section, and the cross-sectional area of metal temperature buffer substrate tablet is not more than the cross-sectional area of dielectric resonator.
3. the mounting structure of dielectric resonator according to claim 1 is characterized in that the tangent plane that described dielectric resonator is connected with the metal temperature buffer substrate tablet adopts the method for welding to link together with the tangent plane that the metal temperature buffer substrate tablet is connected with cavity.
4. the mounting structure of dielectric resonator according to claim 1, sintered copper that it is characterized in that described dielectric resonator is connected with the metal temperature buffer substrate tablet or silver.
5. according to the mounting structure of the described dielectric resonator of arbitrary claim in the claim 1 to 4, it is characterized in that the height of the thickness of described metal temperature buffer substrate tablet less than dielectric resonator.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010201199151U CN201611679U (en) | 2010-02-10 | 2010-02-10 | Installation structure of a dielectric resonator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010201199151U CN201611679U (en) | 2010-02-10 | 2010-02-10 | Installation structure of a dielectric resonator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201611679U true CN201611679U (en) | 2010-10-20 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010201199151U Expired - Lifetime CN201611679U (en) | 2010-02-10 | 2010-02-10 | Installation structure of a dielectric resonator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201611679U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102222811A (en) * | 2011-03-28 | 2011-10-19 | 聚信科技有限公司 | Filter |
| CN103531869A (en) * | 2012-07-03 | 2014-01-22 | 罗森伯格（上海）通信技术有限公司 | TM mold dielectric filter |
| CN103972618A (en) * | 2014-03-28 | 2014-08-06 | 华为机器有限公司 | TM (transverse magnetic)-mode dielectric filter |
-
2010
- 2010-02-10 CN CN2010201199151U patent/CN201611679U/en not_active Expired - Lifetime
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102222811A (en) * | 2011-03-28 | 2011-10-19 | 聚信科技有限公司 | Filter |
| CN103531869A (en) * | 2012-07-03 | 2014-01-22 | 罗森伯格（上海）通信技术有限公司 | TM mold dielectric filter |
| CN103531869B (en) * | 2012-07-03 | 2017-11-24 | 罗森伯格（上海）通信技术有限公司 | A kind of TM moulds dielectric filter |
| CN103972618A (en) * | 2014-03-28 | 2014-08-06 | 华为机器有限公司 | TM (transverse magnetic)-mode dielectric filter |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: WUHAN FAN'GU CERAMIC MATERIALS CO., LTD. Free format text: FORMER OWNER: WUHAN FANGU ELECTRONIC TECHNOLOGY CO., LTD. Effective date: 20140929 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: 430205 WUHAN, HUBEI PROVINCE TO: 430200 WUHAN, HUBEI PROVINCE |
|
| TR01 | Transfer of patent right |
Effective date of registration: 20140929 Address after: 430200, No. two, East Industrial Park, East Lake Development Zone, Hubei, Wuhan Patentee after: WUHAN FINGU CERAMIC MATERIAL CO., LTD. Address before: 430205 Hubei Province, Wuhan city Jiangxia District Guan Feng Lu canglongdao fingu Industrial Park, building 4, floor 2 Patentee before: Wuhan Fingu Electronic Technology Co., Ltd. |
|
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20101020 |