CN201608169U - Upper pressing plate used for bonding of power device - Google Patents
Upper pressing plate used for bonding of power device Download PDFInfo
- Publication number
- CN201608169U CN201608169U CN2010201191075U CN201020119107U CN201608169U CN 201608169 U CN201608169 U CN 201608169U CN 2010201191075 U CN2010201191075 U CN 2010201191075U CN 201020119107 U CN201020119107 U CN 201020119107U CN 201608169 U CN201608169 U CN 201608169U
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- CN
- China
- Prior art keywords
- plate body
- top board
- lead frame
- connecting plate
- pin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model relates to an upper pressing plate (100) used for the bonding of a power device, wherein a plate body (10) is provided with a big through hole (20) and a row of fastening sheets (30); a lead frame pin and a slide area are exposed out of the big through hole; the fastening sheets (30) can be adjusted independently and are used for pressing the lead frame pin; further, the fastening sheet comprises a connecting part (31) and an adjustment pressing sheet (32); the connecting part is connected with the plate body; the adjustment pressing sheet is used for pressing the lead frame pin; a plurality of adjusting screws (33) corresponding to the adjustment pressing sheets one to one are arranged downwards from the upper surface of the plate body in a penetrating way; and the tail end of each adjusting screw can touch one adjustment pressing sheet (32). The adjusting screws can independently adjust each adjustment pressing sheet to clamping the pin, so as to prevent the problems of insufficient-solder bonding, unreliable and unsteady bonding, and the like caused by the springing of the pin. The plate body is provided with an air nozzle (41), a main air channel (42) and a plurality of puff ports (43) that are communicated, wherein the puff ports (43) can puff air toward the fastening sheets, so as to protect the air to directly flow to the slide area of a lead frame and fully protecting the slide area of the silver spot-plated lead frame from being oxidized.
Description
Technical field
The utility model relates to the semi-conductor discrete device sealed in unit, the structure of the top board that need use when particularly relating to a kind of power device bonding.
Background technology
The encapsulation of semi-conductor discrete device comprises bond sequence, bonding is meant with gold thread (or copper cash) and is connected with two pins of lead frame with the mode of ultrasonic bonding B, E the two poles of the earth with power device chip, during bonding, a plurality of lead frames 300 that are linked to be a row are fastened between top board 100 and the lower platen 200 and carry out bonding.In the prior art, top board and lower platen are respectively an integral body, the structure of top board 100 comprises plate body 10, the both sides of plate body are the fixed parts 50 that exceeds plate body, be used for being connected with bonding apparatus, be provided with a square large through-hole 20 at the middle part of plate body, during bonding, the pin 301 of lead frame and slide glass district 302 and on chip expose so that it is carried out ultrasonic bonding from this large through-hole 20, in the hole, stretch out a plurality of connecting plates 30 corresponding of a row in a side of described large through-hole 20 on the plate body 10 with lead frame pin 301, be used for pushing down pin 301, prevent its springing, make firm welding.These connecting plates 30 are one-body molded with plate body, for fixed, can't regulate.Between lead frame, there are differences; or the distortion of upper and lower pressing plate in long-time heating is used; upper and lower pressing plate then takes place easily can not fasten each lead frame fully; like this; in bonding process, just have the springing of part pin, pin bonding rosin joint phenomenon occurs, cause bonding reliability not high; the situation of mending line occurs shutting down through regular meeting in the production, reduce production efficiency.
In addition; in order to increase the solderability of lead frame pin ultrasonic bonding; when bonding, lead frame need be heated to 180 ℃～300 ℃ usually, and this causes the oxidation of lead frame easily; in order to prevent its oxidation; in advance that lead frame is silver-plated, be divided into silver-plated entirely, half silver-plated mode, the slide glass district at high temperature is difficult for oxidation after silver-plated; so need not lead frame is implemented Buchholz protection, but silver-plated area causes price higher more greatly.For the cost that economizes in raw materials, the lead frame that adopts point silver-plated is arranged, promptly only silver-plated at the bonding position of pin, like this, therefore the easy oxidation in slide glass district considers to apply N
2And H
2Mixed gas protected.The guide rail that loads lead frame on bonding apparatus is closed, has in the guide rail and can implement N
2And H
2Mixed gas protected structure, and the guide rail of loading lead frame is an evolution formula guide rail on bonding apparatus, does not then have the N of enforcement
2And H
2Mixed gas protected structure, and existing top board also is not used in the Buchholz protection structure.
Summary of the invention
The technical problems to be solved in the utility model can fasten each lead frame respectively, prevent the top board structure of pin springing when providing a kind of bonding.
For solving the problems of the technologies described above, the top board of using when the utility model provides a kind of power device bonding, the plate body that comprises top board, described plate body is provided with the large through-hole that supplies lead frame pin and slide glass district to expose, the a plurality of connecting plates that are used for pushing down the lead frame pin of one row stretch out in through hole from a side of large through-hole on the plate body, it is characterized in that the shell fragment of each connecting plate for regulating separately.
Described connecting plate is attached to the plate body lower surface, it comprises the connecting portion of one and regulates compressing tablet, described connecting portion removably is connected in plate body, the external end head of described adjusting compressing tablet stretches into large through-hole and is used for pushing down the lead frame pin, from described plate body upper surface be equipped with downwards a plurality of with regulate compressing tablet adjustment screw one to one, the end of each adjustment screw can touch an adjusting compressing tablet.
Two adjusting compressing tablets that can be pressed on the pin of same lead frame both sides are arranged on each connecting plate.
The punched formation opening in centre position at described connecting plate adjusted compressing tablet place, described connecting portion and two adjusting compressing tablets form " Y " shape.
The outer end of described connecting plate is connected with plate body by trip bolt; Described connecting plate is that resilient silicon steel material is made.
The technical problem that the utility model further will solve provide have insufflation channel, can be easily to select silver-plated lead frame slide glass district blow protection, prevent the top board structure of slide glass district oxidation.For solving this technical problem, provide described plate body be provided with can external source of the gas valve, also be provided with the main air flow passage that is communicated with valve in the plate body, on the plate body of described large through-hole one side, in the opposite of connecting plate, be provided with main air flow passage a plurality of inflatable mouths that communicate, can blow to the connecting plate direction.
Described valve is two, is located at a side relative with connecting plate on the plate body, and lays respectively at the two ends of plate body.
Described main air flow passage is located in the plate body with the valve homonymy, is the horizontal main air flow passage along the plate body length direction.
Described inflatable mouth is corresponding one by one with the adjusting compressing tablet.
Described inflatable mouth gas channel is high outside and low outside, to connecting plate inclination miter angle.
The beneficial effects of the utility model are: because each connecting plate that is provided with on the top board of the present utility model is independent adjustable, the corresponding adjusting compressing tablet of each pin, can adjust the degree of compressing separately, so can guarantee that each pin is all compacted, add that the shell fragment material is resilient silicon steel material, even the variant slightly or upper and lower pressing plate of each lead frame slightly is out of shape, can guarantee that also each pin is compacted, thereby prevent problems such as the bonding rosin joint, the bonding that cause because of the pin springing are unreliable, instability.In addition, be provided with air flue in the top board, can external N
2, H
2Protective gas such as mist, and directly lead to the slide glass district of lead frame, the slide glass district of selecting silver-plated lead frame of can adequately protecting is not oxidized.
Description of drawings
Below in conjunction with the drawings and specific embodiments the utility model is further elaborated.
Fig. 1 is that the master that the silver-plated lead frame of point of background technology is fastened between top board and the lower platen looks schematic diagram.
Fig. 2 is the schematic top plan view of Fig. 1.
Fig. 3 is the integral type top board floor map of background technology.
Fig. 4 is the three-dimensional profile schematic diagram in adjustable spring-piece type air blowing pressing plate of the present utility model front.
Fig. 5 is the three-dimensional profile schematic diagram of adjustable spring-piece type air blowing pressing plate reverse side of the present utility model.
Fig. 6 is the floor map of adjustable spring-piece type air blowing pressing plate reverse side of the present utility model.
Embodiment
As Fig. 4-the 6th, the top board of using during power device bonding of the present utility model 100, the plate body 10 that comprises top board, the both sides of plate body are the fixed parts 50 that exceeds plate body, round tube hole, the right side of a diameter 2.7mm are arranged is the stripe shape through hole of wide 2.7mm, long 4.5mm in fixed part 50 left sides among Fig. 2, its effect is to be used for being connected with bonding apparatus, be provided with a square large through-hole 20 at the middle part of plate body, during bonding, the pin 301 of lead frame 300 and slide glass district 302 and on chip expose so that it is carried out ultrasonic bonding (seeing also Fig. 2) from this large through-hole 20.The a plurality of connecting plates 30 of one row stretch out in large through-hole from a side of large through-hole on the plate body, are used for pushing down the lead frame pin during ultrasonic bonding, prevent the pin springing.The shell fragment of each connecting plate 30 for regulating separately, make with resilient silicon steel material, be attached to plate body 10 lower surfaces, it comprises each connecting plate 30 connecting portion 31 of one and regulates compressing tablet 32, the connecting portion 31 of described connecting plate 30 outer ends by trip bolt 34 dismountings be connected plate body 10 lower surfaces.The punched formation opening in centre position at each connecting plate 30 adjusted compressing tablets 32 place, each adjusting compressing tablet 32 of opening both sides, described connecting portion 31 and two adjusting compressing tablets 32 form " Y " shape.Two adjusting compressing tablets can be pressed on the pin of same lead frame both sides.Each external end head of regulating compressing tablet 32 stretches into and is used for voltage lead wires framework pin in the large through-hole 20, from described plate body 10 upper surfaces be equipped with downwards a plurality of with regulate compressing tablet 32 adjustment screw 33 one to one, the end of each adjustment screw can touch an adjusting compressing tablet 32.So just can regulate the amplitude of the corresponding downward pressure pipe pin of adjustment screw, thereby realize adjusting separately the degree that compresses of each pin, guarantee that each pin is all compacted according to the needs of each pin.
In order to implement the protection of blowing in the slide glass district to lead frame; on top board 100, also be provided with the air blowing structure; on described plate body 10, be provided with can external source of the gas valve 41; valve is a hollow; shown in the dotted line of Fig. 6, also be provided with the main air flow passage 42 that is communicated with valve in the plate body 10, on the plate body of described through hole one side; in the opposite of connecting plate 30, be provided with main air flow passage 42 a plurality of inflatable mouths 43 that communicate, can blow to connecting plate 30 directions.As preferred embodiment, described valve is two, be located on the plate body 10 side relative with connecting plate 30, and lay respectively at the two ends of plate body, and main air flow passage 42 is located in the plate body 10 with valve 41 homonymies, be the horizontal main air flow passage along the plate body length direction, described inflatable mouth 43 is over against regulating compressing tablet, and compressing tablet 32 is corresponding one by one with regulating; As can be seen from Fig. 1, lead frame 300 be pressed in pull 100 below, for guaranteeing that slide glass district 302 can be by N
2And H
2Mist fully blows to not oxidized, and described inflatable mouth 43 gas channels are high outside and low outside, to regulating compressing tablet inclination miter angle.
Like this, insert external air source (H for example by valve
2, N
2Mist), flows to inflatable mouth, because inflatable mouth has 45 ° of inclinations, H to regulating the compressing tablet direction through horizontal main airway passage
2, N
2Mist directly blows to lead frame slide glass district by inflatable mouth, thereby surface, slide glass district alleviates, prevented the oxidation of slide glass district.
Claims (10)
1. the top board of using during a power device bonding (100), the plate body (10) that comprises top board, described plate body is provided with the large through-hole (20) that supplies lead frame pin and slide glass district to expose, the a plurality of connecting plates (30) that are used for pushing down the lead frame pin of one row stretch out in through hole from a side of large through-hole on the plate body, it is characterized in that the shell fragment of each connecting plate (30) for regulating separately.
2. top board according to claim 1 (100), it is characterized in that, described connecting plate (30) is attached to plate body (10) lower surface, it comprises the connecting portion (31) of one and regulates compressing tablet (32), described connecting portion (31) removably is connected in plate body (10), the external end head of described adjusting compressing tablet (32) stretches into large through-hole (20) and is used for pushing down the lead frame pin, from described plate body (10) upper surface be equipped with downwards a plurality of with regulate compressing tablet (32) adjustment screw (33) one to one, the end of each adjustment screw can touch an adjusting compressing tablet (32).
3. top board according to claim 2 (100) is characterized in that, two adjusting compressing tablets (32) that can be pressed on the pin of same lead frame both sides are arranged on each connecting plate (30).
4. top board according to claim 3 (100) is characterized in that, the punched formation opening in centre position at described connecting plate (30) adjusted compressing tablet (32) place, and described connecting portion (31) and two adjusting compressing tablets (32) form " Y " shape.
5. top board according to claim 2 (100) is characterized in that, the outer end of described connecting plate (30) is connected with plate body (10) by trip bolt (34); Described connecting plate (30) is made for resilient silicon steel material.
6. according to each described top board (100) of claim 1-5, it is characterized in that, described plate body (10) be provided with can external source of the gas valve (41), also be provided with the main air flow passage (42) that is communicated with valve in the plate body (10), on the plate body of described large through-hole one side, opposite in connecting plate (30) is provided with main air flow passage (42) a plurality of inflatable mouths (43) that communicate, can blow to connecting plate (30) direction.
7. top board according to claim 6 (100) is characterized in that described valve is two, is located at plate body (10) and goes up a side relative with connecting plate (30), and lay respectively at the two ends of plate body.
8. top board according to claim 6 (100) is characterized in that, described main air flow passage (42) is located in the plate body (10) with valve (41) homonymy, is the horizontal main air flow passage along the plate body length direction.
9. top board according to claim 6 (100) is characterized in that, described inflatable mouth (43) is corresponding one by one with adjusting compressing tablet (32).
10. top board according to claim 6 (100) is characterized in that, described inflatable mouth (43) gas channel is high outside and low outside, to connecting plate inclination miter angle.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010201191075U CN201608169U (en) | 2010-02-11 | 2010-02-11 | Upper pressing plate used for bonding of power device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010201191075U CN201608169U (en) | 2010-02-11 | 2010-02-11 | Upper pressing plate used for bonding of power device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201608169U true CN201608169U (en) | 2010-10-13 |
Family
ID=42952872
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010201191075U Expired - Fee Related CN201608169U (en) | 2010-02-11 | 2010-02-11 | Upper pressing plate used for bonding of power device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201608169U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107891208A (en) * | 2017-11-13 | 2018-04-10 | 广西岑科电子工业有限公司 | Line ball pin mechanism before soldering |
| CN111463163A (en) * | 2020-04-09 | 2020-07-28 | 深圳市东昕科技有限公司 | High-precision pressing device |
| CN112117213A (en) * | 2020-08-04 | 2020-12-22 | 株洲中车时代半导体有限公司 | Module bonding clamp plate structure and IGBT module |
-
2010
- 2010-02-11 CN CN2010201191075U patent/CN201608169U/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107891208A (en) * | 2017-11-13 | 2018-04-10 | 广西岑科电子工业有限公司 | Line ball pin mechanism before soldering |
| CN111463163A (en) * | 2020-04-09 | 2020-07-28 | 深圳市东昕科技有限公司 | High-precision pressing device |
| CN111463163B (en) * | 2020-04-09 | 2021-03-26 | 深圳市东昕科技有限公司 | High-precision pressing device |
| CN112117213A (en) * | 2020-08-04 | 2020-12-22 | 株洲中车时代半导体有限公司 | Module bonding clamp plate structure and IGBT module |
| CN112117213B (en) * | 2020-08-04 | 2024-08-13 | 株洲中车时代半导体有限公司 | Module bonding clamp plate structure and IGBT module |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20101013 Termination date: 20180211 |