CN201599728U - LED illuminating lamp with second-grade heat dissipation and enhanced luminance - Google Patents

LED illuminating lamp with second-grade heat dissipation and enhanced luminance Download PDF

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Publication number
CN201599728U
CN201599728U CN2009200095966U CN200920009596U CN201599728U CN 201599728 U CN201599728 U CN 201599728U CN 2009200095966 U CN2009200095966 U CN 2009200095966U CN 200920009596 U CN200920009596 U CN 200920009596U CN 201599728 U CN201599728 U CN 201599728U
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China
Prior art keywords
radiator
led lamp
led
led chip
lamp
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Expired - Lifetime
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CN2009200095966U
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Chinese (zh)
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郑榕彬
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Individual
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Individual
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Priority to CN2009200095966U priority Critical patent/CN201599728U/en
Priority to CA2759812A priority patent/CA2759812A1/en
Priority to KR1020117025361A priority patent/KR20120023619A/en
Priority to EP09842042.5A priority patent/EP2411727A4/en
Priority to PCT/CN2009/000927 priority patent/WO2010108305A1/en
Application granted granted Critical
Publication of CN201599728U publication Critical patent/CN201599728U/en
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched

Abstract

The utility model provides an LED lamp which comprises an LED chip and a lamp cup which is arranged at the outer part of the LED chip. At least one of the outer bottom and the inner bottom of the lamp cup is formed by a plane back type laser light reflection technology, thereby effectively improving the reflection rate of beam and adjusting the color temperature through the characteristic of laser light reflection. The LED lamp further comprises a first-grade heat dissipation body with a plurality of inclined surfaces and a second-grade heat dissipation body which is connected with the first-grade heat dissipation body, wherein the top of the first-grade heat dissipation body is provided with at least one LED chip. By adopting a second-grade heat dissipation technology, the LED lamp can greatly improve the heat dissipation efficiency. The top of the first-grade heat dissipation body is provided with an LED chip support with a certain height, and the LED chip is arranged on the support, so that a beam emitting angle of the chip to the space maximally can be 270 degrees, thus not only improving the radiation angle, but also better guaranteeing the average strength and the homogeneity of illumination.

Description

The LED illuminating lamp that adopts secondary heat radiation and brightness to strengthen
Technical field
The utility model relate generally to LED lighting, more specifically, the utility model relates to a kind of LED illuminating lamp with high cooling efficiency, large illuminating angle degree and even intensity of illumination.
Background technology
Along with the development of light emitting diode (LED) technology, increasing high-powered LED lamp is designed to illumination, for example illumination at home.With respect to lighting sources such as existing incandescent lamps, the LED light fixture has brightness abundance, energy-conservation, plurality of advantages such as reliability is high, the life-span is long, and this makes it have more wide application prospect at lighting field.
For great power LED, the quality of radiating effect becomes the key factor of its performance of decision.The LED lamp of prior art is that the led chip that at least one is packaged is arranged on the matrix to form light source independent or array, is close to matrix simultaneously and connects radiator to promote distributing of heat.As China Patent No. is in the LED bulb structure-improved patent of " 200720141005.1 ", is provided with a lamp holder in the lamp outside, and inside is provided with the light emitting diode of light source, is fitted with the increasing fin of an area greater than the pedestal area in base bottom.Chinese invention patent application CN101349415A then discloses a kind of high-powered LED lamp heat loss through convection device, its technical scheme that adopts be the heat radiation plate body a side be provided with one group of LED lamp, opposite side at the heat radiation plate body is provided with one group of heat radiation projection, and is provided with the auxiliary heat dissipation plate in auxiliary heat dissipation projection and cross-ventilation hole in the both sides of heat radiation plate body mounting groove.Though the radiator structure of these direct contact types has reduced the thermal resistance between pedestal and the fin, produce at short notice under the situation of more heat transfer, still there is the problem of heat accumulation.
In addition, though these LED lamps can satisfy common lighting demand, because its LED illuminator all is positioned at same plane, therefore the light directive property of being launched is strong and range of exposures is less.At the irradiating angle problem of smaller, Chinese invention patent application CN101182916A discloses a kind of LED light fixture, it comprises some LED and LED supporting body, and described LED supporting body has the 2nd LED loading end that the LED loading end that is plane and equal angles are distributed in the inclination on the circumference.This structure can enlarge and optical range, but because its inclined plane is discontinuous and the inclined plane on LED only be positioned on the sphere so distribution of its intensity of illumination and inhomogeneous.
From the above, need provide a kind of radiating efficiency height, irradiating angle is big and the uniform LED illuminating lamp of intensity of illumination, to solve the existing in prior technology problem.
The utility model content
In order to overcome the deficiencies in the prior art, the utility model provides a kind of New LED illuminating lamp, and this kind LED lamp can improve radiating efficiency, increases irradiating angle, ensures the mean intensity of illumination simultaneously well, reaches good illuminating effect.
According to an aspect of the present utility model, a kind of LED lamp is provided, it comprises led chip and is arranged on the Lamp cup of described led chip outside, and the outer bottom of described Lamp cup and inner bottom part one of at least adopt the rear-mounted radium-shine reflective technology in plane to form, to increase reflecting rate and to change colour temperature.
Preferably, described LED lamp also comprises one-level radiator and secondary radiator, and described one-level radiator has one or more inclined-planes, and each described one-level radiator top is provided with at least one led chip.
Preferably, described one-level radiator is connected with described secondary radiator to small part or contacts.
Preferably, described one-level radiator is radial periodic distribution along the central shaft of described secondary radiator, and adjacent inclined-plane has different inclinations angle.
Preferably, the led chip bearing with certain altitude is formed on described one-level radiator top, and described led chip is seated on the described bearing.
More preferably, the height of described led chip bearing between 1.2-3mm, thereby make the light emission angle maximum around the led chip can reach 270 °.
Preferably, the tilt angle ranges on the inclined-plane of described one-level radiator is 10 ° to 80 °.
Preferably, the support of described one-level radiator for forming by metal material processing.
Preferably, the described secondary radiator block of metallic material that is casting forming.
Preferably, the outside of described secondary radiator has the fin of aliform.
Preferably, by two stage cooling structures, make the temperature of one-level radiator remain on 80 ℃-120 ℃, the temperature of secondary radiator remains on below 90 ℃.
Preferably, described Lamp cup is made with transparent material.
Address related objective on realizing, the utility model is included in the feature of hereinafter fully describing and particularly pointing out in claims.Below explanation and accompanying drawing are described some exemplary embodiment of the present utility model in detail.Yet these embodiment are exemplary, and principle of the present utility model can have some and the embodiment that is equal to disclosed herein.
Description of drawings
Other target of the present utility model, advantage and new feature will become obviously to detailed description of the present utility model and in conjunction with the following drawings by following, and identical Reference numeral refers to identical part in the accompanying drawing, wherein:
Fig. 1 is the side view according to the LED lamp of the utility model preferred embodiment;
Fig. 2 is the local enlarged diagram according to the Lamp cup of the utility model preferred embodiment and one-level radiator;
Fig. 3 is the local enlarged diagram according to the led chip of the utility model preferred embodiment and chip-carrier;
Fig. 4 is the vertical view according to the LED lamp of the utility model preferred embodiment;
Fig. 5 is the local enlarged diagram according to the led chip of the utility model preferred embodiment and binding post;
Fig. 6 is the circuit connection diagram according to the utility model preferred embodiment.
The specific embodiment
The utility model provides a kind of new LED illuminating lamp, and it comprises led chip and be arranged on the Lamp cup of led chip outside, and the outer bottom of this Lamp cup and inner bottom part one of at least adopt the rear-mounted radium-shine reflective technology in plane to form, to increase reflecting rate and to change colour temperature.In a preferred embodiment, this LED etc. can also comprise one-level radiator, secondary radiator, and each one-level radiator top is provided with at least one led chip.The secondary heat dissipation technology that this LED lamp is adopted makes the temperature of one-level radiator remain on 80 ℃-120 ℃, and the temperature of secondary radiator remains on below 90 ℃, thereby can greatly improve radiating efficiency.
Below with reference to the accompanying drawings LED illuminating lamp of the present utility model is described in detail.
With reference now to Fig. 1,, it is the side view according to the LED lamp of a preferred embodiment of the utility model.The LED lamp of this embodiment mainly comprises the inside direct current supply electron plate 13 shown in led chip 1, Lamp cup 3, lamp holder 12, one-level radiator 2 and secondary radiator 8 and the dotted portion, wherein lamp holder or lamp socket 12 are used to connect the 220V AC power so that be the power supply of LED lamp, it has identical specification with the corresponding lamp holder of tungsten filament lamp for general service, thereby this LED lamp can be replaced currently used fluorescent lamp easily.
One-level radiator 2 is good and have the metal of certain mechanical strength by heat conductivility, it is as the support that supports led chip or illuminator, this support can be made by conventional machinery processing technology (as cutting), for example utilize technologies formation a plurality of inclined-planes 15 and 15 ' as shown in Figure 1 such as cutting, cutting technique, these inclined-planes are general radial periodic distribution or roughly symmetrical distribution (referring to Fig. 3) around the central shaft of LED lamp, and inwardly downward-sloping with respect to central plane.Can wait coating process to make these inclined-planes have extraordinary light source reflectivity by for example plating, thereby improve light utilization efficiency.These inclined-planes can have identical or different inclinations angle with respect to central plane, for example can be provided with these inclined-planes, so that adjacent inclined-plane has different inclinations angle.For example as can be seen from Figure 1, the inclination angle a on inclined-plane 15 is greater than the inclination angle b on inclined-plane 15 '.As an alternative, when inclined-plane quantity is abundant, can making at interval, two inclined-planes on one or more inclined-planes have identical inclination angle, just the inclination angle on inclined-plane can periodically change, thereby make also cyclically-varying of the irradiation of LED illuminator on the whole circumference direction, to improve the uniformity of illumination on all directions.In order to realize best illuminating effect, preferably the inclination angle on all inclined-planes on the one-level radiator 2 is limited in 10 ° to 80 ° the scope, as 10 °, 15 °, 20 °, 30 °, 45 °, 60 °, 70 °, 75 ° or 80 ° etc.
At least one led chip that is in Lamp cup 3 inside is set as light emitting source at the top of each one-level radiator 2.Lamp cup 3 can adopt material transparent, and for example PC material (being Merlon) or polymer are made.According to the needs of light efficiency, also can adopt ground glass or translucent other plastic materials to make various difform Lamp cups 3, with the soften of increase light and the aesthetics of LED lamp.Lamp cup outer bottom 33 and inner bottom part 33 ' one of at least adopt the rear-mounted radium-shine reflective fabrication techniques in plane to become a lot of reflective surfaces, improving the reflectivity of light, thereby increase luminosity.Because the characteristic of radium-shine processing, light change the part colour temperature after shining reflective surface, therefore can reduce of the stimulation of direct-view light to eyes.
The local enlarged diagram of Fig. 2 has shown the configuration structure of Lamp cup 3 with one-level radiator 2.As can be seen from the figure, below Lamp cup 3, be provided with insulator 5, be used to strengthen the relative position setting of LED power line 4 and one-level radiator 2.LED power line 4 that is formed by conductive materials and one-level radiator 2 pass from insulator 5 and further extend to Lamp cup 3 inside, form the LED electric source line interface that is connected with led chip 1 by bonding line 20 respectively and are used to install the chip-carrier of led chip 1.The extension downwards of the other end of LED power line 4 is connected to the pcb board 32 that is used among Fig. 1 to each led chip 1 power supply.The other end of one-level radiator 2 also extends downwards and width increases, so that be fixed on the secondary radiator 8 by through hole 22 with bigger contact area.Be perfused with conventional transparent gel 14 (for example silica gel) in Lamp cup 3 inside, be used to protect led chip 1 and bonding line 20.
Fig. 3 has shown the set-up mode of led chip in detail by local enlarged diagram, wherein led chip 1 top that is set at one-level radiator 2 has on the led chip bearing of certain altitude h, described height h can be designed to approximately between the 1.2-3mm, thereby make chip increase to about 270 ° of up by about 180 ° to the angle [alpha] of spatial emission light, this has not only increased irradiating angle, and has ensured the mean intensity of illumination better.
Fig. 4 and Fig. 5 are respectively according to the vertical view of the LED lamp of the utility model preferred embodiment and the local enlarged diagram of led chip and binding post.As shown in the figure, led chip along the circumferential direction is the distribution of approximate period property, and the main direction of illumination of the adjacent LED chip direction of Lamp cup bottom (promptly perpendicular to) difference, thereby increases the lighting angle of LED lamp and improve average intensity of illumination.Each led chip 1 is connected to two LED power lines 4 by two bonding lines 20, and this bonding line 20 is preferably this area gold thread commonly used.LED power line 4 is an electric conductivity good metal bar, and it passes Lamp cup 3 and be connected on the pcb board 32 and forms connecting circuit, and forms by conductor wire in the pcb board 32 and following pcb board 13 and to be electrically connected, thereby is that led chip 1 is powered.
Shown in Fig. 1,4, one-level radiator 2 fits together by screw 31 or other feasible fixed forms and secondary radiator 8, so that the conduction of the connection of conductor wire and heat.One-level radiator 2 can be made by metal or alloy materials processing, and secondary radiator 8 can be the metal or alloy piece of casting forming, and its outside preferably have a considerable amount of, can increase the high efficiency and heat radiation aliform structure 11 with the air contact area to greatest extent.By this two stage cooling structures, secondary radiator 8 is at first taken away and pass to the heat that led chip is distributed when energising fast by one-level radiator 2, realize better radiating effect via the aliform structure of secondary radiator 8 outsides and the heat exchange of air then.In this secondary cooling mechanism, the temperature of one-level radiator 2 generally remains on 80 ℃-120 ℃, and the temperature of secondary radiator 8 then generally remains on below 90 ℃.Compare with the structure that radiator is combined closely with the supporter of led chip in the prior art, this two stage cooling structures have not only increased area of dissipation, and the different temperatures of passing through two radiators realizes the Rapid Thermal transmission from one-level radiator 2 to secondary radiator 8, avoid heat in one-level radiator 2, to accumulate and influence the performance of led chip, simultaneously two radiator ambient airs also can form air and flow owing to being heated to different temperatures, thereby further improve radiating efficiency.
The internal circuit of this LED lamp connects as shown in Figure 6.In the internal cavities of this LED lamp, be mounted with direct current supply electron plate 13.This direct current supply electron plate 13 also is a pcb board, and it comprises alternating current is converted to galvanic converter, and this converter can use device well known in the art, is not described in detail at this.This direct current supply electron plate also comprises the control section (not shown) of the electric current of controlling each LED illuminator simultaneously.The input of converter is connected on the lamp holder 12 by lead 19, so that obtain the alternating voltage of 220V from lamp holder, the output of simultaneous converter is connected on the input of pcb board 32 by direct current supply line 18, and further provides the dc source that is converted to led chip 1 via output, LED power line 4 and the bonding line 20 of pcb board 32.
In sum, in the structure of designed Novel LED light, the use of two-stage radiation mechanism can realize the quick heat radiating of led chip well, avoids heat to accumulate on the one-level radiator and causes the led chip performance degradation.Simultaneously, cloth is provided with led chip and can realizes bigger lighting angle on the one-level radiator that tilts, therefore the approximate period property variation at the inclination angle on different inclined-planes or roughly be symmetrically distributed and then guaranteed the uniformity of circumference illumination improves the lighting angle and the average intensity of illumination of LED lamp on the whole more significantly.
To those skilled in the art, by reading above stated specification, can expect many modifications and improvement.The utility model wishes to cover content and any equivalent of claims.Here used specific embodiment is in order to help to understand the utility model, not use it for to limit scope of the present utility model than claims and the narrower mode of equivalent thereof.In addition, though described concrete feature of the present utility model by preferred embodiment in the above, some concrete feature can change and not depart from scope of the present utility model.

Claims (13)

1. LED lamp is characterized in that: comprise led chip and be arranged on the Lamp cup of described led chip outside that the outer bottom of described Lamp cup and inner bottom part one of at least adopt the rear-mounted radium-shine reflective technology in plane to form.
2. LED lamp according to claim 1 is characterized in that: also comprise one-level radiator and secondary radiator, described one-level radiator has one or more inclined-planes, and each described one-level radiator top is provided with at least one led chip.
3. LED lamp according to claim 2 is characterized in that: described one-level radiator is connected with described secondary radiator to small part.
4. LED lamp according to claim 2 is characterized in that: described one-level radiator is radial periodic distribution along the central shaft of described secondary radiator, and the inclined-plane of adjacent one-level radiator has different inclinations angle.
5. according to each described LED lamp among the claim 2-4, it is characterized in that: the led chip bearing with certain altitude is formed on described one-level radiator top, and described led chip is seated on the described bearing.
6. LED lamp according to claim 5 is characterized in that: the height of described led chip bearing is between 1.2-3mm, so that described led chip can reach 270 ° to the angle maximum of spatial emission light.
7. according to each described LED lamp among the claim 2-4, it is characterized in that: the tilt angle ranges on the inclined-plane of described one-level radiator is 10 ° to 80 °.
8. according to each described LED lamp among the claim 2-4, it is characterized in that: described one-level radiator is made by metal material.
9. LED lamp according to claim 8 is characterized in that: the support of described one-level radiator for being formed by metal material processing.
10. according to each described LED lamp among the claim 2-4, it is characterized in that: described secondary radiator is the block of metallic material of casting forming.
11. according to each described LED lamp among the claim 2-4, it is characterized in that: the outside of described secondary radiator has the fin of aliform.
12. according to each described LED lamp among the claim 2-4, it is characterized in that: the temperature of described one-level radiator remains on 80 ℃-120 ℃, and the temperature of described secondary radiator remains on below 90 ℃.
13. according to the described LED lamp of claim 1-4, it is characterized in that: described Lamp cup is made with transparent material.
CN2009200095966U 2009-03-26 2009-03-26 LED illuminating lamp with second-grade heat dissipation and enhanced luminance Expired - Lifetime CN201599728U (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
CN2009200095966U CN201599728U (en) 2009-03-26 2009-03-26 LED illuminating lamp with second-grade heat dissipation and enhanced luminance
CA2759812A CA2759812A1 (en) 2009-03-26 2009-08-13 Led lighting lamp
KR1020117025361A KR20120023619A (en) 2009-03-26 2009-08-13 Led lighting lamp
EP09842042.5A EP2411727A4 (en) 2009-03-26 2009-08-13 Led lighting lamp
PCT/CN2009/000927 WO2010108305A1 (en) 2009-03-26 2009-08-13 Led lighting lamp

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2009200095966U CN201599728U (en) 2009-03-26 2009-03-26 LED illuminating lamp with second-grade heat dissipation and enhanced luminance

Publications (1)

Publication Number Publication Date
CN201599728U true CN201599728U (en) 2010-10-06

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN2009200095966U Expired - Lifetime CN201599728U (en) 2009-03-26 2009-03-26 LED illuminating lamp with second-grade heat dissipation and enhanced luminance

Country Status (1)

Country Link
CN (1) CN201599728U (en)

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Granted publication date: 20101006