CN201575795U - Material bed thickness detecting equipment - Google Patents

Material bed thickness detecting equipment Download PDF

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Publication number
CN201575795U
CN201575795U CN2009202719146U CN200920271914U CN201575795U CN 201575795 U CN201575795 U CN 201575795U CN 2009202719146 U CN2009202719146 U CN 2009202719146U CN 200920271914 U CN200920271914 U CN 200920271914U CN 201575795 U CN201575795 U CN 201575795U
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CN
China
Prior art keywords
thickness
feed layer
collecting device
image collecting
bed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2009202719146U
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Chinese (zh)
Inventor
王阿虎
何木光
陈明华
何斌
冷祥全
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Pangang Group Panzhihua Steel and Vanadium Co Ltd
Pangang Group Panzhihua Iron and Steel Research Institute Co Ltd
Panzhihua New Steel and Vanadium Co Ltd
Original Assignee
Pangang Group Panzhihua Steel and Vanadium Co Ltd
Panzhihua New Steel and Vanadium Co Ltd
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Publication date
Application filed by Pangang Group Panzhihua Steel and Vanadium Co Ltd, Panzhihua New Steel and Vanadium Co Ltd filed Critical Pangang Group Panzhihua Steel and Vanadium Co Ltd
Priority to CN2009202719146U priority Critical patent/CN201575795U/en
Application granted granted Critical
Publication of CN201575795U publication Critical patent/CN201575795U/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Abstract

The utility model provides material bed thickness detecting equipment which comprises a light source, an image collecting device and a processing device connected with the image collecting device, wherein the light source is arranged above a material bed and can irradiate the material bed surface to form a light spot; the image collecting device is arranged in the position where images including the light spot on the material bed surface can be collected, and the shooting direction of the image collecting device is not perpendicular to the place where the material bed surface is positioned; and the processing device receives the images collected by the image collecting device, determines the position of the light spot according to the collected images, and determines the material bed thickness according to the position of the light spot. By adopting the light source, the image collecting device and the processing device, the equipment provided by the utility model has the advantages of less maintenance and higher precision in comparison with the mechanical material bed thickness detecting equipment and the radar-wave type material bed thickness detecting equipment in the prior art, and not only can detect the material bed thickness but also can observe the material surface condition.

Description

The thickness of feed layer checkout equipment
Technical field
The application relates to field of metallurgy, more particularly relates in the metallurgical industry equipment that the thickness of feed layer to sintering machine detects.
Background technology
Sintering machine is that metallurgical industry is the main equipment in the sintering process, and it can sinter materials such as different components, varigrained fine ore, rich ore powder into piece, and part is eliminated objectionable impurities such as sulphur contained in the ore, phosphorus.Sintering machine is being brought into play important role in metallurgical industry.
In the sintering machine operation process, for the Detection ﹠ Controling of the thickness of feed layer of the material of on the sintering machine board, placing the production of sintering deposit there is significant effects, the fluctuation of thickness of feed layer can influence productivity of sinter, sinter quality and production cost, thus the detection of thickness of feed layer be realize to the control of sintering work indispensable means.And the site environment of sintering work is more abominable, and is many etc. such as temperature height, high humidity, dust, for having relatively high expectations of the rugged surroundings adaptive faculty of thickness of feed layer checkout equipment.
Detect in order to carry out thickness of feed layer in the rugged surroundings that are implemented in the sintering work process, similar devices such as mechanical type thickness of feed layer checkout equipment, radar wave thickness of feed layer checkout equipment have been developed at present, but there are problems such as maintenance is big, disturbance of data is big in these checkout equipments, and these detection modes all can not be observed the situation on bed of material surface.
The utility model content
The problems such as situation that the utility model is big at existing thickness of feed layer checkout equipment maintenance, disturbance of data is big and can not observe bed of material surface have proposed that a kind of maintenance is little, measuring accuracy is high and can observe the thickness of feed layer checkout equipment of the situation on bed of material surface when detecting thickness of feed layer.
The thickness of feed layer checkout equipment that the utility model provides comprises light source, image collecting device and the treating apparatus that is connected with image collecting device, described light source is placed in bed of material top and can shines bed of material surface and forms hot spot, described image collecting device is placed in the position of the image that can gather the bed of material surface that comprises described hot spot, and the plane at the shooting direction of described image collecting device and place, bed of material surface is non-perpendicular, described treating apparatus receives the image that described image collecting device is gathered, from the image of being gathered, determine the position of hot spot, and determine thickness of feed layer according to the position of hot spot.
The thickness of feed layer checkout equipment that the utility model provides is owing to adopt the light source that is arranged on bed of material top to form hot spot on bed of material surface, image collecting device in position is set can gather the image that comprises hot spot, in the thickness of feed layer checkout equipment course of work, at first gather the image on the initial bed of material surface of known initial thickness of feed layer, after thickness of feed layer changes, gather the image on the bed of material surface after the bed of material changes, and determine the variable quantity (being the thickness of feed layer variable quantity) of actual bed of material surface elevation according to the location variation in the image on the bed of material surface of hot spot after the image on initial bed of material surface and the bed of material change, utilize the current thickness of feed layer after known initial thickness of feed layer just can be determined the thickness of feed layer variation again, it is than thickness of feed layer checkout equipments such as mechanical type of the prior art and radar waves, it is simple in structure to have composition, reliable, maintenance is little, and maintenance is little, high and the advantages such as situation that when detecting thickness of feed layer, can also realize observing bed of material surface of measuring accuracy.
Description of drawings
Fig. 1 is the synoptic diagram of the thickness of feed layer checkout equipment that provides of the utility model;
Fig. 2 is the facula position synoptic diagram in the image of being gathered by image collecting device among Fig. 1.
Embodiment
As shown in Figure 1, the thickness of feed layer checkout equipment that the utility model provides comprises light source 2, image collecting device 3 and the treating apparatus 4 that is connected with image collecting device 3, described light source 2 is placed in bed of material top and can shines bed of material surface and forms hot spot, described image collecting device 3 is placed in the position of the image that can gather the bed of material surface that comprises described hot spot, and the shooting direction of described image collecting device 3 and the radiation direction of described light source 2 are non-parallel, described treating apparatus 4 receives the image that described image collecting device 3 is gathered, from the image of being gathered, determine the position of hot spot, and determine thickness of feed layer according to the position of hot spot.
Described light source 2 can be any light source that can form hot spot on bed of material surface, be preferably lasing light emitter, the lasing light emitter emitted laser itself has the directed characteristics of luminescence, need not other beam condensing units, the divergence of laser beam is minimum, approximately has only 0.001 radian, near parallel, spotlight effect is very good, and laser brightness is high, and wave spread is very narrow, monochromaticity is good, color is extremely pure, and like this, lasing light emitter more helps the subsequent treatment that the utility model realizes detecting thickness of feed layer at the hot spot that the material surface forms.Because ordinary material is black or grey, lasing light emitter is preferably the bigger lasing light emitter of aberration that adopts with material, as the helium-neon laser of ruby laser, ruddiness etc., can be convenient to treating apparatus like this and determine the position of hot spot in photographic images.Light source 2 is placed in the top of bed of material position to be detected, and can above a plurality of positions to be detected, lay a plurality of light sources 2, can obtain the thickness of feed layer of a plurality of positions to be detected like this, perhaps a plurality of thickness that obtained can be averaged the thickness of feed layer after obtaining on average, so that the thickness of feed layer that detects is more accurate.Preferably; the thickness of feed layer checkout equipment also comprises the transparent protective shield 13 that places the light source periphery; cause damage with the rugged surroundings of avoiding high temperature, the high humility in the sintering machine course of work, many dust to light source; preferably, this protective cover 13 adopts the material of high temperature resistant, the moisture-proof such as quartz glass.
Described image collecting device 3 can be the device of any energy images acquired, such as camera, video camera etc.The riding position of image collecting device 3 is can obtain to comprise that the image of hot spot is as the criterion, and the plane at the shooting direction of image collecting device 3 and place, bed of material surface is non-perpendicular, this be because if the shooting direction of image collecting device 3 perpendicular to bed of material surface, then from the image of being gathered, can only obtain the positional information of hot spot in the plane on bed of material surface, and can not obtain hot spot perpendicular to the positional information in the plane on bed of material surface, and only from the positional information of hot spot in the plane on bed of material surface, can not calculate the thickness of the bed of material.As shown in Figure 1, the shooting direction of image collecting device 3 and perpendicular to being certain included angle θ (θ ≠ 0 °) between the direction on bed of material surface, preferably, the shooting direction of described image collecting device 3 and be set between 30 °~60 ° perpendicular to the angle theta of the direction on bed of material surface.Described image collecting device 3 can be taken continuously, forms video image, perhaps also can be with certain hour interval images acquired.
Described image collecting device 3 is sent to treating apparatus 4 with the image of being gathered that comprises hot spot, and treating apparatus 4 realizes calculating the function of thickness of feed layer according to the image that receives from image collecting device 3.In the image that image collecting device 3 collects, the colourity and the brightness of environment are inequality around hot spot and the material etc., ordinary material is black in image, if adopt the irradiation of red laser source, then hot spot is red, can determine the position of hot spot in image based on the aberration of environment around hot spot and the material etc. in the image by the Flame Image Process of routine like this.By optics general knowledge as can be known, be proportionate relationship between the location variation of hot spot in image and the high variable quantity on actual bed of material surface (variable quantity of thickness of feed layer just), can be in the hope of the variable quantity of thickness of feed layer by the aforementioned proportion relation by the location variation of hot spot in image, if the thickness of feed layer before known thickness of feed layer changes then can be obtained the thickness of feed layer after the bed of material changes.By the ultimate principle of image collecting device 3 imagings of camera and so on as can be known, under the situation that object distance and focal length are determined, can uniquely determine the convergent-divergent multiple K of image collecting device 3, location variation and the proportionality constant of the proportionate relationship high variable quantity on actual bed of material surface between the convergent-divergent multiple that can be approximately equal to image collecting device 3 of hot spot in image, as if the shooting direction of known image harvester 3 and perpendicular to the angle theta between the direction on bed of material surface, can be K/sin θ then in the hope of more accurate proportionality constant.Described treating apparatus 4 can be the computing machine that can realize above-mentioned functions.Those skilled in the art can adopt multiple mode to realize utilizing the image of being gathered that comprises hot spot to calculate the mode of thickness of feed layer.According to a kind of mode, before sintering machine work, lay the material of known thickness, this known thickness is stored in the treating apparatus 4 as with reference to thickness, gather the image that a width of cloth comprises the hot spot on the bed of material surface that is formed at known thickness earlier by the image collecting device 3 that is placed in a certain fixed position, utilize conventional Flame Image Process to find hot spot and the definite position of hot spot in image, and the positional information of this hot spot in the image of being gathered stored as with reference to facula position, subsequently, in the sintering machine course of work, image collecting device 3 real-time images acquired, treating apparatus 4 is determined current facula position from the image of gathering, according to current facula position in the image of gathering and change in location with reference to facula position, come correspondence to draw distance (this distance is the thickness of feed layer changing value) between current bed of material surface and the previous known bed of material surface, and then calculate the thickness of the current bed of material.
Described thickness of feed layer checkout equipment can also comprise the digiverter that is connected with treating apparatus 4, this digiverter is used for receiving thickness of feed layer numerical value from treating apparatus 4, and convert the thickness of feed layer numerical value that is received to analog current signal, represent different thicknesses of feed layer with different size of current (such as the electric current of 4~20mA), use so that output to other utility appliance of sintering machine.
As shown in fig. 1, material 5 places on the sintering machine platform, light source 2 places the material top, the light beam 7 that light source 2 penetrates can form hot spot on bed of material surface, image collecting device 3 can be gathered the image that comprises hot spot, and the image of being gathered is sent to handles in the treating apparatus 4, the position 8 at the hot spot place after the bed of material that forms in the position 6 at the initial hot spot place that bed of material surface 9 after initial bed of material surface 1 and thickness of feed layer have been shown among Fig. 1 change and light beam 7 form in initial bed of material surface 1 and the bed of material surface 9 after thickness of feed layer changes changes to calculate thickness of feed layer.Facula position synoptic diagram in the image of being gathered in equipment shown in Figure 1 has been shown among Fig. 2, in the image shown in Fig. 2, also the image 10 of light source is taken interior, so that the change in location of hot spot when understanding variation in thickness, there is a displacement between the initial light spot image 12 before the light spot image 11 and the bed of material change after the variation after the bed of material changes, can calculate distance between the corresponding respectively actual facula position of these two light spot images according to the size of this displacement (is the distance between the position 8 at the hot spot place after position 6 and the bed of material variation at initial hot spot place, be the thickness of feed layer variable quantity), the initial thickness of feed layer before changing according to the bed of material more just can draw current thickness of feed layer.
The thickness of feed layer checkout equipment that uses the utility model to provide, can detect the variation of thickness of feed layer easily, and the situation that the plant maintenance amount is little, measuring accuracy is high and can also realize observing bed of material surface when detecting thickness of feed layer, thereby the thickness of feed layer checkout equipment that the utility model provides is a kind of convenience thickness of feed layer checkout equipment efficiently.

Claims (7)

1. thickness of feed layer checkout equipment, it is characterized in that, this thickness of feed layer checkout equipment comprises light source, image collecting device and the treating apparatus that is connected with image collecting device, described light source is placed in bed of material top and can shines bed of material surface and forms hot spot, described image collecting device is placed in the position of the image that can gather the bed of material surface that comprises described hot spot, and the plane at the shooting direction of described image collecting device and place, bed of material surface is non-perpendicular, described treating apparatus receives the image that described image collecting device is gathered, from the image of being gathered, determine the position of hot spot, and determine thickness of feed layer according to the position of hot spot.
2. thickness of feed layer checkout equipment according to claim 1 is characterized in that described light source is a lasing light emitter.
3. thickness of feed layer checkout equipment according to claim 1 is characterized in that the quantity of described light source is greater than 1.
4. thickness of feed layer checkout equipment according to claim 1 is characterized in that, this thickness of feed layer checkout equipment also comprises transparent protective shield, and described light source places this protective cover inside.
5. thickness of feed layer checkout equipment according to claim 1 is characterized in that, the shooting direction of described image collecting device and be set between 30 °~60 ° perpendicular to the angle between the direction on bed of material surface.
6. thickness of feed layer checkout equipment according to claim 1 is characterized in that described image collecting device is a video camera.
7. according to the described thickness of feed layer checkout equipment of arbitrary claim among the claim 1-6, it is characterized in that this thickness of feed layer checkout equipment also comprises the digiverter that is connected with treating apparatus.
CN2009202719146U 2009-12-10 2009-12-10 Material bed thickness detecting equipment Expired - Fee Related CN201575795U (en)

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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102305594A (en) * 2011-08-30 2012-01-04 东莞市盟拓光电科技有限公司 Laser measuring method for solder paste thickness
CN102721372A (en) * 2012-05-04 2012-10-10 西安理工大学 Bi-linear CCD-based strip width measurement method and system
CN101750022B (en) * 2008-12-12 2013-03-13 鞍钢股份有限公司 Sintering layer thickness on-line detecting method
CN105588438A (en) * 2014-10-20 2016-05-18 宝山钢铁股份有限公司 Sintering machine chassis material distribution amount detection device and method
CN113790674A (en) * 2021-08-06 2021-12-14 河北光兴半导体技术有限公司 Measuring method, processor and measuring device for glass product

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101750022B (en) * 2008-12-12 2013-03-13 鞍钢股份有限公司 Sintering layer thickness on-line detecting method
CN102305594A (en) * 2011-08-30 2012-01-04 东莞市盟拓光电科技有限公司 Laser measuring method for solder paste thickness
CN102305594B (en) * 2011-08-30 2014-03-26 东莞市盟拓光电科技有限公司 Laser measuring method for solder paste thickness
CN102721372A (en) * 2012-05-04 2012-10-10 西安理工大学 Bi-linear CCD-based strip width measurement method and system
CN102721372B (en) * 2012-05-04 2015-06-03 西安理工大学 Bi-linear CCD-based strip width measurement method and system
CN105588438A (en) * 2014-10-20 2016-05-18 宝山钢铁股份有限公司 Sintering machine chassis material distribution amount detection device and method
CN113790674A (en) * 2021-08-06 2021-12-14 河北光兴半导体技术有限公司 Measuring method, processor and measuring device for glass product

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GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20100908

Termination date: 20161210