CN201562672U - 晶圆承放台 - Google Patents
晶圆承放台 Download PDFInfo
- Publication number
- CN201562672U CN201562672U CN2009202137268U CN200920213726U CN201562672U CN 201562672 U CN201562672 U CN 201562672U CN 2009202137268 U CN2009202137268 U CN 2009202137268U CN 200920213726 U CN200920213726 U CN 200920213726U CN 201562672 U CN201562672 U CN 201562672U
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- wafer
- housing
- outer frame
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Abstract
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Claims (6)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2009202137268U CN201562672U (zh) | 2009-11-17 | 2009-11-17 | 晶圆承放台 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2009202137268U CN201562672U (zh) | 2009-11-17 | 2009-11-17 | 晶圆承放台 |
Publications (1)
Publication Number | Publication Date |
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CN201562672U true CN201562672U (zh) | 2010-08-25 |
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN2009202137268U Expired - Fee Related CN201562672U (zh) | 2009-11-17 | 2009-11-17 | 晶圆承放台 |
Country Status (1)
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CN (1) | CN201562672U (zh) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104022059A (zh) * | 2014-04-22 | 2014-09-03 | 上海华力微电子有限公司 | 一种半导体炉管的晶舟 |
CN108700405A (zh) * | 2016-12-06 | 2018-10-23 | 爱思开矽得荣株式会社 | 晶圆载体厚度测量装置 |
-
2009
- 2009-11-17 CN CN2009202137268U patent/CN201562672U/zh not_active Expired - Fee Related
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104022059A (zh) * | 2014-04-22 | 2014-09-03 | 上海华力微电子有限公司 | 一种半导体炉管的晶舟 |
CN104022059B (zh) * | 2014-04-22 | 2017-01-25 | 上海华力微电子有限公司 | 一种半导体炉管的晶舟 |
CN108700405A (zh) * | 2016-12-06 | 2018-10-23 | 爱思开矽得荣株式会社 | 晶圆载体厚度测量装置 |
US11371829B2 (en) | 2016-12-06 | 2022-06-28 | Sk Siltron Co., Ltd. | Wafer carrier thickness measuring device |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (BEIJING Free format text: FORMER OWNER: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION Effective date: 20130219 |
|
C41 | Transfer of patent application or patent right or utility model | ||
COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: 201203 PUDONG NEW AREA, SHANGHAI TO: 100176 DAXING, BEIJING |
|
TR01 | Transfer of patent right |
Effective date of registration: 20130219 Address after: 100176 No. 18 Wenchang Avenue, Beijing economic and Technological Development Zone Patentee after: Semiconductor Manufacturing International (Beijing) Corporation Address before: 201203 Shanghai City, Pudong New Area Zhangjiang Road No. 18 Patentee before: Semiconductor Manufacturing International (Shanghai) Corporation |
|
CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20100825 Termination date: 20181117 |