CN201532945U - Slice-carrying device - Google Patents

Slice-carrying device Download PDF

Info

Publication number
CN201532945U
CN201532945U CN2009202116755U CN200920211675U CN201532945U CN 201532945 U CN201532945 U CN 201532945U CN 2009202116755 U CN2009202116755 U CN 2009202116755U CN 200920211675 U CN200920211675 U CN 200920211675U CN 201532945 U CN201532945 U CN 201532945U
Authority
CN
China
Prior art keywords
slide glass
wafer
glass device
utility
visual inspection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2009202116755U
Other languages
Chinese (zh)
Inventor
黄臣
赵庆国
顾耀芳
张岚
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Semiconductor Manufacturing International Beijing Corp
Original Assignee
Semiconductor Manufacturing International Shanghai Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Semiconductor Manufacturing International Shanghai Corp filed Critical Semiconductor Manufacturing International Shanghai Corp
Priority to CN2009202116755U priority Critical patent/CN201532945U/en
Application granted granted Critical
Publication of CN201532945U publication Critical patent/CN201532945U/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Landscapes

  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Abstract

The utility model discloses a slice-carrying device, including a base plate and a slice-carrying disk arranged on the base plate, and the slice-carrying disk is provided with fixed grooves. When a two-sided wafer is visually inspected by the slice-carrying device of the invention, the wafer may be integrated with the slice-carrying device to be arranged on a platform to be inspected visually, operating procedure is simplified, wafer scratch and fragment may be reduced, and efficiency is improved.

Description

A kind of slide glass device
Technical field
The utility model relates to integrated circuit and makes the field, relates in particular to a kind of slide glass device that is used to carry double side wafer.
Background technology
Because the continuous increase of die size and sharply dwindling of integrated circuit (IC) pattern character size make chip structure complicated more, defect concentration becomes more and more outstanding to the influence of rate of finished products.The per pass operation of chip production all may machinery or is introduced defective and contamination artificially.If the untimely discovery of this class problem is also solved, will cause the production line rate of finished products to descend significantly.
In order to find some open defects in the chip production process in time, after each crucial processing procedure, all set up the visual inspection link, to detect the evenness and the contamination situation of wafer surface.As a rule, visual inspection is meant and places wafer on the sucker of board and vacuum holds, then under the irradiation of major light with the fractographic process of enlargement ratio.In order to realize batch detection, normally lots of wafers is placed special brilliant boat, manipulator automatic wafer that grasps from brilliant boat by board carries out visual inspection then, finishes the visual inspection of a wafer and grasps next wafer more in regular turn afterwards, and all wafers in brilliant boat is all finished visual inspection.
Yet, for double side wafer (both-side pattern wafer), because its tow sides have all been made circuit, its surface is irregular, thereby can't directly wafer be placed the sucker of board enterprising vacuum adsorbed, make the visual inspection of double side wafer not realize automatic operation, and in the process of visual inspection, be easy to the electrical unit of scratch wafer by board.
In order to address this problem, normally in the visual inspection process, cover manipulator with Arathene (Tyvek paper) earlier at present, then wafer is manually taken and carried out visual inspection on the board sucker, the wafer that the one side visual inspection also needs when finishing back replacing another side manually to reverse on the Tyvek paper again carries out the visual inspection of another side.Yet because there is the risk that can not fine contact wafer surface causes wafer scratch and fragmentation because of board in existing manual manipulation mode, and this manual manipulation mode has brought inconvenience to the operator, also greatly reduce simultaneously the production capacity of wafer, restricted the development space of double side wafer.
The utility model content
The utility model provides a kind of slide glass device, to solve the necessary manual operation in the visual inspection process of existing double side wafer, causes the risk height of trivial operations, wafer scratch and fragmentation, inefficient problem.
For addressing the above problem, the utility model proposes a kind of slide glass device, described slide glass device comprises the chassis and is arranged at slide glass dish on the described chassis, wherein, has holddown groove on the described slide glass dish.
Optionally, the shape on described chassis is the disk shape.
Optionally, described slide glass dish is a circle ring column structure.
Optionally, described holddown groove is one to be arranged at the ring-shaped step in the circle ring column.
Optionally, the external diameter of described ring-shaped step is more than or equal to the diameter of wafer.
Optionally, the internal diameter of described ring-shaped step is less than the diameter of wafer.
Optionally, the top of described slide glass dish has the groove of two symmetries.
Optionally, the back side, described chassis material identical with the wafer material.
Compared with prior art, slide glass device provided by the utility model comprises the chassis and is arranged at slide glass dish on the described chassis, has holddown groove on the described slide glass dish, the double side wafer for the treatment of visual inspection can be placed on the described holddown groove, the edge of holddown groove contact double side wafer, described double side wafer and slide glass device place as an integral body and carry out automated visual inspection on the board, thereby have simplified operation sequence, reduce the risk of wafer scratch and fragmentation, improved efficient.
Description of drawings
The stereogram of the slide glass device that Figure 1A provides for the utility model embodiment;
The front view of the slide glass device that Figure 1B provides for the utility model embodiment;
The vertical view of the slide glass device that Fig. 1 C provides for the utility model embodiment;
The slide glass device that Fig. 2 provides for the utility model embodiment is put into the stereogram of special brilliant boat.
Embodiment
Below in conjunction with the drawings and specific embodiments the slide glass device that the utility model proposes is described in further detail.According to the following describes and claims, advantage of the present utility model and feature will be clearer.It should be noted that accompanying drawing all adopts very the form of simplifying and all uses non-ratio accurately, only in order to convenient, the purpose of aid illustration the utility model embodiment lucidly.
Core concept of the present utility model is, a kind of slide glass device that is used to carry double side wafer is provided, so that in the visual inspection process, double side wafer and slide glass device place as an integral body and carry out automated visual inspection on the board, thereby simplified operation sequence, reduce the risk of wafer scratch and fragmentation, improved efficient.
Please refer to Figure 1A to Fig. 1 C, wherein, the stereogram of the slide glass device that Figure 1A provides for the utility model embodiment, the front view of the slide glass device that Figure 1B provides for the utility model embodiment, the vertical view of the slide glass device that Fig. 1 C provides for the utility model embodiment, shown in Figure 1A to Fig. 1 C, this slide glass device 100 comprises chassis 110 and is arranged at slide glass dish 120 on the described chassis 110, the groove 130 that has two symmetries on the described slide glass dish 120, the holddown groove that has an annular table scalariform on the described slide glass dish 120, wherein the external diameter of ring-shaped step is more than or equal to the diameter of wafer, its internal diameter is slightly less than the diameter of wafer, but greater than the diameter of making circuit part on the wafer.The double side wafer for the treatment of visual inspection can be placed on the described holddown groove, holddown groove only contacts the edge of double side wafer and does not contact its circuit part, described double side wafer and slide glass device place as an integral body and carry out automated visual inspection on the board, thereby simplified operation sequence, reduce the risk of wafer scratch and fragmentation, improved efficient.
Please continue with reference to figure 2, Fig. 2 is provided as an integral body for the utility model embodiment slide glass device that provides and the double side wafer that is carried by the stereogram of special brilliant boat, as shown in Figure 2, in the process of visual inspection, being placed on double side wafer and the slide glass device integral body of waiting for visual inspection in the slide glass device 100 that the utility model embodiment provides all is placed in the special brilliant boat 200, be convenient to the automatic operation of board end, after the one side of double side wafer is all finished visual inspection by the gross, by the gross double side wafer overturn to carry out the visual inspection work of another side.Be arranged at the groove 130 on the slide glass dish 120, its bottom is a little less than the wafer surface position that is placed in the slide glass device, and groove 130 is symmetrically arranged, thereby can easily wafer be taken out from the slide glass device, and then realizes the upset of wafer.
In a specific embodiment of the present utility model, the Back Material on the chassis 110 of described slide glass device 100 is similar to the wafer material, and this is for the ease of the automatic extracting to the slide glass device of the manipulator of realizing board.
In a specific embodiment of the present utility model, the chassis 110 of described slide glass device 100 be shaped as the disk shape.Yet should be realized that according to actual needs, described chassis 110 can also change according to the change of wafer shape, keep identical with wafer shape.
In a specific embodiment of the present utility model, described slide glass device 100 places special brilliant boat with the double side wafer of waiting for visual inspection as an integral body.Yet should be realized that described slide glass device also can be made corresponding change according to the variation of brilliant boat, so that it can put into brilliant boat.
In above-mentioned specific embodiment, described slide glass device 100 is to be described as to be used in the visual inspection process, the carrying double side wafer, yet should be realized that described slide glass device 100 can also be used for other analyte detection process and carry double side wafer.
In sum, the utility model provides a kind of slide glass device, and this slide glass device comprises the chassis and be arranged at slide glass dish on the described chassis that described slide glass dish has holddown groove.Use this slide glass device to carry out in the process of visual inspection, double side wafer and the slide glass device integral body of waiting for visual inspection can be placed in the special brilliant boat in batch, need the double side wafer of visual inspection and slide glass device to place and carry out automated visual inspection on the board as an integral body, thereby simplified operation sequence, reduce the risk of wafer scratch and fragmentation, improved efficient.
Obviously, those skilled in the art can carry out various changes and modification to the utility model and not break away from spirit and scope of the present utility model.Like this, if of the present utility model these are revised and modification belongs within the scope of the utility model claim and equivalent technologies thereof, then the utility model also is intended to comprise these changes and modification interior.

Claims (9)

1. a slide glass device is used to carry a wafer, it is characterized in that, comprises the chassis and is arranged at slide glass dish on the described chassis, has holddown groove on the described slide glass dish.
2. slide glass device as claimed in claim 1 is characterized in that, the shape on described chassis is the disk shape.
3. slide glass device as claimed in claim 1 is characterized in that, described slide glass dish is a circle ring column structure.
4. slide glass device as claimed in claim 3 is characterized in that, described holddown groove is one to be arranged at the ring-shaped step in the circle ring column.
5. slide glass device as claimed in claim 4 is characterized in that the external diameter of described ring-shaped step is more than or equal to the diameter of wafer.
6. slide glass device as claimed in claim 4 is characterized in that the internal diameter of described ring-shaped step is less than the diameter of wafer.
7. slide glass device as claimed in claim 3 is characterized in that, the top of described slide glass dish has the groove of symmetry.
8. slide glass device as claimed in claim 7 is characterized in that, the quantity of described groove is two.
9. slide glass device as claimed in claim 1 is characterized in that, the material at the back side, chassis is identical with the wafer material.
CN2009202116755U 2009-10-30 2009-10-30 Slice-carrying device Expired - Fee Related CN201532945U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2009202116755U CN201532945U (en) 2009-10-30 2009-10-30 Slice-carrying device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2009202116755U CN201532945U (en) 2009-10-30 2009-10-30 Slice-carrying device

Publications (1)

Publication Number Publication Date
CN201532945U true CN201532945U (en) 2010-07-21

Family

ID=42528346

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2009202116755U Expired - Fee Related CN201532945U (en) 2009-10-30 2009-10-30 Slice-carrying device

Country Status (1)

Country Link
CN (1) CN201532945U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103730399A (en) * 2014-01-16 2014-04-16 成都先进功率半导体股份有限公司 Piece drawing device for semiconductor visual inspection machine

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103730399A (en) * 2014-01-16 2014-04-16 成都先进功率半导体股份有限公司 Piece drawing device for semiconductor visual inspection machine

Similar Documents

Publication Publication Date Title
CN109188161A (en) Capacitor detection device and its detection method
KR101264399B1 (en) Solar Cell Wafer Sorter
CN201532945U (en) Slice-carrying device
CN107819099B (en) Automatic bending device of electric core tab
CN207623356U (en) A kind of wash mill for chemiluminescence immunoassay detection
CN106920767A (en) A kind of mask plate is fitted and separator with sample
TWM512211U (en) Substrate stage mechanism
CN106370995B (en) Automatic device and method for batch writing and testing of circuit boards
CN102222632A (en) Wafer testing method and device
CN202150448U (en) Wafer supporting stage for wafer test machine
TWI414800B (en) Applied to image sensing IC test classifier (2)
CN211824097U (en) Automatic detection equipment for electronic detonator chip
CN207134325U (en) A kind of sample carrier for transmission electron microscope
CN213878041U (en) Novel wafer edge inspection device
CN215784982U (en) Inductor shape face detection device
US20050139525A1 (en) Chip sorting apparatus and method for fabricating the same
CN206672909U (en) A kind of mask plate and sample be bonded and separator
CN206258533U (en) A kind of automatically retractable tool
CN210040132U (en) TAIKO wafer slice test system
CN211878368U (en) Liquid crystal display inspection table structure
CN220490124U (en) Processing device for USB equipment
CN203930258U (en) A kind of new type auto backlight is lighted tool
CN219831629U (en) Glass manufacturing support stable frame
TWI794068B (en) A chip taking fixture for an electronic component module
CN215896359U (en) Wafer alignment transfer bearing device

Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
ASS Succession or assignment of patent right

Owner name: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (BEIJING

Free format text: FORMER OWNER: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION

Effective date: 20130219

C41 Transfer of patent application or patent right or utility model
COR Change of bibliographic data

Free format text: CORRECT: ADDRESS; FROM: 201203 PUDONG NEW AREA, SHANGHAI TO: 100176 DAXING, BEIJING

TR01 Transfer of patent right

Effective date of registration: 20130219

Address after: 100176 No. 18, Wenchang Avenue, Beijing economic and Technological Development Zone

Patentee after: Semiconductor Manufacturing International (Beijing) Corporation

Address before: 201203 Shanghai City, Pudong New Area Zhangjiang Road No. 18

Patentee before: Semiconductor Manufacturing International (Shanghai) Corporation

CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20100721

Termination date: 20181030