CN201530061U - 硅单晶棒切片前处理夹具 - Google Patents

硅单晶棒切片前处理夹具 Download PDF

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Publication number
CN201530061U
CN201530061U CN2009200429539U CN200920042953U CN201530061U CN 201530061 U CN201530061 U CN 201530061U CN 2009200429539 U CN2009200429539 U CN 2009200429539U CN 200920042953 U CN200920042953 U CN 200920042953U CN 201530061 U CN201530061 U CN 201530061U
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施海明
陆景刚
张锦根
鄂林
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Zhenjiang Rietech New Energy Technology Co., Ltd.
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Zhenjiang Huantai Silicon Technology Co Ltd
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Abstract

本实用新型涉及硅单晶晶片的制造，具体是一种硅单晶棒切片前处理具。该夹具包括一个座体，座体上具有两个相互垂直的支承面，两个支承面与座体的底平面之间分别具有锐角夹角。本实用新型的后处理夹具可以在对棒料切片前方便地对棒料表面的棱角进行磨削加工，方便地对棒料的棱角部分进行磨削加工，有效地改善了棒料表面的的应力状况，大大降低了实际生产和转运过程中产生碎片的机率，提高了成品率。

Description

硅单晶棒切片前处理夹具
技术领域
本实用新型涉及硅单晶晶片的制造，具体是一种硅单晶棒切片前处理具。
背景技术
采用硅单晶棒料切割生产晶片的方法通常是先将圆柱状的棒料通过切方工艺后形成角部为圆弧的正方形截面形状(如附图1)，然后对正方形截面的棒料在切片机上进行线切割，形成晶片。其切片和转运过程中经常会发生碎片的情况，使切割下的晶片报废，降低了成品率。产生碎片的原因，通常认为是由于棒料表面的应力不均匀，在外力作用下就容易产生碎裂，虽然现有生产工艺中在单晶棒切片前都已经通过表面抛光处理，但仍然难以减少碎片的产生。
发明内容
本实用新型所要解决的技术问题是，提供一种能够有效减少硅单晶晶片生产中的碎片，提高成品率的硅单晶棒切片前处理夹具。
本实用新型的硅单晶棒切片前处理夹具包括一个座体，座体上具有两个相互垂直的支承面，两个支承面与座体的底平面之间分别具有锐角夹角。
本实用新型的硅单晶棒切片前处理夹具在使用方法是：当硅单晶棒料进行切方后，具有四个侧平面和位于四个角部的圆弧面，将相邻的两个侧平面安置在前处理夹具的两个支承面上，使得棒料一个侧平面与一个角部的圆弧面交界的棱角朝向正上方，使用磨削设置的磨头直接对棱角部分进行磨削加工，使棱角钝化。
本实用新型的后处理夹具可以在对棒料切片前方便地对棒料表面的棱角进行磨削加工，方便地地棒料的棱角部分进行磨削加工，有效地改善了棒料表面的的应力状况，大大降低了实际生产和转运过程中产生碎片的机率，提高了成品率。
附图说明
图1是硅单晶棒料经过切方工艺后的截面形状示意图；
图2是本实用新型的前处理夹具的结构示意图。
具体实施方式
如图2所示，本实用新型的后处理夹具的座体4上具有两个相互垂直的支承面5，两个支承面与座体的底平面6之间分别具有锐角夹角。该夹具使用过程中，经过切方工艺后的硅单晶棒料7(截面形状如图1)的相互垂直的两个侧平面1安置在座体的支承面5上，使得棒料一个侧平面1与一个角部的圆弧面2交界的棱角3朝向正上方，使用磨削设备的磨头直接对棱角部分进行磨削加工，使棱角钝化。

Claims (1)

1.一种硅单晶棒切片前处理夹具，其特征是：它包括一个座体，座体上具有两个相互垂直的支承面两个支承面与座体的底平面之间分别具有锐角夹角。
CN2009200429539U 2009-06-30 2009-06-30 硅单晶棒切片前处理夹具 Expired - Fee Related CN201530061U (zh)

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CN2009200429539U CN201530061U (zh) 2009-06-30 2009-06-30 硅单晶棒切片前处理夹具

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CN2009200429539U CN201530061U (zh) 2009-06-30 2009-06-30 硅单晶棒切片前处理夹具

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CN201530061U true CN201530061U (zh) 2010-07-21

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101934558A (zh) * 2010-08-13 2011-01-05 上海超日(洛阳)太阳能有限公司 硅棒切片方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101934558A (zh) * 2010-08-13 2011-01-05 上海超日(洛阳)太阳能有限公司 硅棒切片方法

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Address after: 212200 Chinese Jiangsu Province Economic Development Zone of Yangzhong Port Road No. 998

Patentee after: Zhenjiang Rietech New Energy Technology Co., Ltd.

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