CN201527541U - Multi-mask aligner silicon wafer platform system - Google Patents
Multi-mask aligner silicon wafer platform system Download PDFInfo
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- CN201527541U CN201527541U CN2009201734859U CN200920173485U CN201527541U CN 201527541 U CN201527541 U CN 201527541U CN 2009201734859 U CN2009201734859 U CN 2009201734859U CN 200920173485 U CN200920173485 U CN 200920173485U CN 201527541 U CN201527541 U CN 201527541U
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- silicon wafer
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Abstract
The utility model relates to a multi-mask aligner silicon wafer platform system which comprises a base platform, at least one silicon wafer platform, a group of optical lenses and a mask platform system, wherein the mask platform system consists of a mask platform substrate and a mask carrying platform; the long edge of the mask platform substrate is in Y direction, and the short edge thereof is in X direction; and the mask carrying stage does linear motion on the mask platform substrate along the Y direction and is at least provided with two mask plate mounting grooves and two mask plates along the Y direction, and each mask plate mounting groove is internally provided with one mask plate. The system avoids shortcomings of the existing aligner that after replacement, the mask plate needs to be aligned again with high accuracy requirement, only prolongs the stroke of a mask stage guide rail on the basis of the existing structure, and has no change on the complexity of the system structure; and compared with the system using one existing aligner, the system leads the whole aligning efficiency to be improved to a certain extent.
Description
Technical field
The utility model relates to a kind of photo-etching machine silicon slice bench double-bench switching system, and this system applies belongs to the semiconductor manufacturing facility technical field in the semiconductor lithography machine.
Background technology
In the production run of integrated circuit (IC) chip, the exposure transfer printing (photoetching) of the design configuration of chip on the silicon chip surface photoresist is one of most important operation wherein, and the used equipment of this operation is called litho machine (exposure machine).The resolution of litho machine and exposure efficiency affect the characteristic line breadth (resolution) and the throughput rate of integrated circuit (IC) chip greatly.And, determined the resolution and the exposure efficiency of litho machine again to a great extent as the kinematic accuracy and the work efficiency of the silicon chip ultraprecise motion locating system (being designated hereinafter simply as the silicon chip platform) of litho machine critical system.
The advanced scanning projecting photoetching machine ultimate principle as shown in Figure 1.From the deep UV (ultraviolet light) of light source 45 see through mask 47, lens combination 49 with a part of pattern imaging on the mask on certain Chip of silicon chip 50.Mask and silicon chip oppositely are synchronized with the movement by certain speed proportional, whole pattern imagings on the mask are on the certain chip (Chip) of silicon chip the most at last, present litho machine is only to be provided with a mask on mask platform, other masks change the outfit behind the end exposure, adopt a litho machine branch multistep just to finish and to change mask successively, mask of every replacing will be aimed at once again; And adopt two litho machines to work simultaneously, will significantly increase production cost.
The utility model content
At the deficiencies in the prior art, the purpose of this utility model provides a kind of photoetching machine silicon wafer stage system of many masks, save to change the time of aiming at again behind next piece mask and the time of a stepping in exposure process, reduce cost, and then improve the exposure efficiency of litho machine.
The technical solution of the utility model is as follows:
The photoetching machine silicon wafer stage system of many masks, this system contains base station, at least one silicon chip platform, one group of optical lens and mask platform system, it is characterized in that: described mask platform system comprises mask platform pedestal and mask plummer, the long limit of mask platform pedestal is the Y direction, minor face is a directions X, described mask plummer is at mask platform pedestal upper edge Y direction moving linearly, mask plummer upper edge Y direction is provided with two mask mounting grooves and two masks at least, places a mask in each mask mounting groove.
The photoetching machine silicon wafer stage system of the described many masks of technique scheme, it is characterized in that: described mask plummer is done the guiding driving at mask platform pedestal upper edge Y direction moving linearly employing air-float guide rail and linear electric motors, or adopts line slideway, ball-screw and servomotor to do the guiding driving.
The utility model compared with prior art has the advantage of following high-lighting: the one, the polylith mask is arranged along direction of motion in turn compare with using a litho machine, the silicon chip platform can reduce the time of a stepping when scan exposure; The 2nd, polylith mask one-step installation is saved the time of once aiming at, and generally, has improved work efficiency.
Description of drawings
Fig. 1 is existing litho machine principle of work synoptic diagram.
Fig. 2 is the structural principle synoptic diagram of the embodiment of the litho machine system of the utility model employing dual masks.
Fig. 3 is the principle of work synoptic diagram of the embodiment of the litho machine system of the utility model employing dual masks.
Among the figure: the 1-base station; 2-pre-service silicon chip platform; 3-exposure silicon chip platform; The 4-lens; 5-mask platform pedestal; 6-mask plummer; 7a-first mask; 7b-second mask.
Embodiment
The photoetching machine silicon wafer stage system of many masks that the utility model provides, this system contains base station 1, at least one silicon chip platform, one group of optical lens 4 and mask platform system, it is characterized in that: described mask platform system comprises mask platform pedestal 5 and mask plummer 6, mask platform pedestal 5 long limits are the Y direction, minor face is a directions X, described mask plummer 6 is at mask platform pedestal 5 upper edge Y direction moving linearlies, mask plummer 6 upper edge Y directions are provided with two mask mounting grooves and two masks at least, place a mask in each mask mounting groove.Described mask plummer is done the guiding driving at mask platform pedestal upper edge Y direction moving linearly employing air-float guide rail and linear electric motors, or adopts line slideway, ball-screw and servomotor to do the guiding driving.
Fig. 2 is the structural principle synoptic diagram of the embodiment of the litho machine system of the utility model employing dual masks.This system contains 1, one pre-service silicon chip of base station platform 2 and 4, two silicon chip platforms of exposure 3, one groups of optical lenses of silicon chip platform are done pre-service campaign and exposure motion respectively at base station 1 upper surface; Above base station 1, be provided with a mask platform system, this mask platform system comprises a mask platform pedestal 5 and a mask plummer 6, and establishing mask platform pedestal 5 long limits is the Y direction, and minor face is a directions X; Mask plummer 6 upper edge Y directions are arranged two mask mounting grooves by row, and the first mask 7a and the second mask 7b are installed in the mask mounting groove successively; The motion of this mask platform system is the single-degree-of-freedom rectilinear motion, and the guiding driving by air-float guide rail and linear electric motors makes mask plummer 6 adopt at mask platform pedestal upper edge Y direction moving linearly.
Fig. 3 is the principle of work synoptic diagram of the embodiment of the litho machine system of the utility model employing dual masks.When carrying out the scan exposure operation, according to the size of silicon chip, mark off several regions on the silicon chip waiting to carve in advance, each such zone is called a field.In the process of each of exposing, at first, mask plummer 6 moves right along the Y direction, the first mask 7a and the second mask 7b pass through projection in zone successively, but have only the first mask 7a to be scanned, side by side, the silicon chip platform is done the counter motion with mask plummer 6, along the Y direction to left movement, at this moment, the pattern of the first mask 7a is engraved on the silicon chip, mask plummer 6 slows down oppositely, and simultaneously, cooling device makes the photoresist quench cooled on the silicon chip, afterwards, the silicon chip platform slows down oppositely; Then, to left movement, the second mask 7b, the first mask 7a pass through projection in zone to mask plummer 6 successively again along the Y direction, have only the second mask 7b to be scanned this moment, side by side, the silicon chip platform is still done the counter motion with mask plummer 6, moves right along the Y direction, specifically, the pattern of the second mask 7b is engraved on the silicon chip, has finished one scan exposure this moment, and mask plummer 6 slows down oppositely, simultaneously the silicon chip platform steps to next, and the exposure of other each circulates successively.
Claims (2)
1. the photoetching machine silicon wafer stage system of many masks, this system contains base station (1), at least one silicon chip platform, one group of optical lens (4) and mask platform system, it is characterized in that: described mask platform system comprises mask platform pedestal (5) and mask plummer (6), the long limit of mask platform pedestal (5) is the Y direction, minor face is a directions X, described mask plummer (6) is at mask platform pedestal (5) upper edge Y direction moving linearly, mask plummer (6) upper edge Y direction is provided with two mask mounting grooves at least, places a mask in each mask mounting groove.
2. according to the photoetching machine silicon wafer stage system of the described many masks of claim 1, it is characterized in that: described mask plummer (6) is done the guiding driving at mask platform pedestal (5) upper edge Y direction moving linearly employing air-float guide rail and linear electric motors, or adopts line slideway, ball-screw and servomotor to do the guiding driving.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009201734859U CN201527541U (en) | 2009-06-30 | 2009-09-11 | Multi-mask aligner silicon wafer platform system |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200920109622.2 | 2009-06-30 | ||
| CN2009201734859U CN201527541U (en) | 2009-06-30 | 2009-09-11 | Multi-mask aligner silicon wafer platform system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201527541U true CN201527541U (en) | 2010-07-14 |
Family
ID=42518826
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009201734859U Expired - Fee Related CN201527541U (en) | 2009-06-30 | 2009-09-11 | Multi-mask aligner silicon wafer platform system |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201527541U (en) |
-
2009
- 2009-09-11 CN CN2009201734859U patent/CN201527541U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20100714 Termination date: 20140911 |
|
| EXPY | Termination of patent right or utility model |