CN201518116U

CN201518116U - CPU thermal module structure

Info

Publication number: CN201518116U
Application number: CN2009201749182U
Authority: CN
Inventors: 庄启辉
Original assignee: AMERICAN ILLINO TOOLS Co Ltd
Current assignee: AMERICAN ILLINO TOOLS Co Ltd
Priority date: 2009-09-25
Filing date: 2009-09-25
Publication date: 2010-06-30
Anticipated expiration: 2019-09-25

Abstract

The utility model relates to a CPU thermal module structure. The CPU thermal module structure is mainly characterized in that a back board arranged below a circuit board is made of plastic, wherein a groove is formed at the bottom of the back board and used for allowing a metal fixing plate to be arranged, the fixing plate is fixedly arranged with a CPU fixing device, the back board is fixedly arranged with a radiator at four corners of the radiator. Since the back board is made of plastic, the metal scraps can be effectively reduced so as to achieve the purpose of reducing production cost.

Description

The CPU modular structure that dispels the heat

[technical field]

The utility model is about a kind of CPU heat radiation modular structure, particularly about a kind of structure that reduces the waste material generation and reduce production costs.

[background technology]

The computing of computer and running mainly are to finish by central processing unit (CPU), yet along with central processing unit operates the more and more faster of speed, the thermal value of CPU is also along with increasing, for central processing unit can be operated normally, so the computer dealer all can be provided with a heat radiation module on CPU.

Existing heat radiation module 1, see also shown in Figure 1, it mainly is installing one heating radiator 11 on CPU 2, the top of this heating radiator 11 is provided with a

radiator fan

12,11 4 corners of this heating radiator are provided with fixed orifice 13, this fixed orifice 13 can wear for bolting element 14, is arranged with flexible member 15 on this bolting element 14.This CPU 2 is assembled in the stationary installation 4 of circuit board 3, and this stationary installation 4 includes a pedestal 41, a gland 42, a depression bar 43 and several fixtures 44.This pedestal 41 is the plate bodys that form a rectangle frame with insulating material, be provided with the slot 411 of arranging shape in the surface of pedestal 41, this slot 411 can be planted for the terminal of CPU 2, side in pedestal 41 is provided with gland 42, these pedestal 41 opposite sides are provided with hook part 412 outwardly, be provided with several fixed orifices 413 in pedestal 41 in addition, this fixed orifice 413 can be provided with for the nut 442 of fixture 44.This gland 42 is the plate bodys that form a rectangle frame equally with insulating material, wherein is provided with a through hole 421, and these gland 42 1 sides are hubbed on the pedestal 41, and opposite side has then extended a pressing part 422.This depression bar 43 is to be a L shaped round bar, and depression bar 43 is the sides that are hubbed at pedestal 41.This fixture 44 has bolt 441 and nut 442, and this nut 442 is to be arranged in the fixed orifice 413 of pedestal 41, bolt 441 then by the backboard 5 of circuit board 3 belows upwards spiral shell be located on the nut 442.Be provided with a backboard 5 in the below of circuit board 3 in addition, this backboard 5 is with metal plate body.

Existing heat radiation module 1 is when implementing, please cooperate Fig. 2 to consult, be that CPU 2 is arranged in the stationary installation 4, again the nut 442 of fixture 44 fixed orifice 413 by pedestal 41 is worn downwards, and bolt 441 is located in the nut 442 by the backboard 5 belows spiral shell that makes progress, and then heating radiator 11 is arranged at the top of CPU 2, pass flexible member 15 and fixed orifice 13 with bolting element 14 after, pass circuit board 3 and backboard 5 again, locked with nut 16.

Though existing heat radiation module 1 can reach the purpose that CPU 2 is dispelled the heat by above-mentioned structure, yet, because this backboard 5 is to make with metal, therefore backboard 5 pads easy and circuit board 3 form Metal Contact and produce short circuit, and for the weight that alleviates backboard 5 and increase configuration space, this backboard 5 can be removed unnecessary part, and produces metallic scrap, and then causes cost waste.

Because existing C PU heat radiation module has above-mentioned disappearance, be with, the backboard that will how to overcome existing CPU heat radiation module causes Metal Contact easily and produces short circuit, and is easy to generate metallic scrap and causes cost waste, the time be the problem that present dealer demanded urgently overcoming.

[utility model content]

The purpose of this utility model is to be to provide a kind of CPU heat radiation modular structure, is to make with plastic cement by this backboard, and can effectively reduces the generation of metallic scrap, to reach the purpose that reduces production costs.

In order to achieve the above object, the utility model provides a kind of CPU heat radiation modular structure, and this heat radiation module includes at least:

One heating radiator, top are provided with a radiator fan, and four corners of this heating radiator are provided with fixed orifice, and this fixed orifice wears for bolting element;

One CPU is to be arranged between heating radiator and the circuit board;

One circuit board, this circuit board is provided with a stationary installation, and this stationary installation is provided with for CPU, and this stationary installation is provided with several fixed orifices; And

One backboard is the below that is arranged at circuit board, and this backboard is provided with several fixed orifices and perforation,

It is characterized in that: this backboard is to make with plastic cement, and is provided with a groove in the bottom of backboard, and this groove can be provided with for a metal fixed head.

Described CPU heat radiation modular structure, it is characterized in that: this fixed head and CPU stationary installation set firmly, and backboard then sets firmly with heating radiator four corners.

Described CPU heat radiation modular structure is characterized in that: have bolt on this fixed head temporarily.

Described CPU heat radiation modular structure, it is characterized in that: lower edge is provided with several salient points around this backboard groove.

Accept above-mentioned, major technique means of the present utility model are to provide a kind of CPU heat radiation modular structure, it mainly is that the backboard that is arranged at the circuit board below is made with plastic cement, this backboard bottom is provided with a groove, this groove can supply a metal fixed head setting, this fixed head can provide a preferable structural strengthening effect, wherein, this fixed head is to set firmly with the CPU stationary installation, backboard then sets firmly with heating radiator four corners, by this backboard is to make with plastic cement, and can effectively reduce the generation of metallic scrap, to reach the purpose that reduces production costs.

Of the present utility model time a technological means is to provide a kind of CPU heat radiation modular structure, it mainly is that the backboard that is arranged at the circuit board below is made with plastic cement, this backboard bottom is provided with a groove, this groove can supply a metal fixed head setting, this fixed head can provide a preferable structural strengthening effect, wherein, has bolt on this fixed head temporarily, this bolt can be arranged in the fixed orifice of backboard, lower edge is provided with several salient points around the backboard groove in addition, can make fixed head pay temporarily in the groove of backboard by this salient point and bolt, to reach the effect of simplifying assembling.

[description of drawings]

Fig. 1 is the three-dimensional exploded view of existing CPU heat radiation module.

Fig. 2 is the assembled sectional view of existing CPU heat radiation module.

Fig. 3 is the three-dimensional exploded view of the utility model CPU heat radiation module.

Fig. 4 is the synoptic diagram of another angle of the utility model backboard.

Fig. 5 is the assembled sectional view of the utility model CPU heat radiation module.

1 heat radiation module, 11 heating radiators, 12 radiator fans

13 fixed orifices, 14 bolting elements

15 flexible members, 16 nuts

2CPU

3 circuit boards

4 stationary installations, 41 pedestals, 411 slots

412 hook parts, 413 fixed orifices

42 glands, 421 through holes

422 pressing parts, 43 depression bars

44 fixtures, 441 bolts

442 nuts

5 backboards

6 heat radiation modules, 61 heating radiators, 62 radiator fans

63 fixed orifices, 64 bolting elements

65 flexible members, 66 nuts

7CPU

8 stationary installations, 81 pedestals, 811 slots

812 hook parts, 813 fixed orifices

82 glands, 821 through holes

822 pressing parts, 83 depression bars

84 fixtures, 841 bolts

842 nuts

9 backboards, 90 fixed heads, 91 fixed orifices

92 perforation, 93 grooves

94 salient points

The B circuit board

[embodiment]

Be the effect that enables to be easier to understand structure of the present utility model and can reach, cooperate graphic explanation as the back now:

At first, see also shown in Figure 3, this module 6 that dispels the heat, it mainly is installing one heating radiator 61 on CPU 7, the top of this heating radiator 61 is provided with a

radiator fan

62,61 4 corners of this heating radiator are provided with fixed orifice 63, and this fixed orifice 63 can wear for bolting element 64, is arranged with flexible member 65 on this bolting element 64.This CPU 7 is assembled in the stationary installation 8 of circuit board B, and this stationary installation 8 includes a pedestal 81, a gland 82, a depression bar 83 and several fixtures 84.This pedestal 81 is the plate bodys that form a rectangle frame with insulating material, be provided with the slot 811 of arranging shape in the surface of pedestal 81, this slot 811 can be planted for the terminal of CPU 7, side in pedestal 81 is provided with gland 82, these pedestal 81 opposite sides are provided with hook part 812 outwardly, be provided with several fixed orifices 813 in pedestal 81 in addition, this fixed orifice 813 can be provided with for the nut 842 of fixture 84.This gland 82 is the plate bodys that form a rectangle frame equally with insulating material, wherein is provided with a through hole 821, and these gland 82 1 sides are hubbed on the pedestal 81, and opposite side has then extended a pressing part 822.This depression bar 83 is a L shaped round bar, and depression bar 83 is the sides that are hubbed at pedestal 81.This fixture 84 has bolt 841 and nut 842, this nut 842 is to be arranged in the fixed orifice 813 of pedestal 81, be provided with a backboard 9 in the below of circuit board B, wherein, please cooperate Fig. 4 to consult, this backboard 9 is to make not have a plastic cement of electric conductivity, this backboard 9 is provided with several fixed orifices 91 and bores a hole 92, be provided with a groove 93 in the bottom of backboard 9, this groove 93 can be provided with for a metal fixed head 90, this fixed head 90 can provide backboard 9 one preferable structural strengthening effect, lower edge is provided with several salient points 94 around groove 93, and this salient point 94 can make fixed head 90 pay temporarily in groove 93, in addition, this fixed head 90 can be paid bolt 841 on four corners of fixed head 90 when implementing temporarily.

See also shown in Figure 5 again, the utility model is when implementing, be to utilize the salient point 94 of backboard 9 to pay in the groove 93 of backboard 9 temporarily in advance fixed head 90, bolt 841 on the fixed head 90 then can pass backboard 9 fixed orifices 91, CPU 7 is arranged in the stationary installation 8, after utilizing gland 82 with CPU 7 compactings, with depression bar 83 hooks in the hook part 812 of pedestal 81, the nut 842 of fixture 84 is worn back and bolt 841 by the fixed orifice 813 of pedestal 81, and to give spiral shell solid, then nut 66 is passed perforation 92 by the bottom of backboard 9 and form temporary paying, again heating radiator 61 is arranged at the top of CPU 7, after bolting element 64 passed flexible member 65, be arranged in the fixed orifice 63 and the circuit board B of heating radiator 61 again, screw togather fixingly, so promptly finish combination of the present utility model with nut 66.

Effect of the present utility model is, make with plastic cement by the backboard 9 that will be arranged at circuit board B below, and can effectively reduce the manufacturing cost of backboard 9, and avoid the generation of metallic scrap, and the bottom of backboard 9 is provided with a groove 93, can be provided with for a metal fixed head 90 by this groove 93, utilize this fixed head 90 can provide backboard 9 one preferable reinforcing effect, in addition, utilize salient point 94 and bolt 841 to pay temporarily fixed head 90 and base plate 9 in advance, again the stationary installation 8 of fixed head 90 and CPU 7 bolt 841 and the nut 842 with fixture 84 set firmly, backboard 9 then then sets firmly with bolting element 64 and nut 66 with four corners of heating radiator 61, can effectively simplify the assembling process of this heat radiation module 6 whereby, and reach firm in conjunction with effect.

In sum, CPU heat radiation modular structure of the present utility model can improve existing disappearance really by above-mentioned structure, and can reach the purpose and the effect of institute's demand, should meet the important document of novelty, progressive and practicality.

Claims

1. CPU heat radiation modular structure, this heat radiation module includes at least:

One heating radiator, top are provided with a radiator fan, and four corners of this heating radiator are provided with fixed orifice, and this fixed orifice can wear for bolting element;

One CPU is to be arranged between heating radiator and the circuit board;

2. CPU heat radiation modular structure as claimed in claim 1, it is characterized in that: this fixed head and CPU stationary installation set firmly, and backboard then sets firmly with heating radiator four corners.

3. CPU heat radiation modular structure as claimed in claim 1 is characterized in that: have bolt on this fixed head temporarily.

4. CPU heat radiation modular structure as claimed in claim 1, it is characterized in that: lower edge is provided with several salient points around this backboard groove.