CN201499371U - Circuit board structure - Google Patents
Circuit board structure Download PDFInfo
- Publication number
- CN201499371U CN201499371U CN 200920177309 CN200920177309U CN201499371U CN 201499371 U CN201499371 U CN 201499371U CN 200920177309 CN200920177309 CN 200920177309 CN 200920177309 U CN200920177309 U CN 200920177309U CN 201499371 U CN201499371 U CN 201499371U
- Authority
- CN
- China
- Prior art keywords
- weld pad
- board structure
- circuit board
- circuit
- cross
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
Abstract
A circuit board structure comprises a ball grid array element with pluralities of electrical pins, a circuit board body with a plurality of solder pads and a soldermask layer which is formed on the surface of the circuit board body and partially coats the solder pads, a plurality of openings are formed on the soldermask layer corresponding to positions of the solder pads, and the electrical pins are respectively soldered on the corresponding solder pads via the openings, thereby reducing risk of poor electric short circuit of the circuit board structure, and effectively increasing combination strength between the solder pads and the circuit board body.
Description
Technical field
The utility model relates to a kind of board structure of circuit, particularly relates to a kind of board structure of circuit that can effectively increase the bond strength between weld pad and the circuit board.
Background technology
Significantly increase along with various Portable (Portable) product function demands such as communication, network and computers, thereby being laid with various difference in functionality and electronic component not of uniform size on the most printed circuit board (PCB), described electronic component for example is ball grid array element (Ball Grid Array; BGA), cover crystal cell (Flip Chip; FC), chip size packages element (Chip Size Package; CSP) and multi-chip module element (Multi Chip Module; MCM) etc., and great majority have a plurality of electrical pins in above-mentioned electronic component, and utilize existing surface adhesion technology (Surface-Mounting Technology usually; SMT), and be able to described electrical pin is soldered on the weld pad (Pad) of this printed circuit board (PCB), thereby electrically connect this electronic component and this printed circuit board (PCB), and make this electronic component be carried out operation by weldering stick (Solder paste).
But, along with electronic product more and more develops towards compact direction, be installed in printed circuit board (PCB) in this electronic product and electronic component also towards high density, the direction of microminiaturization develops, so, make in the printed circuit board (PCB) corresponding the diminishing of size in order to a plurality of weld pads of welding described electrical pin, yet when the weld pad size decreases, mean that the contact area between weld pad and printed circuit board (PCB) diminishes, correspondingly make the bond strength between weld pad and the printed circuit board (PCB) die down, so, then in welding when respectively the electrical pin of this electronic component is to weld pad, or transport, maintenance has been welded in the printed circuit board (PCB) process of this electronic component respectively, the situation that weld pad is peeled off on printed circuit board (PCB) takes place easily, and then influences the quality and the product yield of electronic packing piece.
In sum, how a kind of board structure of circuit is proposed, to avoid many disadvantages of the prior art, with the bond strength between effective increase weld pad and circuit board, the real technical problem that solves by the anxious desire of present industry.
The utility model content
Shortcoming in view of above-mentioned prior art, the purpose of this utility model provides a kind of board structure of circuit that a plurality of weld pads combine with circuit board that has, to guarantee at described weld pad each other not electrically under the prerequisite of bridge joint, effectively increase the bond strength between weld pad and the circuit board, and then promote the quality and the product yield of electronic packing piece.
For reaching above-mentioned and other purpose, the utility model provides a kind of board structure of circuit, comprising: the ball grid array element has the first surface that a plurality of electrical pins are set; The circuit board body has and this first surface opposing second surface, and corresponding with described electrical pin respectively a plurality of weld pads are set on this second surface; And welding resisting layer, be covered on this second surface and the described weld pad, and have corresponding with described weld pad respectively a plurality of openings, and respectively the cross-sectional area of this opening is less than the cross-sectional area of respectively corresponding respectively this weld pad, and respectively this electrical pin is welded in respectively on respectively this weld pad of correspondence via this opening respectively.
In an embodiment of the present utility model, the cross-sectional area of described opening is equal to or greater than the cross-sectional area of the electrical pin corresponding with it.The periphery of described electrical pin all is coated with scolding tin.This welding resisting layer is green lacquer.The shape of cross section of described weld pad and described opening is circle, wherein, respectively the orthographic projection in the center of circle of this opening respectively with the center of circle overlaid of corresponding respectively this weld pad.The area of described weld pad equates, and the area of described opening equates.
As from the foregoing, the utility model provides a kind of board structure of circuit, the ball grid array element that comprises a plurality of electrical pins, the circuit board body of a plurality of weld pads, and be formed at this circuit board body surface and part covers the welding resisting layer of described weld pad, this welding resisting layer is formed with a plurality of openings in the position of the described weld pad of correspondence, to expose outside the part of described weld pad, use the risk that bad electrical short circuit takes place in minimizing on board structure of circuit, and effectively increase bond strength between described weld pad and this circuit board body, and then the quality and the product yield of lifting electronic packing piece, so board structure of circuit provided by the utility model has the industry applications of height.
Description of drawings
Fig. 1 is the partial cutaway schematic of the board structure of circuit of an embodiment of the present utility model;
Fig. 2 is the local schematic top plan view of the board structure of circuit of Fig. 1.
The main element symbol description:
1 board structure of circuit
11 ball grid array elements
111 electrical pins
112 first surfaces
113 scolding tin
12 circuit board bodies
121 second surfaces
13 welding resisting layers
131 openings
14 weld pads
Embodiment
Below by specific instantiation execution mode of the present utility model is described, those skilled in the art can understand other advantages of the present utility model and effect easily by the content that this specification disclosed.
Fig. 1 and Fig. 2 are the schematic diagram of the board structure of circuit of an embodiment of the present utility model.It should be noted that herein, described accompanying drawing is the schematic diagram of simplification, it only illustrates basic framework of the present utility model in a schematic way, therefore it only shows the formation relevant with the utility model, and shown formation be not number when implementing, shape with reality, and dimension scale draw, when reality is implemented, still can carry out appropriate change with regard to above-mentioned number, shape and dimension scale according to situation.
As shown in Figure 1, board structure of circuit 1 of the present utility model comprises ball grid array element 11, circuit board body 12 at least, reaches welding resisting layer 13.This ball grid array element 11 has a plurality of electrical pins 111, and the periphery of described electrical pin 111 is coated with scolding tin 113, thereby is able to this ball grid array element 11 is welded on the circuit board body 12.This circuit board body 12 for example is a single-layer printed circuit plate or for multilayer board, but not as limit.
Below promptly cooperate Fig. 1, Fig. 2 to be elaborated with above-mentioned each assembly to board structure of circuit 1 of the present utility model.
As shown in Figure 1 and Figure 2, this ball grid array element 11 has first surface 112, and this first surface 112 is provided with a plurality of electrical pins 111.Have on this circuit board body 12 and this first surface 112 opposing second surface 121, this second surface 121 is provided with respectively a plurality of weld pads 14 corresponding with described electrical pin 111, reaching the purpose that electrically connects this ball grid array element 11 and this circuit board body 12, thereby make this ball grid array element 11 be carried out operation.
This welding resisting layer 13 is covered on the second surface 121 and described weld pad 14 of this circuit board body 12, and have respectively a plurality of openings 131 corresponding with described weld pad 14, the cross-sectional area of described opening 131 less than with the cross-sectional area of its corresponding pad 14, so that the subregion of described weld pad 14 be exposed to its corresponding opening 131 in, that is to say, the subregion of the described weld pad 14 of these welding resisting layer 13 shades, thereby the electrical pin 111 that makes this ball grid array element 11 is able to be welded in respectively on the pairing weld pad 14 via described opening 131, and then reaches the purpose that electrically connects ball grid array element 11 and circuit board body 12.Moreover in an embodiment of the present utility model, the area of described weld pad 14 equates, and the area of described opening 131 is equal, but not as limit.
In addition, on board structure of circuit 1 of the present utility model, because the part of the described weld pad 14 of these welding resisting layer 13 shades, thereby effectively prevented to be coated on scolding tin 113 bridge joint and cause this board structure of circuit 1 that the situation of bad electrical short circuit takes place each other on the described electrical pin 111.
In an embodiment of the present utility model, the shape of cross section of described weld pad 14 and opening 131 is circle, and respectively the orthographic projection in the center of circle of this opening 131 respectively with the center of circle overlaid of corresponding respectively this weld pad 14, but not as limit, respectively the shape of cross section of this opening 131 still can be complied with the shape of cross section of corresponding respectively this electrical pin 111 and appropriate change.
Should be noted that, in order effectively to increase the bond strength between described weld pad 14 and this circuit board body 12, board structure of circuit 1 of the present utility model increases the contact area of weld pad 14 and circuit board body 12, and the contact area that is increased for example is the area of oblique dashed region shown in Figure 2, but because the increase of above-mentioned contact area can cause adjacent two weld pads 14 more close each other, thereby when ball grid array element 11 is soldered to circuit board body 12, between adjacent weld pad 14 situation that the tin bridging connects will take place more easily, and then cause the situation that bad electrical short circuit takes place on this board structure of circuit 1.
In order to prevent that effectively above-mentioned tin bridging from connecing the generation of situation, board structure of circuit 1 of the present utility model provides a welding resisting layer 13, use and cover the contact area that this weld pad 14 is increased, that is to say, the cross-sectional diameter L1 of described opening 131 less than with the cross-sectional diameter L2 of its corresponding pad 14, to increase the frontier distance that exposes zone (skew lines zone as shown in Figure 2) of adjacent welding-pad 14, use intercepting the scolding tin 113 be welded on the described weld pad 14 and be connected with each other, and then prevent that the situation that above-mentioned tin bridging connects from taking place.
Moreover the cross-sectional diameter L1 of described opening 131 is equal to or greater than the cross-sectional diameter L3 of the electrical pin 111 corresponding with it, thus help with described electrical pin 111 be welded in its corresponding pad 14 on, thereby moved this ball grid array element 11.And the quantity of the described opening 131 of this welding resisting layer 13 equals the quantity of described weld pad 14, to make described weld pad 14 can be respectively corresponding with an electrical pin 111 on this ball grid array element 11, thereby electrically connect this ball grid array element 11 and this circuit board body 12, and carry out the operation of this board structure of circuit 1.
In addition, this welding resisting layer 13 can be selected green lacquer for use, but not as limit, and the insulating material that this welding resisting layer 13 also can be selected other for use as an alternative.
From the above, the utility model provides a kind of board structure of circuit, the ball grid array element that comprises a plurality of electrical pins, the circuit board body of a plurality of weld pads, and be formed at this circuit board body surface and partly cover the welding resisting layer of described weld pad (promptly being formed at the side and the part upper surface of described weld pad), this welding resisting layer is formed with a plurality of openings in the position of the described weld pad of correspondence, to expose the also part of the described weld pad of shade, use the risk that bad electrical short circuit takes place in minimizing on board structure of circuit, and effectively increase bond strength between weld pad and the circuit board, and then the quality and the product yield of lifting electronic packing piece, so board structure of circuit provided by the utility model has the industry applications of height.
The foregoing description is illustrative principle of the present utility model and effect thereof only, but not is used to limit the utility model.Any those skilled in the art all can be under spirit of the present utility model and category, and the foregoing description is modified and changed.Therefore, rights protection scope of the present utility model should be foundation with the scope of claims.
Claims (7)
1. a board structure of circuit is characterized in that, comprising:
The ball grid array element has the first surface that a plurality of electrical pins are set;
The circuit board body has and this first surface opposing second surface, and this second surface is provided with corresponding with described electrical pin respectively a plurality of weld pads; And
Welding resisting layer, be covered on this second surface and the described weld pad, and have corresponding with described weld pad respectively a plurality of openings, and respectively the cross-sectional area of this opening is less than the cross-sectional area of respectively corresponding respectively this weld pad, and respectively this electrical pin is welded in respectively on respectively this weld pad of correspondence via this opening respectively.
2. board structure of circuit according to claim 1 is characterized in that: the cross-sectional area of described opening is equal to or greater than the cross-sectional area of the electrical pin corresponding with it.
3. board structure of circuit according to claim 1 is characterized in that: the periphery of described electrical pin all is coated with scolding tin.
4. board structure of circuit according to claim 1 is characterized in that: this welding resisting layer is green lacquer.
5. board structure of circuit according to claim 1 is characterized in that: the shape of cross section of described weld pad and described opening is circle.
6. board structure of circuit according to claim 5 is characterized in that: respectively the orthographic projection in the center of circle of this opening respectively with the center of circle overlaid of corresponding respectively this weld pad.
7. board structure of circuit according to claim 1 is characterized in that: the area of described weld pad equates, and the area of described opening equates.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200920177309 CN201499371U (en) | 2009-09-04 | 2009-09-04 | Circuit board structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200920177309 CN201499371U (en) | 2009-09-04 | 2009-09-04 | Circuit board structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201499371U true CN201499371U (en) | 2010-06-02 |
Family
ID=42442559
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200920177309 Expired - Fee Related CN201499371U (en) | 2009-09-04 | 2009-09-04 | Circuit board structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201499371U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111447740A (en) * | 2019-01-17 | 2020-07-24 | 日本特殊陶业株式会社 | Package with a metal layer |
-
2009
- 2009-09-04 CN CN 200920177309 patent/CN201499371U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111447740A (en) * | 2019-01-17 | 2020-07-24 | 日本特殊陶业株式会社 | Package with a metal layer |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US7652362B2 (en) | Semiconductor package stack with through-via connection | |
| US9837331B1 (en) | Semiconductor device having overlapped via apertures | |
| CN101336042B (en) | Solder pad, circuit board and electronic apparatus having the solder pad | |
| US20120267782A1 (en) | Package-on-package semiconductor device | |
| KR101198411B1 (en) | package on package substrate | |
| KR102358343B1 (en) | Semiconductor package | |
| CN101859752A (en) | Stack package structure and manufacture method thereof with chip embedded and silicon through hole crystal grain | |
| CN104576593A (en) | Package structure and method for fabricating the same | |
| CN106298731B (en) | Circuit board and semiconductor package including the same | |
| CN101897175B (en) | Reflowable camera module with improved reliability of solder connections | |
| CN107785344A (en) | Electronic package and manufacturing method thereof | |
| CN103021969B (en) | substrate, semiconductor package and manufacturing method thereof | |
| CN100534263C (en) | Circuit board conductive lug structure and making method | |
| CN105514053B (en) | Semiconductor package and fabrication method thereof | |
| CN104112715A (en) | Semiconductor Device And Method Of Manufacturing Same | |
| CN104795356A (en) | Semiconductor package and fabrication method thereof | |
| KR101653563B1 (en) | Stack type semiconductor package and method for manufacturing the same | |
| CN201499371U (en) | Circuit board structure | |
| CN101989587A (en) | Electrical connection structure of circuit board and circuit board device | |
| CN101241868B (en) | Encapsulation technology for internal buried semiconductor component and its encapsulation structure | |
| CN107241862B (en) | Circuit board | |
| JP2005340450A (en) | Semiconductor device, its manufacturing method, circuit board, and electronic apparatus | |
| CN103137581B (en) | Semiconductor device with conductive bump, package structure and manufacturing method | |
| CN206098376U (en) | Packaging structure | |
| CN100481480C (en) | Glass flip-chip packaging construction for image sensor |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20100602 Termination date: 20150904 |
|
| EXPY | Termination of patent right or utility model |