CN201495306U - Improved structure of cathode conductive copper plate of plating tank - Google Patents

Abstract

The utility model relates to an improved structure of a cathode conductive copper plate of a plating tank. The improved structure mainly comprises an internal layer body for increasing strength, a middle layer body and an external layer body, wherein the middle layer body wraps the internal layer body and is used for conduction, and the external layer body wraps the middle layer body and forms the protective function. The layer bodies make the conductivity of the cathode conductive copper plate be stable, increase the qualified rate of electroplating quality, avoid the erosion of electroplating liquid and prolong the service life, wherein the internal layer body is made of steel material, the middle layer body is made of copper material, and the external layer body is made of titanium or galvanized iron material.

Description

Plating tank negative electrode conductive copper plate improves structure

Technical field

The utility model relates to a kind of plating tank negative electrode conductive copper plate and improves structure, particularly relates to a kind of electroplate liquid that can prevent and corrode in electroplating activity, makes that conduction is stable, the electroplating quality yield promotes, and the negative electrode conductive copper plate structure that can increase the service life.

Background technology

The general plating tank that is applied to circuit board manufacturing, usually as shown in Figure 1, be provided with board 11, be located at the cell body 12 of board 11 belows, at the bilateral anode that is provided with of cell body 12 grooves, and, make the circuit card 14 that is hung on board 11 pass through the conduction of anode 15 and negative electrode conduction paulownia plate 13 by board 11 connection negative electrode conductive copper plates 13, constitute galvanized operation.Existing negative electrode conductive copper plate 13 as shown in Figure 2, for adopting integrated copper coin, because the characteristic of copper coin, there is following shortcoming at least in it:

1, because negative electrode conductive copper plate 13 uses on plating tank for a long time, the acid gas in the groove easily makes the copper coin oxidation and causes the pollution of electroplate liquid.

2, because of being subjected to the pollution of electroplate liquid, therefore every use once needs instant the cleaning, during quite trouble, and consumption expenses of labour.

3, when cleaning, adhered to various soups, made the also very fast souring of water of being cleaned to cause copper coin uneven, caused conduction bad because of constantly being etched owing to copper coin.

4, because negative electrode conductive copper plate 13 is very important in electroplating technology, the instability of conduction will cause bad electroplating quality.

5, work-ing life shorter, general about 2 years need be changed new product, cause the waste of cost and resource.

Summary of the invention

Main purpose of the present utility model provides a kind of plating tank negative electrode conductive copper plate and improves structure, makes the negative electrode conductive copper plate can prevent that in electroplating activity electroplate liquid from corroding, and makes that its conduction is stable, the electroplating quality yield promotes, and can prolong the life-span of use.

For achieving the above object; the utility model provides a kind of plating tank negative electrode conductive copper plate to improve structure; comprise the internal layer body of Gong gaining in strength; be coated on this internal layer body,, and be coated on this middle level body for the middle level body of conduction; constitute the outer layer body of provide protection; by described layer body make the conduction of negative electrode conductive copper plate stable, the electroplating quality yield promotes, and avoids being corroded by electroplate liquid, prolongs the life-span of using.

Aforesaid plating tank negative electrode conductive copper plate improves in the structure, and wherein this internal layer body is a steel material, and this middle level body is a copper material, and this outer layer body then is the material of titanium matter or galvanized iron matter.

The utility model is compared with existing negative electrode conductive copper plate, and it has following advantage at least:

1, negative electrode conductive copper plate 2 uses on plating tank for a long time, and the acid gas in the groove can not make the copper coin oxidation and cause the pollution of electroplate liquid.

2, can be subjected to the pollution of electroplate liquid because of use, outer matcoveredn when therefore every use once needs instant the cleaning can be because of the rinse water souring, and corrodes conductive copper plate.

3, since negative electrode conductive copper plate 2 can not be etched and uneven, so can avoid conducting electricity bad factor.

4, owing to stablizing that conductive phase is worked as, avoid causing bad electroplating quality, and then can promote the yield of electroplating quality.

5, work-ing life longer, need not need change new product at short notice, save cost and resource.

Description of drawings

Fig. 1 is the structure iron of plating tank.

Fig. 2 is the stereographic map of existing negative electrode conductive copper plate.

Fig. 3 is a stereographic map of the present utility model.

Fig. 4 is the A-A ' sectional block diagram of Fig. 3.

The main element nomenclature:

11. board 12. cell bodies 13. connect the negative electrode conductive copper plate

14. circuit card 2. negative electrode conductive copper plates

21. internal layer body 22. middle level bodies 23. outer layer bodies

15. anode

Embodiment

Please consult Fig. 2 and Fig. 3 simultaneously, negative electrode conductive copper plate 2 of the present utility model mainly comprises the internal layer body 21 of Gong gaining in strength, and is coated on this internal layer body 21, for the middle level body 22 of conduction, and is coated on this middle level body 22, constitutes the outer layer body 23 of provide protection.Wherein, in the present embodiment, this internal layer body 21 is a steel material, because whole negative electrode conductive copper plate 2 has suitable length, the hardness by steel makes negative electrode conductive copper plate 2 in use prevent to be out of shape improperly to improve its anchorage force; This middle level body 22 is copper material, to reach the favorable conductive effect, makes galvanized quality good; This outer layer body 23 then is the material of titanium matter or galvanized iron matter, for this middle level body 22 of protection, avoids this copper middle level body 22 to be electroplated soup and corrodes.

By the combination of aforesaid member, when negative electrode conductive copper plate 2 is used in as the electroplating activity of Fig. 1, can not be electroplated soup and do not corroded, make it reach that conduction is stable, the electroplating quality yield promotes, and corroded by electroplate liquid because of can avoiding, so prolonged the life-span of use.

The utility model is compared with existing negative electrode conductive copper plate, and it has following advantage at least:

1, negative electrode conductive copper plate 2 uses on plating tank for a long time, and the acid gas in the groove can not make the copper coin oxidation and cause the pollution of electroplate liquid.

2, can be subjected to the pollution of electroplate liquid because of use, outer matcoveredn when therefore every use once needs instant the cleaning can be because of the rinse water souring, and corrodes conductive copper plate.

3, since negative electrode conductive copper plate 2 can not be etched and uneven, so can avoid conducting electricity bad factor.

4, owing to stablizing that conductive phase is worked as, avoid causing bad electroplating quality, and then can promote the yield of electroplating quality.

5, work-ing life longer, need not need change new product at short notice, save cost and resource.

In sum, the utility model constitutes plating tank negative electrode conductive copper plate and improves structure with each layer body of differing materials, makes the negative electrode conductive copper plate can prevent that in electroplating activity electroplate liquid from corroding, make that its conduction is stable, the electroplating quality yield promotes, and can prolong the life-span of use.

Claims (2)

1. a plating tank negative electrode conductive copper plate improves structure, it is characterized in that, comprises:

For the internal layer body of gaining in strength, it is a steel material;

For the middle level body of favorable conductive, be coated on this internal layer body, it is a copper material;

To constitute the outer layer body of provide protection, be coated on this middle level body, it is a titanium material;

By aforesaid member combination, constitute the negative electrode conductive copper plate.

2. a plating tank negative electrode conductive copper plate improves structure, it is characterized in that, comprises:

For the internal layer body of gaining in strength, it is a steel material;

For the middle level body of favorable conductive, be coated on this internal layer body, it is a copper material;

To constitute the outer layer body of provide protection, be coated on this middle level body, it is the galvanized iron material;

By aforesaid member combination, constitute the negative electrode conductive copper plate.

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