CN201487722U - Light emitting diode backlight source and display device with same - Google Patents
Light emitting diode backlight source and display device with same Download PDFInfo
- Publication number
- CN201487722U CN201487722U CN2009201732251U CN200920173225U CN201487722U CN 201487722 U CN201487722 U CN 201487722U CN 2009201732251 U CN2009201732251 U CN 2009201732251U CN 200920173225 U CN200920173225 U CN 200920173225U CN 201487722 U CN201487722 U CN 201487722U
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- printed circuit
- circuit board
- led
- emitting diode
- light emitting
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Abstract
The utility model discloses an LED (light emitting diode) backlight source and a display device with same, which relates to the technical field of backlight source and is designed for emitting the heat generated by the LED and eliminating static electricity generated by the LED. The LED backlight source comprises an LED installed on a printed circuit board; the printed circuit board is connected with a metal support plate; the metal support plate is used for supporting the printed circuit board; the printed circuit board is provided with a metal contact region; the grounding terminal of the LED is electrically connected with the metal contact region; and the metal contact region is directly contacted with the metal support plate. The display device comprises a housing, wherein the housing is internally provided with the LED backlight source. The LED backlight source is used for emitting the heat generated by the LED better and eliminating the static electricity generated by the LED.
Description
Technical field
The utility model relates to the backlight technical field, relates in particular to a kind of back light source in LED and has the display device of this backlight.
Background technology
Present back light source in LED structure popular in display device as shown in Figure 1, at first light emitting diode 7 is arranged on the printed circuit board (PCB) 6, then by double faced adhesive tape 5 printed circuit board (PCB) 6 is bonded on the metal profile 4, metal profile 4 is used for supporting printing board 6.Over against light emitting diode 7 LGP 2 is installed then, is used plastic frame 1 that blooming piece 3 is fitted on the LGP 2 at last.
As shown in Figures 2 and 3, owing to realize fixing by double faced adhesive tape 5 between printed circuit board (PCB) 6 and the metal profile 4, and the heat conductivility of double faced adhesive tape 5 is relatively poor, so the heats that the luminous back of light emitting diode 7 produces will accumulate in around it, is difficult to distribute by double faced adhesive tape 5.To cause light emitting diode 7 under hot environment, to be worked like this, greatly reduce the service life of light emitting diode.
And as shown in Figure 4, be the electrical block diagram of back light source in LED.The static that light emitting diode 7 in use produces need be eliminated by ground connection.The earth terminal of light emitting diode 7 need be connected to FPC by the wiring on the printed circuit board (PCB) 6 in the prior art, is connected to earthing module on the module board with the release electrostatic lotus by FPC again.Wherein FPC connects printed circuit board (PCB) 6 and module board, and this module board is electrical connected with liquid crystal panel again.
The static of foregoing circuit structure is eliminated the path: light emitting diode 7---printed circuit board (PCB) 6---FPC---module board.The link of process is more when as seen eliminating static, the path complexity, thus cause electrostatic charge to discharge difficulty.This just causes light emitting diode 7 electrostatic breakdowns easily, thereby causes the dead lamp phenomenon of light emitting diode 7.
The utility model content
Technical problem to be solved in the utility model is to provide a kind of back light source in LED, can distribute the heat that light emitting diode produces better, and eliminates the static that light emitting diode produces better.
For solving the problems of the technologies described above, the utility model adopts following technical scheme:
A kind of back light source in LED, comprise light emitting diode, described light emitting diode is located on the printed circuit board (PCB), described printed circuit board (PCB) is connected with metal profile, described metal profile is used to support described printed circuit board (PCB), be provided with the Metal Contact district on described printed circuit board (PCB), the earth terminal of described light emitting diode and described Metal Contact district are electrical connected, and described Metal Contact district directly contacts with described metal profile.
The back light source in LED that the utility model provides, because the earth terminal and the described Metal Contact district of described light emitting diode are electrical connected, therefore the electrostatic charge that produces in the described light emitting diode can be transferred in the described Metal Contact district, contact with described metal profile owing to described Metal Contact district again, therefore the electrostatic charge in the described Metal Contact district can directly be transferred on the large-area described metal profile, thereby eliminates the static that described light emitting diode produces better; And, contact with described metal profile by described Metal Contact district, the heat that described light emitting diode produces can also be delivered in the large-area described metal profile,, thereby better distribute the heat that described light emitting diode produces with the raising radiating efficiency.
Another technical problem to be solved in the utility model is to provide a kind of display device, can distribute the heat that light emitting diode produces better, and eliminates the static that light emitting diode produces better.
For solving the problems of the technologies described above, the utility model adopts following technical scheme:
A kind of display device, comprise housing, be provided with back light source in LED in the described housing, described back light source in LED comprises light emitting diode, described light emitting diode is located on the printed circuit board (PCB), described printed circuit board (PCB) is connected with metal profile, described metal profile is used to support described printed circuit board (PCB), on described printed circuit board (PCB), be provided with the Metal Contact district, the earth terminal of described light emitting diode and described Metal Contact district are electrical connected, and described Metal Contact district directly contacts with described metal profile.
The display device that the utility model provides, wherein earth terminal and the described Metal Contact district owing to described light emitting diode is electrical connected, therefore the electrostatic charge that produces in the described light emitting diode can be transferred in the described Metal Contact district, contact with described metal profile owing to described Metal Contact district again, therefore the electrostatic charge in the described Metal Contact district can directly be transferred on the large-area described metal profile, thereby eliminates the static that described light emitting diode produces better; And, contact with described metal profile by described Metal Contact district, the heat that described light emitting diode produces can also be delivered in the large-area described metal profile,, thereby better distribute the heat that described light emitting diode produces with the raising radiating efficiency.
Description of drawings
Fig. 1 is the schematic diagram of display device internal structure described in the prior art;
Fig. 2 is the structural representation of back light source in LED shown in Figure 1;
Fig. 3 is that the A-A of Fig. 2 is to cross sectional view;
Fig. 4 is the electrical block diagram of back light source in LED in the prior art;
Fig. 5 is the structural representation of the utility model back light source in LED embodiment;
Fig. 6 is that the B-B of Fig. 5 is to cross sectional view;
Fig. 7 is the electrical block diagram of the utility model back light source in LED embodiment;
Fig. 8 is the schematic diagram of an embodiment of snap-in structure among Fig. 5;
Fig. 9 is the schematic diagram of another embodiment of snap-in structure among Fig. 5.
Reference numeral:
1-plastic frame, 2-LGP, 3-blooming piece, 4-metal profile, 42-contact site, 44-fixed support, 442-draw-in groove, 5-double faced adhesive tape, 6-printed circuit board (PCB), 62-Metal Contact district, 64-buckle, 7-light emitting diode, 72-earth terminal, 8-snap-in structure.
The specific embodiment
The utility model aims to provide a kind of back light source in LED and has this by the display device of light source, can distribute the heat that light emitting diode produces better, and eliminates the static that light emitting diode produces better.
Below in conjunction with accompanying drawing and embodiment the utility model is described in detail.
As shown in Figure 5 and Figure 6, among the embodiment of the utility model back light source in LED, described back light source in LED comprises light emitting diode 7, light emitting diode 7 is located on the printed circuit board (PCB) 6, printed circuit board (PCB) 6 links to each other with metal profile 4, and metal profile 4 is used for supporting printing board 6, is provided with Metal Contact district 62 on printed circuit board (PCB) 6, the earth terminal 72 and the Metal Contact district 62 of light emitting diode 7 are electrical connected, and Metal Contact district 62 directly contacts with metal profile 4.
In the present embodiment because the earth terminal 72 and the Metal Contact district 62 of light emitting diode 7 is electrical connected, therefore the electrostatic charge that produces in the light emitting diode 7 can be transferred in the Metal Contact district 62, contact with metal profile 4 owing to Metal Contact district 62 again, so the electrostatic charge in the Metal Contact district 62 can directly be transferred on the large-area metal profile 4.Like this, as shown in Figure 7, the earth terminal of light emitting diode 7 is except linking to each other with earthing module on the described module board with described FPC by printed circuit board (PCB) 6, to eliminate outside the static, also link to each other with large-area metal profile 4 eliminating static further, and the link of process is less when eliminating static by metal profile 4, the path is simple, thereby make electrostatic charge discharge easily, therefore can eliminate the static that light emitting diode 7 produces better.
In addition, contact with metal profile 4, the heat that light emitting diode 7 produces can also be delivered in the large-area metal profile 4,, thereby better distribute the heat that described light emitting diode produces with the raising radiating efficiency by Metal Contact district 62.In the back light source in LED design of traditional application double faced adhesive tape, temperature around the light emitting diode 7 is usually about 50 ℃～60 ℃, be generally about 15000 hours in the life-span of light emitting diode 7 under such temperature, and after adopting metal profile 4 heat radiations, the temperature of light emitting diode 7 is descended about 10 ℃, thereby the life-span of light emitting diode 7 was improved about 5000 hours.
It can also be seen that by Fig. 5 and Fig. 6, for the Metal Contact district 62 on the printed circuit board (PCB) 6 is contacted better with metal profile 4, performance with further increase Metal Contact district 62 conductions and heat conduction, on metal profile 4, also be provided with contact site 42, and contact site 42 matches with Metal Contact district 62.
Wherein, the size of the size in this Metal Contact district 62 and contact site 42 adapts, and perhaps this Metal Contact district 62 also can be more bigger than contact site 42.This is because the transmission efficiency of electrostatic charge and heat is relevant with the size of contact area, and compares with contact site 42, and is unilaterally that 62 making of Metal Contact district are too much or too small, all is unfavorable for improving the transmission efficiency of unit contact area electrostatic charge and heat.
In the present embodiment, being shaped as of contact site 42 is spherical, because contact site 42 can utilize Sheet Metal Forming Technology to be made on metal profile 4 by diel, moves back mould conveniently and make this spherical contact site 42, therefore is convenient to processing.But as mentioned above, because when using spherical contact site 42 to contact with Metal Contact district 62, contact area is less, influenced the transmission efficiency of electrostatic charge and heat to a certain extent, for this reason in other embodiment of the present utility model, described contact site also can be made as column or gengon shape, to increase the contact area in contact site 42 and Metal Contact district 62.
And the shape to Metal Contact district 62 in the present embodiment does not limit, and according to processing situation and the actual needs that use, this Metal Contact district 62 can be circle or polygon etc.
And for the efficient that further electrostatic charge and heat transmit between raising contact site 42 and the Metal Contact district 62, this Metal Contact district 62 can be made by the material of conduction and good heat conductivity, as copper or copper alloy etc.
Need to prove, as can be known from Fig. 5, use snap-in structure 8 fixed printed circuit boards 6 and metal profile 4 in the present embodiment, snap-in structure 8 is simple to operation, be convenient to the assembly and disassembly between printed circuit board (PCB) 6 and the metal profile 4, and can avoid using double faced adhesive tape, improved the efficient that electrostatic charge and heat transmit.
For snap-in structure 8, particularly, as shown in Figure 8, on metal profile 4, be provided with fixed support 44, after printed circuit board (PCB) 6 is fastened in the fixed support 44, just make printed circuit board (PCB) 6 be connected with metal profile 4.In the present embodiment, snap-in structure 8 can be by directly bending formation on metal profile 4 of Sheet Metal Forming Technology.
Perhaps as shown in Figure 9, on metal profile 4, be provided with fixed support 44, in fixed support 44, be provided with draw-in groove 442; In addition, be provided with buckle 64, after buckle 64 is fastened in the draw-in groove 442, just make printed circuit board (PCB) 6 be connected with metal profile 4 in the both sides of printed circuit board (PCB) 6.In the present embodiment, snap-in structure 8 can be made moulding separately, and is connected on the metal profile 4 by securing members such as screw, rivet, bonding agents.
From Fig. 5, it can also be seen that, in the present embodiment, be provided with at least two snap-in structures 8 on metal profile 4, wherein for fixed printed circuit board 6 and metal profile 4 better, the number of snap-in structure 8 can be decided on the length of its printed circuit board (PCB) that will fix 6.Generally speaking, when printed circuit board (PCB) 6 50 millimeters of every increases and when above, just need to increase a snap-in structure 8.
In sum, back light source in LED in the present embodiment, because the earth terminal and the described Metal Contact district of described light emitting diode are electrical connected, therefore the electrostatic charge that produces in the described light emitting diode can be transferred in the described Metal Contact district, contact with described metal profile owing to described Metal Contact district again, therefore the electrostatic charge in the described Metal Contact district can directly be transferred on the large-area described metal profile, thereby eliminates the static that described light emitting diode produces better; And, contact with described metal profile by described Metal Contact district, the heat that described light emitting diode produces can also be delivered in the large-area described metal profile,, thereby better distribute the heat that described light emitting diode produces with the raising radiating efficiency.
Except that the embodiment of above-mentioned back light source in LED, the utility model also provides a kind of embodiment of display device, display device comprises housing described in the present embodiment, be provided with back light source in LED in this housing, wherein referring to Fig. 5 and shown in Figure 6, this back light source in LED comprises light emitting diode 7, light emitting diode 7 is located on the printed circuit board (PCB) 6, printed circuit board (PCB) 6 is connected with metal profile 4, metal profile 4 is used for supporting printing board 6, be provided with Metal Contact district 62 on printed circuit board (PCB) 6, the earth terminal 72 and the Metal Contact district 62 of light emitting diode 7 are electrical connected, and Metal Contact district 62 directly contacts with metal profile 4.
In the present embodiment, because the earth terminal 72 and the Metal Contact district 62 of light emitting diode 7 are electrical connected, therefore the electrostatic charge that produces in the light emitting diode 7 can be transferred in the Metal Contact district 62, contact with metal profile 4 owing to Metal Contact district 62 again, therefore the electrostatic charge in the Metal Contact district 62 can directly be transferred on the large-area metal profile 4, thereby can eliminate the static that light emitting diode 7 produces better; And, contact with metal profile 4 by Metal Contact district 62, the heat that light emitting diode 7 produces can also be delivered in the large-area metal profile 4, with the raising radiating efficiency, thereby can better distribute the heat that light emitting diode 7 produces.
Need to prove that wherein the 26S Proteasome Structure and Function of back light source in LED described in the present embodiment is identical with the 26S Proteasome Structure and Function of back light source in LED described in the foregoing description, does not repeat them here.
The above; it only is the specific embodiment of the present utility model; but protection domain of the present utility model is not limited thereto; anyly be familiar with those skilled in the art in the technical scope that the utility model discloses; can expect easily changing or replacing, all should be encompassed within the protection domain of the present utility model.Therefore, protection domain of the present utility model should be as the criterion with the described protection domain of claim.
Claims (10)
1. back light source in LED, comprise light emitting diode, described light emitting diode is located on the printed circuit board (PCB), described printed circuit board (PCB) links to each other with metal profile, described metal profile is used to support described printed circuit board (PCB), it is characterized in that, is provided with the Metal Contact district on described printed circuit board (PCB), the earth terminal of described light emitting diode and described Metal Contact district are electrical connected, and described Metal Contact district directly contacts with described metal profile.
2. back light source in LED according to claim 1 is characterized in that, is provided with contact site on described metal profile, and described contact site matches with described Metal Contact district.
3. back light source in LED according to claim 2 is characterized in that, the size in described Metal Contact district and the size of described contact site adapt.
4. according to each described back light source in LED of claim 1 to 3, it is characterized in that described contact site is spherical, column or gengon shape.
5. back light source in LED according to claim 4 is characterized in that, described Metal Contact district is circle or polygon.
6. back light source in LED according to claim 5 is characterized in that, described Metal Contact district is made by copper or copper alloy.
7. according to each described back light source in LED of claim 1 to 3, it is characterized in that, described metal profile is provided with fixed support, and after described printed circuit board (PCB) was fastened in the described fixed support, described printed circuit board (PCB) linked to each other with described metal profile.
8. display device, comprise housing, be provided with back light source in LED in the described housing, described back light source in LED comprises light emitting diode, described light emitting diode is located on the printed circuit board (PCB), described printed circuit board (PCB) is connected with metal profile, described metal profile is used to support described printed circuit board (PCB), it is characterized in that, on described printed circuit board (PCB), be provided with the Metal Contact district, the earth terminal of described light emitting diode and described Metal Contact district are electrical connected, and described Metal Contact district directly contacts with described metal profile.
9. display device according to claim 8 is characterized in that, is provided with contact site on described metal profile, and described contact site matches with described Metal Contact district.
10. according to Claim 8 or 9 described display devices, it is characterized in that described metal profile is provided with fixed support, after described printed circuit board (PCB) was fastened in the described fixed support, described printed circuit board (PCB) linked to each other with described metal profile.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009201732251U CN201487722U (en) | 2009-08-24 | 2009-08-24 | Light emitting diode backlight source and display device with same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009201732251U CN201487722U (en) | 2009-08-24 | 2009-08-24 | Light emitting diode backlight source and display device with same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201487722U true CN201487722U (en) | 2010-05-26 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009201732251U Expired - Lifetime CN201487722U (en) | 2009-08-24 | 2009-08-24 | Light emitting diode backlight source and display device with same |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201487722U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101886761A (en) * | 2010-06-12 | 2010-11-17 | 友达光电股份有限公司 | LED light source module |
| CN102878495A (en) * | 2012-10-12 | 2013-01-16 | 北京京东方光电科技有限公司 | Backlight and manufacturing method and display device for backlight |
| CN109147558A (en) * | 2017-06-27 | 2019-01-04 | 深圳市宇顺工业智能科技有限公司 | A kind of antistatic vehicle-mounted type display module |
| CN109215502A (en) * | 2018-08-30 | 2019-01-15 | 努比亚技术有限公司 | A kind of screen assembly |
-
2009
- 2009-08-24 CN CN2009201732251U patent/CN201487722U/en not_active Expired - Lifetime
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101886761A (en) * | 2010-06-12 | 2010-11-17 | 友达光电股份有限公司 | LED light source module |
| CN101886761B (en) * | 2010-06-12 | 2012-08-01 | 友达光电股份有限公司 | LED light source module |
| CN102878495A (en) * | 2012-10-12 | 2013-01-16 | 北京京东方光电科技有限公司 | Backlight and manufacturing method and display device for backlight |
| CN109147558A (en) * | 2017-06-27 | 2019-01-04 | 深圳市宇顺工业智能科技有限公司 | A kind of antistatic vehicle-mounted type display module |
| CN109215502A (en) * | 2018-08-30 | 2019-01-15 | 努比亚技术有限公司 | A kind of screen assembly |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: BEIJING BOE PHOTOELECTRICITY SCIENCE + TECHNOLOGY Effective date: 20150629 Owner name: JINGDONGFANG SCIENCE AND TECHNOLOGY GROUP CO., LTD Free format text: FORMER OWNER: BEIJING BOE PHOTOELECTRICITY SCIENCE + TECHNOLOGY CO., LTD. Effective date: 20150629 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20150629 Address after: 100015 Jiuxianqiao Road, Beijing, No. 10, No. Patentee after: BOE Technology Group Co., Ltd. Patentee after: Beijing BOE Photoelectricity Science & Technology Co., Ltd. Address before: 100176 No. 8 West Central Road, Beijing economic and Technological Development Zone, Beijing Patentee before: Beijing BOE Photoelectricity Science & Technology Co., Ltd. |
|
| CX01 | Expiry of patent term |
Granted publication date: 20100526 |
|
| CX01 | Expiry of patent term |