CN201467595U - Enclosure structure of electronic device - Google Patents
Enclosure structure of electronic device Download PDFInfo
- Publication number
- CN201467595U CN201467595U CN2009200476474U CN200920047647U CN201467595U CN 201467595 U CN201467595 U CN 201467595U CN 2009200476474 U CN2009200476474 U CN 2009200476474U CN 200920047647 U CN200920047647 U CN 200920047647U CN 201467595 U CN201467595 U CN 201467595U
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- Prior art keywords
- casing
- heat
- dimensional pattern
- enclosure
- utility
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Abstract
The utility model relates to an enclosure structure of an electronic device, which is mainly characterized in that the surface of three-dimensional patterns are protruded out of an electronic device enclosure made of metal material in a molding mode, the depth formed by the three-dimensional patterns can be lower than the enclosure surface or leveled with the enclosure surface; the heat radiating area of the enclosure surface can be enlarged by means of the protruded three-dimensional patterns, so the heat radiating effect of the electronic device is better; and by using the characteristic, a heat conducting component is embedded in the enclosure so as to further more quickly conduct the heat inside the electronic device to the enclosure and improve the heat radiating effect.
Description
[technical field]
The utility model has the structure of decoration functions concurrently simultaneously about a kind of radiating effect that can promote casing of electronic apparatus.
[background technology]
Along with the continuous breakthrough of electronic technology, such as mobile computer, PDA (personal digital aid (PDA)), palmtop computer, hand held VCD player, desktop PC main frame, MP3, walkman ... Deng electronic product also constantly towards light, thin, short, little characteristic research and development constantly.Any electronic product the time all can produce heat in running, if heat can not effectively discharge body outside, then the high temperature of internal body may influence the usefulness of electronic building brick, and then causes operating ineffective etc. when phenomenons such as machines, even the anxiety of burning is arranged.Therefore, the heat dissipation design of electronic product inside is very important.
Present radiating mode for the bigger electronic product of caloric value, normally radiator fan is set in casing inside, by the high temperature air in the casing is extracted out outside the casing, or cold air sucked in the casing mode that heat is discharged in convection current again, reach the purpose that reduces the casing internal temperature; Even also have at radiator fan in conjunction with parts such as heat-conductive assembly and radiating fins, with spread heat to wider, thereby more quickly with the heat eliminator.And for the less electronic product of caloric value, because its volume is just very little originally, thereby may not be provided with parts such as radiator fan, radiating fin and heat-conductive assembly in casing inside, but by casing itself heat is distributed.
In order to reach better heat radiating effect, have concurrently simultaneously and lower weight and requirement attractive in appearance, at present the common mobile computer in market, PDA, palmtop computer, MP3, walkman ... Deng electronic product, be mostly with aluminium alloy, magnesium alloy, almag or titanium alloy etc materials manufacturing; Though utilize the casing of aforementioned alloy material manufacturing to possess better heat radiating effect is arranged, but in the time of will further promoting radiating efficiency again, except must with in conjunction with other assembly (for example heat-conductive assembly, radiating fin ... Deng) outside, only can't obtain good achievement by smooth casing itself merely.Moreover electronic product provides whole decoration by the metallic luster of its metal chassis itself mostly at present, goes out color or pattern in casing surface thermoprint at most, causes the intention of its decoration to fail to have breakthrough always.
[utility model content]
In order to solve the above-mentioned deficiency of prior art, the utility model purpose is to provide a kind of improvement of casing structure of electronic installation.
The technical scheme that an embodiment of the present utility model is provided is: the casing surface forming at electronic product goes out plural three-dimensional pattern, described three-dimensional pattern can be various possible patterns or lines, in described three-dimensional pattern, be formed with plural chase simultaneously, the degree of depth of described chase can be lower than the casing surface, or it is concordant with the casing surface, enlarged the surface area of casing by the more described three-dimensional pattern that is formed at the casing surface, thereby can directly be promoted the radiating efficiency of casing itself.
The technical scheme that an embodiment of the present utility model is provided is: can be after the casing of electronic product is made level and smooth surface, utilize milling cutter that secondary operations is carried out on the casing surface again, make the vestige after the casing surface forms milling cutter processing, constitute the lines of three-dimensional pattern by described vestige.
A technological means more of the present utility model in the time of can utilizing mould to make the casing of electronic product, directly goes out to give prominence to the three-dimensional pattern on casing surface at the casing surface forming.
The technical scheme that an embodiment of the present utility model is provided is: the upper end of described three-dimensional pattern can be formed pointed, toroidal, taper or section and be trapezoidal shape.
In order to make casing structure of the present utility model further promote radiating effect again, the utility model is when making described casing, can also bury heat-conductive assembly underground in casing inside, and heat-conductive assembly is exposed outside the casing, in order to do the heat generating component or the radiating subassembly that described heat-conductive assembly are connected to electronic product, use and more quickly heat to be delivered to casing via heat-conductive assembly, thereby utilize the enlarged-area of described body and three-dimensional pattern apace heat to be got rid of.
Conclude aforementioned design of the present utility model, because casing itself does not need to do significantly structural change, but via the design of secondary operations or processing procedure cleverly, just can form the three-dimensional pattern of protuberate on the casing surface, make the utility model can under the condition that does not too increase manufacturing cost, obtain good radiating efficiency and visual decorative effect, therefore, the utility model is a design of very having a progressive, and never have identical or approximate product to be disclosed in elder generation, thereby the utility model also possess novelty is arranged.
Other purpose of the present utility model and advantage can be further understood from the disclosed technical characterictic of the utility model.For above-mentioned and other purpose, feature and advantage of the present utility model can be become apparent, embodiment cited below particularly also cooperates appended graphicly, is described in detail below.
[description of drawings]
First figure shows that structure applications of the present utility model is in the embodiment of mobile computer stereogram.
Second figure shows that the upper end that the utility model is located at the casing surface is pointed three-dimensional pattern, its chase degree of depth and the surperficial concordant part plan enlarged drawing of casing.
The 3rd figure shows that the utility model is located at the three-dimensional pattern on casing surface, and its chase degree of depth is lower than the part plan enlarged drawing on casing surface.
The 4th figure shows that the utility model is located at the three-dimensional pattern on casing surface, and its section is the part plan enlarged drawing of trapezoidal shape.
The 5th figure shows that the utility model is located at the three-dimensional pattern on casing surface, and its section is the part plan enlarged drawing that the upper end is arc surface.
The 6th figure is demonstration the utility model is buried heat-conductive assembly underground at casing of electronic apparatus a part plan cutaway view.
[primary clustering symbol description]
1... electronic installation
10... casing
11... three-dimensional pattern
12... chase
2... heat-conductive assembly
3... heat generating component
[embodiment]
Wherein, first figure shows the stereogram of general mobile computer electronic installation 1, and all being formed with three-dimensional pattern 11. described three-dimensional patterns 11 on casing 10 surfaces of described electronic installation 1 can be various possible patterns or lines; The mode of its moulding, can be after the casing 10 of electronic product be made level and smooth surface, utilize milling cutter that secondary operations is carried out on the casing surface again, make the vestige after casing surface forms milling cutter processing, constitute the lines of three-dimensional pattern 11 by described vestige. or adopt the die stamping technology not finish as yet to make casing between metal sheet mold described three-dimensional pattern 11.
Second figure shows that the utility model is located at an embodiment of the three-dimensional pattern on casing surface, described three-dimensional pattern 11 can be formed as the upper end and be pointed triangle, constitute plural chase 12 in the described three-dimensional pattern 11, the depth D of described chase 12 can be concordant with casing 10 surfaces, or make the depth D of chase 12 be lower than casing 10 surfaces following (shown in the 3rd figure).Described three-dimensional pattern 11 also can be formed as section and be trapezoidal shape (shown in the 4th figure), or section is that the upper end is arc surface (shown in the 5th figure); Also can be formed as the tapered shape of section.
In order to make casing structure further promote radiating effect again, when making described casing, can also bury heat-conductive assembly 2 underground in casing 10 inside, and heat-conductive assembly 2 is exposed outside the casing 10; When the assembling electronic product, then described heat-conductive assembly 2 is connected to the heat generating component 3 (for example CPU) or the radiating subassembly (for example radiating fin) of electronic product inside, use and more quickly heat to be delivered to casing 10 via heat-conductive assembly 2, thereby utilize the described casing 10 and the enlarged-area of three-dimensional pattern 11 apace heat to be got rid of.
Claims (6)
1. a casing of electronic apparatus structure is characterized in that, described casing adopts the metal material manufacturing, and the three-dimensional pattern on outstanding described casing surface is arranged at described casing surface forming.
2. casing of electronic apparatus structure as claimed in claim 1 is characterized in that, the lowest depth of described three-dimensional pattern is lower than the plane of described casing.
3. casing of electronic apparatus structure as claimed in claim 1 is characterized in that the lowest depth of described three-dimensional pattern is concordant with the plane of described casing.
4. casing of electronic apparatus structure as claimed in claim 1 is characterized in that, described three-dimensional pattern is made up of the block that plural concentric circles lines is constituted.
5. casing of electronic apparatus structure as claimed in claim 1 is characterized in that described casing is embedded with heat-conductive assembly.
6. as each described casing of electronic apparatus structure in the claim the 1 to 5, it is characterized in that the upper end of described three-dimensional pattern forms pointed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009200476474U CN201467595U (en) | 2009-07-20 | 2009-07-20 | Enclosure structure of electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009200476474U CN201467595U (en) | 2009-07-20 | 2009-07-20 | Enclosure structure of electronic device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201467595U true CN201467595U (en) | 2010-05-12 |
Family
ID=42394939
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009200476474U Expired - Fee Related CN201467595U (en) | 2009-07-20 | 2009-07-20 | Enclosure structure of electronic device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201467595U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109310029A (en) * | 2017-07-28 | 2019-02-05 | 宏碁股份有限公司 | Casing structure |
-
2009
- 2009-07-20 CN CN2009200476474U patent/CN201467595U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109310029A (en) * | 2017-07-28 | 2019-02-05 | 宏碁股份有限公司 | Casing structure |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20100512 Termination date: 20110720 |