CN201464501U - Fixture for testing thick film integrated circuit - Google Patents
Fixture for testing thick film integrated circuit Download PDFInfo
- Publication number
- CN201464501U CN201464501U CN2008202376743U CN200820237674U CN201464501U CN 201464501 U CN201464501 U CN 201464501U CN 2008202376743 U CN2008202376743 U CN 2008202376743U CN 200820237674 U CN200820237674 U CN 200820237674U CN 201464501 U CN201464501 U CN 201464501U
- Authority
- CN
- China
- Prior art keywords
- connecting rod
- integrated circuit
- thick film
- film integrated
- base
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Testing Of Individual Semiconductor Devices (AREA)
Abstract
The utility model relates to a fixture for testing a film integrated circuit. The fixture comprises a base, and is characterized in that a groove is formed at one end of the base; a circuit board is arranged on one side of the groove, and a pressure plate is arranged on the other side thereof; a compression device is mounted on the base and comprises a ground bar; two ends of the ground bar are hinged with one end of a first connecting rod and that of a third connecting rod respectively; the first connecting rod and the third connecting rod are hinged with the two ends of a second connecting rod; and a compression block is arranged at the other end of the third connecting rod. The fixture for testing the film integrated circuit has the advantages of time saving, high detection efficiency and stable and accurate measured data.
Description
Technical field
The utility model relates to test fixture, particularly detects the test fixture of thick film integrated circuit.
Background technology
In the prior art, the test fixture of thick film integrated circuit comprises a base, device one insulating circuit board on the base, install and the consistent socket piece of tested thick film integrated circuit outer lead pin quantity on circuit board, the outer lead of thick film integrated circuit inserts the jack in the socket piece during measurement data, and described jack is connected with test circuit, when measuring, correctly insert jack to a fairly large number of outer lead, it is time-consuming to require great effort, and detects the inefficiency of thick film integrated circuit.The outer lead of thick film integrated circuit inserts in the jack and has tolerance clearance, and contact is not very good, usually makes that the data of measuring are unstable and inaccurate.
The utility model content
The utility model is time-consuming, fragile at the thick film integrated circuit test fixture detection thick film integrated circuit of said structure, detection efficiency is low, unstable and the inaccurate problem of the data of measuring, carried out research and improved, provide a kind of and save time and detection efficiency height, the stable and accurate thick film integrated circuit test fixture of measurement data.
In order to solve the problems of the technologies described above, the utility model adopts following technical scheme:
The test fixture of thick film integrated circuit comprises base, and an end of base has groove, a side device circuit board of groove, and opposite side is provided with pressing plate; Hold down gag is installed on the base, described hold down gag is constructed as follows: comprise a ground bar, the two ends of ground bar are hinged with an end of first connecting rod and third connecting rod respectively, and first connecting rod and third connecting rod are hinged with the two ends of second connecting rod respectively, at the other end device compact heap of third connecting rod.
Further, described circuit board is provided with and the corresponding circuit bar of thick film integrated circuit outer lead; One end of described pressing plate is connected with base, and the described relatively circuit board of the other end has angle; Have an inclined-plane above the described base, described ground bar is installed on the inclined-plane; Described second connecting rod has step, and step and each connecting rod and compact heap constitute self-locking structure; Described compact heap one end has the L groove; The base top end face is provided with block.
Technique effect of the present utility model is:
1. after the utility model being used for the thick film integrated circuit test, one end of base has groove, one side device circuit board of groove, circuit board is provided with and the corresponding circuit bar of thick film integrated circuit outer lead, the outer lead of thick film integrated circuit inserts in the described groove at an easy rate, and corresponding circuit bar aligns on each outer lead and the circuit board, adopts the contraposition carefully of insertion aperture formula anchor clamps to save a large amount of time compared with prior art, effectively improves detection efficiency.Opposite side at groove is provided with pressing plate, and thick film integrated circuit outer lead and the circuit board travel permit that powers on contacts firmly when hold down gag compresses the heat dissipation base of thick film integrated circuit, and the data stabilization of measurement is accurate.Above-mentioned hold down gag has self-locking structure, makes test data further improve accuracy.Hold down gag is a four-bar mechanism, and it is also very convenient to test the back unloading.
Description of drawings
Fig. 1 looks synoptic diagram for the master of the utility model structure;
Fig. 2 is the vertical view of Fig. 1;
Fig. 3 is the axonometric three-dimensional view of Fig. 1;
Fig. 4 is the stereographic map of thick film integrated circuit element;
Fig. 5 is that the axle of the utility model application state is surveyed schematic perspective view;
Embodiment
Below in conjunction with accompanying drawing embodiment of the present utility model is further described.
See Fig. 1, Fig. 2, Fig. 3, Fig. 4, the utility model comprises base 1, and an end of base 1 has groove 15, a side device circuit board 16 of groove 15, and opposite side is provided with pressing plate 3; On the base 1 hold down gag is installed, described hold down gag is constructed as follows: comprise a ground bar 5, the two ends of ground bar 5 are hinged with an end of first connecting rod 6 and third connecting rod 8 respectively, and first connecting rod 6 and third connecting rod 8 are hinged with the two ends of second connecting rod 7 respectively, form a four-bar mechanism.Other end device compact heap 9 at third connecting rod 8, can connect by screw, nut, packing ring, wherein bar 5 and connecting rod 6,7,8 all are double-decker, hinged again after each connecting rod fit, the end equipment handle 10 of connecting rod 6, compact heap 9 one ends have the L groove, are convenient to tighten the heat dissipation base 11 of thick film integrated circuit 13.
See Fig. 3, Fig. 4, be provided with outer lead 12 corresponding circuit bars 14 with thick film integrated circuit 13; See Fig. 1, Fig. 2, the lower end of pressing plate 3 is connected with base 1, the described relatively circuit board 16 in upper end has angle, be convenient to the insertion of thick film integrated circuit outer lead 12, plastic production is folded in pressing plate 3 usefulness hard foldings, circuit board 16 usefulness copper sheets are made, and circuit bar 14 is made in the one side of copper sheet, and the another side of circuit board 16 is electrically connected with external coaxial socket 2.See Fig. 3, have an inclined-plane 17 above the base 1, ground bar 5 is installed on the inclined-plane 17; See Fig. 1, Fig. 2, second connecting rod 7 has step 18, and step 18 constitutes self-locking structure with each connecting rod and compact heap 9, and the base top end face is provided with two blocks 4, block 4 restriction thick film integrated circuit heat dissipation base slippages.
See Fig. 2, Fig. 3, when the utility model uses, the outer lead 12 of thick film integrated circuit is aimed at insertion pressing plate 3 relative circuit boards 16 to be had in the crack 15 of angle, promote handle 10, each connecting rod is around hinge through, thereby drive compact heap 9, the end face that makes compact heap 9 have the L groove faces with the radiating seat 11 of thick film integrated circuit 13 and fits, continue to promote handle 10, make radiating seat 11 constantly push pressing plate 3, thereby the crack 15 that makes pressing plate 3 relative circuit boards 16 have angle constantly diminishes, continue to promote handle 10, when first connecting rod 6 overlaps with the connecting line that is included in second connecting rod 7 two ends hinge axis wherein, hold-down mechanism just reaches self-locking state, and at this moment the six-freedom degree of thick film integrated circuit element is completely restricted, and the outer lead 12 of thick film integrated circuit is compressed by base and pressing plate, and corresponding one by one with circuit bar 14 on the circuit board 16, closely contact.The step 18 that this moment, second connecting rod 7 had is limited in the upper surface of first connecting rod 6, and restriction continues to promote handle 10, has so just finished the process of thick film integrated circuit element clamping, waits stand-by instrument detecting, as shown in Figure 5.After instrument is finished detection, promote handle 10 round about, linkage assembly drives compact heap 9 and breaks away from thick film integrated circuit radiating seat 11, makes the power that is carried on the pressing plate 3 disappear, the integrated circuit component that light taking-up has detected, cargo handling process is all over.
The utility model utilizes the relative circuit board of interlocking principle, pressing plate of hold-down mechanism to have the corresponding matching of the crack of angle and circuit bar on the circuit board and tested thick film integrated circuit outer lead, thereby limited the six-freedom degree of thick film integrated circuit element well, and cargo handling process is simple and easy and accurate, the unstable and inaccurate problem of data time-consuming, fragile, that measure when having solved the thick film integrated circuit element testing.The utility model is a kind of anchor clamps efficiently, can apply to the clamping with thick film integrated circuit base similar elements.
Claims (7)
1. the test fixture of thick film integrated circuit comprises base, it is characterized in that an end of base has groove, a side device circuit board of groove, and opposite side is provided with pressing plate; Hold down gag is installed on the base, described hold down gag is constructed as follows: comprise a ground bar, the two ends of ground bar are hinged with an end of first connecting rod and third connecting rod respectively, and first connecting rod and third connecting rod are hinged with the two ends of second connecting rod respectively, at the other end device compact heap of third connecting rod.
2. according to the test fixture of the described thick film integrated circuit of claim 1, it is characterized in that described circuit board is provided with and the corresponding circuit bar of thick film integrated circuit outer lead.
3. according to the test fixture of the described thick film integrated circuit of claim 1, it is characterized in that an end of described pressing plate is connected with base, the described relatively circuit board of the other end has angle.
4. according to the test fixture of the described thick film integrated circuit of claim 1, it is characterized in that having an inclined-plane above the described base, described ground bar is installed on the inclined-plane.
5. according to the test fixture of the described thick film integrated circuit of claim 1, it is characterized in that described second connecting rod has step, described step and each connecting rod and compact heap constitute self-locking structure.
6. according to the test fixture of the described thick film integrated circuit of claim 1, described compact heap one end has the L groove.
7. according to the test fixture of claim 1 or 4 described thick film integrated circuits, it is characterized in that described base top end face is provided with block.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2008202376743U CN201464501U (en) | 2008-12-30 | 2008-12-30 | Fixture for testing thick film integrated circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2008202376743U CN201464501U (en) | 2008-12-30 | 2008-12-30 | Fixture for testing thick film integrated circuit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201464501U true CN201464501U (en) | 2010-05-12 |
Family
ID=42391851
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2008202376743U Expired - Fee Related CN201464501U (en) | 2008-12-30 | 2008-12-30 | Fixture for testing thick film integrated circuit |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201464501U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103175996A (en) * | 2011-12-20 | 2013-06-26 | 鸿富锦精密工业(武汉)有限公司 | Text fixture for expansion card |
| CN103175997A (en) * | 2011-12-20 | 2013-06-26 | 鸿富锦精密工业(武汉)有限公司 | Text fixture for expansion card |
-
2008
- 2008-12-30 CN CN2008202376743U patent/CN201464501U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103175996A (en) * | 2011-12-20 | 2013-06-26 | 鸿富锦精密工业(武汉)有限公司 | Text fixture for expansion card |
| CN103175997A (en) * | 2011-12-20 | 2013-06-26 | 鸿富锦精密工业(武汉)有限公司 | Text fixture for expansion card |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20100512 Termination date: 20101230 |