CN201450686U

CN201450686U - Radiator for electronic products

Info

Publication number: CN201450686U
Application number: CN2009200472007U
Authority: CN
Inventors: 许振焜
Original assignee: XINLI PRECISION HARDWARE CO Ltd KUNSHAN CITY
Current assignee: XINLI PRECISION HARDWARE CO Ltd KUNSHAN CITY
Priority date: 2009-06-17
Filing date: 2009-06-17
Publication date: 2010-05-05
Anticipated expiration: 2019-06-17

Abstract

The utility model discloses a radiator used for electronic products, which comprises a radiator component formed by buckling a plurality of single radiating fins. The radiating fins are provided by upper bending parts and lower bending parts in the same direction, and radiating fin bodies are arranged between the upper bending parts and the lower bending parts and are curved surfaces. Because the radiating fin bodies are the curved surfaces, the areas of the radiating fin bodies are enlarged, and the whole radiating surface is effectively enlarged after the radiating fin bodies are buckled; and moreover, a vent of the radiator, which is formed after the radiating fins are buckled, is enlarged correspondingly, thereby ensuring better radiating performance, and having beautiful appearance.

Description

Heat radiator for electronic product

Technical field

The utility model relates to a kind of radiator, especially a kind of heat radiator for electronic product.

Background technology

The radiating fin of ordinary electronic product radiator is to face type or plagiohedral directly mostly at present, and the ventilating opening that each radiating fin fastens the back formation is a parallelogram, and the ventilating opening area is limited like this, thereby heat dispersion is not good.

Summary of the invention

In order to overcome above-mentioned defective, the utility model provides a kind of heat radiator for electronic product, and this heat radiator for electronic product can effectively improve radiating effect.

The utility model for the technical scheme that solves its technical problem and adopt is:

A kind of heat radiator for electronic product, comprise that the radiating fin by most one chips fastens the radiating subassembly of forming mutually, described radiating fin have one in the same way last kink and following kink, be the radiating fin body between last kink and the following kink, described radiating fin body is a curved surface.

As further improvement of the utility model, the upper and lower kink shape of the radiating fin of described majority is all identical.

As further improvement of the utility model, the upper and lower kink and the radiating fin body of described radiating fin are rectangular.

As further improvement of the utility model, described radiating fin body is parallel to the cross section undulate of described upper and lower kink.

As further improvement of the utility model, described radiating fin body is perpendicular to the cross section undulate of described upper and lower kink.

As further improvement of the utility model, the waveform in the cross section of described radiating fin body is the sine wave of a wavelength.

As further improvement of the utility model, the waveform in the cross section of described radiating fin body is the cosine wave of a wavelength.

The structure that the radiating fin of most one chips described in the utility model interconnects fastening is consistent with the structure that present radiating fin interconnects fastening.

The beneficial effects of the utility model are: because the radiating fin body is a curved surface, thereby enlarged the area of radiating fin body, therefore effectively strengthened the integral heat sink area after radiating fin fastens, and several dissipation fins fastens also corresponding expansion of ventilating opening of the formed radiator in back, thereby guaranteed thermal diffusivity preferably, and good looking appearance.

Description of drawings

Fig. 1 is a monolithic heat radiation fin structure schematic diagram described in the utility model;

Fig. 2 is that most sheet radiating fin described in the utility model fastens the back structural representation;

Fig. 3 is that the A of Fig. 2 is to schematic diagram.

Embodiment

Embodiment: a kind of heat radiator for electronic product, comprise that the radiating fin 1 by most one chips fastens the radiating subassembly of forming 10 mutually, described radiating fin 1 has in the same way a last kink 2 and a following kink 3, between last kink 2 and the following kink 3 is radiating fin body 4, and described radiating fin body 4 is a curved surface.

As further improvement of the utility model, upper and

lower kink

2,3 shapes of the radiating fin 1 of described majority are all identical.

As further improvement of the utility model, the upper and

lower kink

2,3 and the radiating fin body 4 of described radiating fin 1 are rectangular.

As further improvement of the utility model, described radiating fin body 4 is parallel to the cross section undulate of described upper and

lower kink

2,3.

As further improvement of the utility model, described radiating fin body 4 is perpendicular to the cross section undulate of described upper and

lower kink

2,3.

As further improvement of the utility model, the waveform in the cross section of described radiating fin body 4 is the sine wave of a wavelength.

As further improvement of the utility model, the waveform in the cross section of described radiating fin body 4 is the cosine wave of a wavelength.

The curved surface of this routine radiating fin body 4 can be the continuous type curved surface, also can be the noncontinuity curved surface, is all this routine claimed scope as radiating fin body 4 for suppressing some grooves etc. in the plane.

The structure that the radiating fin 1 of the described most one chips of this example interconnects fastening is consistent with the structure that present radiating fin 1 interconnects fastening, as be located at T type on the upper and

lower kink

2,3, V-type connecting portion 5 and connecting hole 6 etc., or use straight rod serial connection etc. in the middle of the radiating fin 1 of most one chips, this example no longer describes in detail.

This example can be used for the heat radiation of electronic products such as notebook computer.

Claims

1. heat radiator for electronic product, comprise that the radiating fin (1) by most one chips fastens the radiating subassembly of forming (10) mutually, described radiating fin has in the same way a last kink (2) and a following kink (3), between last kink and the following kink is radiating fin body (4), it is characterized in that: described radiating fin body is a curved surface.

2. heat radiator for electronic product according to claim 1 is characterized in that: the upper and lower kink shape of the radiating fin of described majority is all identical.

3. heat radiator for electronic product according to claim 1 and 2 is characterized in that: the upper and lower kink and the radiating fin body of described radiating fin are rectangular.

4. heat radiator for electronic product according to claim 1 is characterized in that: described radiating fin body is parallel to the cross section undulate of described upper and lower kink.

5. heat radiator for electronic product according to claim 1 is characterized in that: described radiating fin body is perpendicular to the cross section undulate of described upper and lower kink.

6. according to claim 4 or 5 described heat radiator for electronic product, it is characterized in that: the waveform in the cross section of described radiating fin body is the sine wave of a wavelength.

7. according to claim 4 or 5 described heat radiator for electronic product, it is characterized in that: the waveform in the cross section of described radiating fin body is the cosine wave of a wavelength.