CN201449571U

CN201449571U - Back plate

Info

Publication number: CN201449571U
Application number: CN2009200535951U
Authority: CN
Inventors: 赵立刚
Original assignee: Individual
Current assignee: Individual
Priority date: 2009-03-30
Filing date: 2009-03-30
Publication date: 2010-05-05
Anticipated expiration: 2019-03-30

Abstract

The utility model discloses a back plate used by a computer mainboard and a CPU radiator, and aims to solve the problem of insufficient rigidity of the back plate caused by the complete openness of the middle hole of the back plate in the conventional back plate. For solving the problem, the utility model provides the back plate, and the middle hole is designed to be a pit lowering relative to a surface attached to the main board. The utility model is characterized in that more than two radiating through holes are distributed at the bottom of the pit, the side edge of the pit plays an importance role in resisting bending stress, a bottom plate and side edge are connected to form a whole for playing a key function of effectively preventing the planar tensile stress converted by bending stress, the space that the bottom part of the pit lowers in relative to the surface attached to the main board plays the key role in preventing assemble interference. By adopting the technical scheme, the back plate ensures that the pit has effective clearance for electrical components, such as resistors and pins, positioned at the bottom of the main board and matched with the CPU; and a plurality of radiating through holes distributed at the bottom of the pit can effectively perform thermal convection; at the same time, the pit forms a polygon with one side opened, thereby effectively resisting the concentrated force of the bending stress; and the problem that the rigidity of the back plate is not satisfactory due to the existence of the middle hole is solved.

Description

Backboard

Technical field:

The utility model relates to computer main board and the employed backboard of CPU (central processing unit) heating radiator.

Background technology:

Backboard is installed in the back side of mainboard, plays the effect that keeps mainboard that enough bending strength and rigidity are arranged, and is used for installing and fixing central processing unit, connector, heating radiator etc. simultaneously.Like this, just require backboard that enough rigidity and intensity will be arranged.At present, backboard mainly adopts two class materials to make, and a class is to adopt the plastic cement backboard of injection molding, and such backboard has the low advantage of cost, but has the birth defect that lacks enough rigidity and intensity; Another kind of is to adopt the stamping forming backboard of sheet metal, and such backboard has good relatively rigidity and intensity, but still not ideal enough.Research by analysis, find that backboard has one to be positioned at long and the wide interstitial hole that constitutes the plane geometry center, this hole is mainly played to prevent to assemble and is interfered and the effect of empty avoiding electronic component and stitch thereof, the effect of certain help heat radiation is arranged simultaneously, and the center line that bending stress is concentrated coincides with the center line of this interstitial hole of backboard just, as shown in Figure 1.The conclusion of research shows that causing the unfavorable root of backboard rigidity is the backboard interstitial hole, and what the backboard interstitial hole was that complete sky opens is exactly present problem.

The utility model content:

It is the problem that complete sky is opened that the utility model is intended to solve the existing backboard interstitial hole of existing backboard.

For addressing the above problem, the utility model provides backboard, and the backboard interstitial hole is designed to a pit that subsides with respect to the surface of applying mainboard, arranges the through hole that dispels the heat more than two in pit bottom.

Do like this, both can guarantee that pit effectively avoided CPU (central processing unit) and be positioned at electronic component that mainboard bottom matches such as resistance etc., again can be by effective heat loss through convection of several heat radiation through holes of pit bottom layout, the polyhedron of the recording quantity of pit formation is simultaneously effectively resisted bending stress and is concentrated effect, has solved the unfavorable problem of backboard rigidity.

Description of drawings

Fig. 1 is existing backboard synoptic diagram.

Fig. 2 is the cross-sectional schematic of Fig. 1.

Fig. 3 Fig. 5 Fig. 7 Fig. 9 Figure 11 is the utility model synoptic diagram.

Fig. 4 Fig. 6 Fig. 8 Figure 10 Figure 12 is respectively the cross-sectional schematic of Fig. 3 Fig. 5 Fig. 7 Fig. 9 Figure 11.

Embodiment:

As Fig. 3,4,5,6,7,8,9,10,11,12 backboard:

The backboard interstitial hole is designed to a pit that subsides with respect to the surface of applying mainboard, arrange heat radiation through hole 1 more than two in pit bottom, pit side 2 plays the vital role of resisting bending stress, base plate 3 and side fuse and constitute the key of effectively resisting the planar stretch stress that bending stress transforms, and pit bottom avoids producing the key that assembling is interfered with respect to the size N that the surface of applying mainboard subsides.

Do like this, both can guarantee that the effective empty avoiding CPU (central processing unit) of pit was positioned at electronic component such as resistance and stitch etc. that the mainboard bottom matches, again can be by effective heat loss through convection of several heat radiation through holes of pit bottom layout, simultaneously the pit polyhedron that forms recording quantity is effectively resisted the concentrated effect of bending stress, has solved backboard because interstitial hole and the unfavorable problem of rigidity.

Claims

1. backboard, interstitial hole is designed to a pit that subsides with respect to the surface of applying mainboard, it is characterized in that, is provided with heat radiation through hole (1) in pit bottom, and pit side (2) and base plate (3), and pit bottom is with respect to the applying mainboard surface size (N) that subsides.

2. backboard according to claim 1 is characterized in that, the quantity of heat radiation through hole (1) is no less than 2.

3. according to claim 1,2 described backboards, it is characterized in that the shape of heat radiation through hole (1) can be circle, quadrilateral, triangle, all kinds of plane geometric shapes of hexagon.

4. according to claim 1,2,3 described backboards, it is characterized in that pit bottom is not less than 1.8 millimeters with respect to the size (N) that applying mainboard surface subsides.

5. according to claim 1,2,3,4 described backboards, it is characterized in that when adopting Sheet Metal Forming Technology to make, used starting material are sheet metals.

6. according to claim 1,2,3,4 described backboards, it is characterized in that when adopting Shooting Technique to make, used starting material are plastic cement particle or the potpourri that adds the certain proportion glass.