CN201420107Y - Mobile guiding device for circuit board electroplating - Google Patents
Mobile guiding device for circuit board electroplating Download PDFInfo
- Publication number
- CN201420107Y CN201420107Y CN2009200532949U CN200920053294U CN201420107Y CN 201420107 Y CN201420107 Y CN 201420107Y CN 2009200532949 U CN2009200532949 U CN 2009200532949U CN 200920053294 U CN200920053294 U CN 200920053294U CN 201420107 Y CN201420107 Y CN 201420107Y
- Authority
- CN
- China
- Prior art keywords
- guide
- fixed
- circuit card
- circuit board
- guidepost
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model relates to electroplating equipment technical field, in particular to a mobile guiding device for a circuit board electroplating device, which comprises a guide column, a guide tube,a base plate, a fixed rod and two rows of guide plates; the two rows of guide plates are symmetrically arranged in an electroplating path, a gap for a circuit board to pass through is arranged between the two rows of guide plates, the other ends of the guide plates opposite to the gap are mounted and fixed on the guide tube, the guide tube is nested on the guide column, the bottom end of the guide column is fixed on the base plate and the top end of the guide column is fixed by the fixed rod; when the circuit board passes through the gap between the two rows of guide plates, as buoyancy fromthe electroplating liquid applies on the guide tube and the guide plates, the guide plates fixed on the guide tube can rotate in certain degree along the movement of the circuit board so that the board surface of the circuit board cannot be abraded easily and the electroplating quality of the circuit board is improved.
Description
Technical field:
The utility model relates to technical field of plating equipment, relates in particular to a kind of galvanized mobile guide device of circuit card that is used for.
Background technology:
In the plating production process of large-scale automatic electroplating device, circuit card is in plating tank when mobile, circuit card need vertically pass through from the mid-way of plating tank, otherwise can cause the thickness of coating on circuit card two sides unequal, influence the electroplating quality of circuit card, when for example circuit card produced, the thickness of coating on circuit card two sides can be seriously unequal, causes scrapping of circuit card.So people have designed and have been used for the galvanized mobile guide device of circuit card, it is that the roller that two rows are used to lead has been installed on the both sides in plating tank mid-way, makes circuit card guarantee that the thickness of coating on circuit card two sides equates from process between two row's rollers.But the roller of this mobile guide device is fixed in the plating tank, when circuit card moves, abrades the plate face of circuit card easily.
The utility model content:
The purpose of this utility model is intended to overcome the deficiencies in the prior art, and what a kind of difficult scratch plate face was provided is used for the galvanized mobile guide device of circuit card.
The purpose of this utility model mainly realizes by following technical solution:
A kind of galvanized mobile guide device of circuit card that is used for, it comprises guidepost, guide pipe, seat board, fixed link, two row guide plates, described two row guide plates place plating tank symmetrically, be provided with the space that is used for by circuit card between the two row guide plates, the other end that guide plate is relative with the space is fixed on the guide pipe, guide pipe is set on the guidepost, and the bottom of guidepost is fixed on the seat board, and the top of guidepost is fixed by fixed link.
Described guide plate is equidistant the arrangement in vertical direction.
The bottom of described guidepost is by being bolted on the seat board.
One end of described fixed link is fixedlyed connected with the top of guidepost, and the other end of fixed link is fixed on the trough rim of plating tank.
Described guide pipe has low-angle inclination to the direction of ejecting plate.
The utility model beneficial effect is:
Because guide pipe of the present utility model is to be set on the guidepost, be that guide pipe is rotating, when the space of circuit card between two row guide plates through out-of-date, because guide pipe and guide plate all are subjected to the buoyancy of electroplate liquid, so be fixed on the rotation that guide plate on the guide pipe can be made certain angle along with moving of circuit card, thereby make the plate face of circuit card be not easy to be directed to the blackboard eraser wound, improved the electroplating quality of circuit card.
Description of drawings:
Fig. 1 is a structural representation of the present utility model;
Fig. 2 is a side-view of the present utility model;
Fig. 3 is a vertical view of the present utility model;
Fig. 4 is the structural representation of guide pipe of the present utility model and guide plate;
Fig. 5 is user mode figure of the present utility model.
Reference numeral:
The 1-guidepost, 2-guide pipe, 3-seat board, 4-fixed link, 5-guide plate, 6-plating tank, 7-anchor clamps, 8-circuit card.
Embodiment:
Below in conjunction with accompanying drawing the technical solution of the utility model is described further:
Referring to Fig. 1~4, a kind of galvanized mobile guide device of circuit card that is used for, it comprises guidepost 1, guide pipe 2, seat board 3, fixed link 4, two row guide plates 5, described two row guide plates 5 with the mid-way of plating tank 6 be centrosymmetry place plating tank 6, be provided with the space that is used for by circuit card 8 between the two row guide plates 5, the other end that guide plate 5 is relative with the space is fixed on the guide pipe 2, guide pipe 2 is set on the guidepost 1, make guide pipe 2 can do the rotation of certain angle round guidepost 1, the guide plate 5 that promptly is fixed on the guide pipe 2 also is rotating, the bottom of guidepost 1 is fixed on the seat board 3, seat board 3 is fixed on plating tank 6 bottoms, the top of guidepost 1 is fixing by fixed link 4, make guidepost 1 can be fixed in the plating tank 6, in the present embodiment, described guidepost 1 is to be vertically fixed in the plating tank 6.
The guide plate 5 of present embodiment is equidistant the arrangement in vertical direction, more particularly, the guide pipe 2 that is used for fixing guide plate 5 is to be set in successively on the guidepost 1, when the space of circuit card 8 between two row guide plates 5 through out-of-date, because it is spacing to be subjected to guide plate 5, circuit card 8 can not cause because of inclination to be scrapped.
The bottom of present embodiment guidepost 1 is by being bolted on the seat board 3; One end of fixed link 4 is fixedlyed connected with the top of guidepost 1, and the other end of fixed link 4 is fixed on the trough rim of plating tank 6; Make guidepost 1 stably to be fixed in the plating tank 6.
Present embodiment guide pipe 2 is that the direction to ejecting plate has low-angle inclination, and promptly the direction that moves to circuit card 8 of guide pipe 2 is done low-angle inclination, makes the plate face of circuit card 8 be not easy to be directed to plate 5 scratches more.
Please refer to Fig. 5, when the Electroplating Production of circuit card 8, circuit card 8 is to be suspended on the anchor clamps 7 of plating tank 6 tops, and pass through the space between the utility model two row guide plates 5, because the space between the two row guide plates 5 is the mid-way of plating tank 6, so the utility model can guarantee the thickness of coating on circuit card 8 two sides and equate, simultaneously, because the utility model places the guide pipe 2 of plating tank 6 and the buoyancy that guide plate 5 all is subjected to electroplate liquid, so be fixed on the rotation that guide plate 5 on the guide pipe 2 can be made certain angle along with moving of circuit card 8, when moving and the frictional force of guide plate 5 to reduce circuit card 8, thereby make the plate face of circuit card 8 be not easy to be directed to plate 5 scratches, improve the electroplating quality of circuit card 8.
The above only is a better embodiment of the present utility model, so all equivalences of doing according to the described structure of the utility model patent claim, feature and principle change or modify, is included in the utility model patent claim.
Claims (5)
1, a kind of galvanized mobile guide device of circuit card that is used for, it is characterized in that: it comprises guidepost (1), guide pipe (2), seat board (3), fixed link (4), two row guide plates (5), described two row guide plates (5) place plating tank (6) symmetrically, be provided with the space that is used for by circuit card (8) between the two row guide plates (5), guide plate (5) the other end relative with the space is fixed on the guide pipe (2), guide pipe (2) is set on the guidepost (1), the bottom of guidepost (1) is fixed on the seat board (3), and the top of guidepost (1) is fixing by fixed link (4).
2, a kind of galvanized mobile guide device of circuit card that is used for according to claim 1 is characterized in that: described guide plate (5) is arranged for equidistant in vertical direction.
3, a kind of galvanized mobile guide device of circuit card that is used for according to claim 1, it is characterized in that: the bottom of described guidepost (1) is by being bolted on the seat board (3).
4, a kind of galvanized mobile guide device of circuit card that is used for according to claim 1, it is characterized in that: an end of described fixed link (4) is fixedlyed connected with the top of guidepost (1), and the other end of fixed link (4) is fixed on the trough rim of plating tank (6).
5, a kind of galvanized mobile guide device of circuit card that is used for according to claim 1, it is characterized in that: described guide pipe (2) has low-angle inclination to the direction of ejecting plate.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2009200532949U CN201420107Y (en) | 2009-03-24 | 2009-03-24 | Mobile guiding device for circuit board electroplating |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2009200532949U CN201420107Y (en) | 2009-03-24 | 2009-03-24 | Mobile guiding device for circuit board electroplating |
Publications (1)
Publication Number | Publication Date |
---|---|
CN201420107Y true CN201420107Y (en) | 2010-03-10 |
Family
ID=41806761
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2009200532949U Expired - Fee Related CN201420107Y (en) | 2009-03-24 | 2009-03-24 | Mobile guiding device for circuit board electroplating |
Country Status (1)
Country | Link |
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CN (1) | CN201420107Y (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103614748A (en) * | 2013-08-31 | 2014-03-05 | 盐城市电子设备厂有限公司 | Method for inserting manganese or zinc cathode plate into electrolyte tank, and positioning guiding apparatus thereof |
-
2009
- 2009-03-24 CN CN2009200532949U patent/CN201420107Y/en not_active Expired - Fee Related
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103614748A (en) * | 2013-08-31 | 2014-03-05 | 盐城市电子设备厂有限公司 | Method for inserting manganese or zinc cathode plate into electrolyte tank, and positioning guiding apparatus thereof |
CN103614748B (en) * | 2013-08-31 | 2016-06-29 | 盐城市电子设备厂有限公司 | Manganese or zinc minus plate enter method and the locating guide device thereof of groove |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C17 | Cessation of patent right | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20100310 Termination date: 20140324 |