CN201405454Y - Novel UV laser device for cutting large format Micro Phone chip - Google Patents
Novel UV laser device for cutting large format Micro Phone chip Download PDFInfo
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- CN201405454Y CN201405454Y CN 200920045236 CN200920045236U CN201405454Y CN 201405454 Y CN201405454 Y CN 201405454Y CN 200920045236 CN200920045236 CN 200920045236 CN 200920045236 U CN200920045236 U CN 200920045236U CN 201405454 Y CN201405454 Y CN 201405454Y
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- laser
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- micro phone
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Abstract
The utility model provides a novel UV laser device for cutting large format Micro Phone chip, which comprises a UV laser and a processing platform; the output end of the UV laser is provided with an optical shutter, the output end of the optical shutter is connected with a beam expander, the output of the beam expander is provided with a first reflector, the first reflector is connected with a second reflector, the second reflector is connected with a third reflector, the output end of the third reflector is connected with a focusing lens, the focusing lens just faces the processing platform;the laser light issued by the UV laser is incidented to the optical shutter, and the laser is vertically incidented to the beam expander after passing through the optical shutter, the laser after passing through the beam expander is incidented to the first reflector and the second reflector and the third reflector in turn, the reflected laser is vertically incidented to the focusing lens, and thelaser after penetrating the focusing lens is focused on the processing platform. The novel UV laser device for cutting large format Micro Phone chip realizes that the UV laser cuts the large format Micro Phone silicon chips; the largest cut format is up to 8 inches; the cutting speed is fast, the processing efficient is high, and the utility model is very practical.
Description
Technical field
The utility model relates to a kind of novel ultraviolet laser device that is used to cut large format Micro Phone chip, belongs to laser accurate processing and manufacturing technical field.
Background technology
Along with the popularization of global various countries green energy resource and the extra normal development of semiconductor industry in recent years, the supply and demand in silicon chip market degree to the utmost is uneven, the backwardness of cutting processing ability and the wretched insufficiency of production capacity have constituted the bottleneck of industrial chain, have seriously hindered the development of solar energy and semiconductor industry.The key technology of producing as silicon chip (wafer), the novel silicon chip cutting technique of Jue Qiing in recent years, but have cutting surface quality height, cutting efficiency height and cutting large size material, make things convenient for characteristics such as following process.The silicon chip cutting is the electronics industry main raw material(s)---the key technology that silicon chip (wafer) is produced, the quality of cutting and scale directly have influence on the subsequent production of whole industry chain.The great demand of silicon chip shows on the semiconductor industries such as integrated circuit.Silicon accounts for more than 95% of whole semi-conducting material, and monocrystalline silicon piece is the key base material that semiconductor devices is produced, and is the base support material of electronic industry.The technique for processing silicon chip flow process is generally passed through the stages such as crystal growth, cut-out, external diameter barreling, flat limit, section, chamfering, grinding, burn into polishing, cleaning, packing.Developing rapidly of semicon industry had higher requirement to the processing of silicon chip in recent years, on the one hand in order to reduce manufacturing cost, silicon chip trend ever-larger diameters, the machining major diameter is difficulty relatively, requires silicon chip that high flatness precision and minimum surface roughness are arranged on the other hand.All these require to have improved greatly the difficulty of processing of silicon chip, because silicon materials have characteristics such as crisp, hard, diameter increases the buckling deformation that causes in the processing, and machining accuracy is difficult for guaranteeing.Common machining mode process velocity is slow, and the finished product yield is low, the processing cost height.In machining, damage the vocal cords film in Micro Phone silicon chip front easily, and dust is many in the process of cutting, can cause the bad of Micro Phone silicon chip.
It is a kind of new technique for applying that the Ultra-Violet Laser cutting technique is applied to the semiconductor silicon wafer, and the Ultra-Violet Laser cutting technique adopts 355nm or other short wavelength's Ultra-Violet Laser non-contact laser cold working, has beam quality height (M
2＜1.2), ((＜20ns) characteristics almost can realize the cutting to all silicon materials to the pulse frequency height for 30kHz～120kHz), pulse width.In addition, the outstanding focusing power of Ultra-Violet Laser is easy to realize the cutting live width less than 20um, compare with the cutting live width more than the traditional machine cuts 50um, has remarkable advantages aspect the precision cutting, and work in-process has used special-purpose smelting tool, just with the frame of Micro Phone silicon chip on special-purpose smelting tool, produce and used vacuum suction to make its fixing cutting.
Summary of the invention
The purpose of this utility model is to overcome the deficiency that prior art exists, and a kind of novel ultraviolet laser device that is used to cut large format Micro Phone chip is provided, and is intended to cut down finished cost, and simplified processing process reduces difficulty of processing, improves the processing yield.
The purpose of this utility model is achieved through the following technical solutions:
A kind of novel ultraviolet laser device that is used to cut large format Micro Phone chip, comprise ultraviolet laser and processing platform, characteristics are: the output of described ultraviolet laser is provided with optical gate, the output of optical gate is connected with beam expanding lens, the output of beam expanding lens is furnished with first speculum, and first speculum is connected second speculum, and second speculum is connected the 3rd speculum, the output of the 3rd speculum is connected with focus lamp, and focus lamp is right against processing platform; The laser that ultraviolet laser sends incides optical gate, laser impinges perpendicularly on beam expanding lens through optical gate, incide first speculum, second speculum and the 3rd speculum successively through the laser behind the beam expanding lens, laser vertical after the reflection incides focus lamp, and the laser that sees through focus lamp focuses on the processing platform.
Further, the above-mentioned a kind of novel ultraviolet laser device that is used to cut large format Micro Phone chip, wherein, the output wavelength of described ultraviolet laser is 355nm.
Further, the above-mentioned a kind of novel ultraviolet laser device that is used to cut large format Micro Phone chip wherein, is provided with dust arrester in a side of processing platform.
The substantive distinguishing features of technical solutions of the utility model and progressive being mainly reflected in:
The utility model ultraviolet laser machining apparatus modern design, realized Ultra-Violet Laser cutting large format Micro Phone silicon chip, the maximum breadth of cutting can reach 8 inches, use the shortcoming that the Ultra-Violet Laser cutting has avoided machine cuts Micro Phone silicon chip to exist, adopt Ultra-Violet Laser cutting large format MicroPhone silicon chip more more convenient to operate than common machining mode, cutting speed is fast, outward appearance is very desirable, the working (machining) efficiency height, not only reduced cost of processing, also having significantly improved yield rate, is the new design of a practicality.
Description of drawings
Below in conjunction with accompanying drawing technical solutions of the utility model are described further:
Fig. 1: aufbauprinciple schematic diagram of the present utility model;
Fig. 2: the structural representation of smelting tool.
The implication of each Reference numeral sees the following form among the figure:
| Reference numeral | Implication | Reference numeral | Implication | | Implication | |
| 1 | |
2 | |
3 | |
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| 4 | |
5 | |
6 | The |
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| 7 | Focus lamp | 8 | |
9 | The smelting tool |
The specific embodiment
As shown in Figure 1, be used to cut the ultraviolet laser device of large format Micro Phone chip, comprise ultraviolet laser 1 and processing platform 8, the output wavelength of ultraviolet laser 1 is 355nm, the output of ultraviolet laser 1 is provided with optical gate 2, the output of optical gate 2 is connected with beam expanding lens 3, the output of beam expanding lens 3 is furnished with first speculum 4, first speculum 4 is connected second speculum 5, second speculum 5 is connected the 3rd speculum 6, the output of the 3rd speculum 6 is connected with focus lamp 7, and focus lamp 7 is right against processing platform 8.It is that 355nm (ultraviolet light) laser incides optical gate 2 that ultraviolet laser 1 sends wavelength, laser impinges perpendicularly on beam expanding lens 3 through optical gate 2, incide 45 degree first speculum 4, second speculum 5 and the 3rd speculums 6 successively through the laser behind the beam expanding lens 3, laser vertical behind the reflection corner incides focus lamp 7, and the laser that sees through focus lamp 7 focuses on the surface of processing platform 8.
Beam quality height, pulse frequency height, pulse width, focusing power are strong, and the shift motion of the X of processing platform 8, Y direction just can be processed large format Micro Phone silicon chip (8 inches) more than or equal to 200mm, and the thickness of Micro Phone silicon chip is 400um.Micro Phone silicon chip is adsorbed on the smelting tool of processing platform, the Ultra-Violet Laser that ultraviolet laser 1 sends impinges perpendicularly on the processing platform 8 after entering transmission laser system, by the optical imagery system Micro Phone silicon chip to be processed is positioned before the laser cutting and the planning of cutting track, during Laser Processing laser beam axis keep motionless and processing platform with respect to optical axis in two axial linear movement of X, Y.It is pointed out that when laser cutting Micro Phone silicon chip, each parameter when cutting Micro Phone silicon chip by the power, frequency and the change that change laser instrument, collocation is used, and to the cutting of the Micro Phone silicon chip back side once, improves working (machining) efficiency.
The special-purpose smelting tool 9 of a cutting large format Micro Phone silicon chip is installed on processing platform 8, smelting tool 9 as shown in Figure 2, smelting tool 9 has the vacuum suction function, use the wafer cutting software, each parameter such as the cutting speed of the frequency by changing laser instrument, energy, processing platform, focal length, processing number of times is controlled the depth of cut to large format Micro Phone silicon chip; For follow-up processing, depth of cut is greater than 2/3rds silicon wafer thickness, accurately locatees the position of cutting with CCD, makes the cutting accuracy height of Micro Phone silicon chip, the whole working (machining) efficiency that improves, cutting appearance looks elegant.
To reduce dust in the process in order making as far as possible, to improve yield, one dust arrester is installed, the dust that occurs in the processing is directly removed in a side of processing platform.
During concrete the application, the special-purpose smelting tool 9 of a cutting large format Micro Phone silicon chip is installed on processing platform 8, smelting tool 9 (8 inches) is as Fig. 2, has the vacuum suction function, elder generation's facing up with large format Micro Phone silicon chip, the back side is adsorbed on the smelting tool 9, open wafer cutting processing software, crystal grain with two one straight lines in silicon chip front transfers to level with large format Micro Phone silicon chip, the size of measuring crystal grain and drawing the road, get the left side of maximum gauge, right 2 points, draw the heartcut cross mark of width in the front of silicon chip, mark is drawn to the thickness that sees through silicon chip, and clearly mark is also arranged overleaf, this moment ultraviolet laser frequency 30KHZ, power 3W.If silicon chip back has been carried out a stroke road cut mark, this step can economize.Large format Micro Phone silicon chip is reversed, the back side upwards, there is the front of crystal grain to be adsorbed on the smelting tool, find ready-made two cross marks in the back side, with these two marks silicon chip is transferred to level, mark with one of them is made as the benchmark cutting again, in cutting process medium ultraviolet laser parameters is frequency 40KHZ, laser is about 2.5W to the platform energy, platform X and Y to cutting speed all be 10mm/sec, if the single crystal grain 1.5*1.5mm on the large format Micro Phone silicon chip, the cutting full wafer used time of wafer is about 30 minutes.The general thick silicon chip of 400um, the degree of depth of cutting will reach more than the 250um.If change the depth of cut of silicon chip, can change cutting speed, the processing number of times of frequency, power and the processing of laser instrument.In the process of processing, open the dust arrester of platform side, the dust powder during cutting is in time removed, and improves the cutting yield of silicon chip.
In sum, the utility model ultraviolet laser device, realized Ultra-Violet Laser cutting large format Micro Phone silicon chip, the maximum breadth of cutting can reach 8 inches, uses the shortcoming that the Ultra-Violet Laser cutting has avoided machine cuts Micro Phone silicon chip to exist, adopt Ultra-Violet Laser cutting large format MicroPhone silicon chip more more convenient to operate than common machining mode, cutting speed is fast, and outward appearance is very good, the working (machining) efficiency height, not only reduce cost of processing, also significantly improved yield rate.
What need understand is: above-mentioned explanation is not to be to restriction of the present utility model, and in the utility model design scope, the interpolation of being carried out, conversion, replacement etc. also should belong to protection domain of the present utility model.
Claims (3)
1. novel ultraviolet laser device that is used to cut large format Micro Phone chip, comprise ultraviolet laser (1) and processing platform (8), it is characterized in that: the output of described ultraviolet laser (1) is provided with optical gate (2), the output of optical gate (2) is connected with beam expanding lens (3), the output of beam expanding lens (3) is furnished with first speculum (4), first speculum (4) is connected second speculum (5), second speculum (5) is connected the 3rd speculum (6), the output of the 3rd speculum (6) is connected with focus lamp (7), and focus lamp (7) is right against processing platform (8).
2. a kind of novel ultraviolet laser device that is used to cut large format Micro Phone chip according to claim 1, it is characterized in that: the output wavelength of described ultraviolet laser (1) is 355nm.
3. a kind of novel ultraviolet laser device that is used to cut large format Micro Phone chip according to claim 1, it is characterized in that: the side at processing platform (8) is provided with dust arrester.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200920045236 CN201405454Y (en) | 2009-05-12 | 2009-05-12 | Novel UV laser device for cutting large format Micro Phone chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200920045236 CN201405454Y (en) | 2009-05-12 | 2009-05-12 | Novel UV laser device for cutting large format Micro Phone chip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201405454Y true CN201405454Y (en) | 2010-02-17 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN 200920045236 Expired - Lifetime CN201405454Y (en) | 2009-05-12 | 2009-05-12 | Novel UV laser device for cutting large format Micro Phone chip |
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| CN (1) | CN201405454Y (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102172798A (en) * | 2011-02-17 | 2011-09-07 | 徐州永佳液压设备有限公司 | Method for processing antiwear texture of polyoxymethylene support ring |
| CN104526892A (en) * | 2014-12-23 | 2015-04-22 | 苏州凯锝微电子有限公司 | Wafer cutting device |
| CN106563881A (en) * | 2016-08-29 | 2017-04-19 | 武汉凌云光电科技有限责任公司 | Device and method for cutting optical fiber through laser |
-
2009
- 2009-05-12 CN CN 200920045236 patent/CN201405454Y/en not_active Expired - Lifetime
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102172798A (en) * | 2011-02-17 | 2011-09-07 | 徐州永佳液压设备有限公司 | Method for processing antiwear texture of polyoxymethylene support ring |
| CN104526892A (en) * | 2014-12-23 | 2015-04-22 | 苏州凯锝微电子有限公司 | Wafer cutting device |
| CN106563881A (en) * | 2016-08-29 | 2017-04-19 | 武汉凌云光电科技有限责任公司 | Device and method for cutting optical fiber through laser |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: JIANGYIN DELI LASER INSTRUMENT CO., LTD. Free format text: FORMER OWNER: JIANGYIN DEFEI LASER INSTRUMENT CO., LTD. |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20110706 Address after: 215021 Suzhou Industrial Park, Jiangsu, Hong Zhong Road, No. 77 Co-patentee after: Jiangyin Deli Laser Equipment Co., Ltd. Patentee after: Suzhou Delphi Laser Co., Ltd. Address before: 215021 Suzhou Industrial Park, Jiangsu, Hong Zhong Road, No. 77 Co-patentee before: Jiangyin Defei Laser Equipment Co., Ltd. Patentee before: Suzhou Delphi Laser Co., Ltd. |
|
| C56 | Change in the name or address of the patentee | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 215021 Suzhou Industrial Park, Jiangsu, Hong Zhong Road, No. 77 Patentee after: Suzhou Delphi Laser Co., Ltd. Patentee after: Jiangyin Deli Laser Equipment Co., Ltd. Address before: 215021 Suzhou Industrial Park, Jiangsu, Hong Zhong Road, No. 77 Patentee before: Suzhou Delphi Laser Co., Ltd. Patentee before: Jiangyin Deli Laser Equipment Co., Ltd. |
|
| CX01 | Expiry of patent term |
Granted publication date: 20100217 |
|
| CX01 | Expiry of patent term |