CN201397205Y - Novel electronic heat distributor - Google Patents

Abstract

The utility model aims at providing a novel electronic heat distributor with the characteristics of exact measuring and convenient assembling, which comprises a temperature sensing head and a thermistor. The novel electronic heat distributor is characterized in that a heat conduction silica gel which is connected with the thermistor on a PCB by a temperature sensing head bracket is arranged at thebottom end of the temperature sensing head, and a heat conduction silica gel which is connected with an aluminum plate is arranged at the top end of the temperature sensing head. The temperature sensing head and the bracket connect the aluminum plate with the PCB like a bridge; by adopting the bridge connecting structure, the novel electronic heat distributor can quickly, stably and exactly reflect the temperature of a radiating fin to the thermistor, so as to cause the value changing of the thermistor and obtain the surface temperature of a radiator at that time, thereby providing necessarybasis for calculating temperature difference. The novel electronic heat distributor exactly obtains the temperature of the radiator and the difference of the indoor temperature with less measuring errors; by adopting the silica gels, the installation within wide range of height difference is convenient, the cushioning function can be exerted, and the temperature sensing head cannot be damaged.

Description

A kind of novel electron heat distribution device

Technical field

The utility model relates to a kind of measuring instrument, especially a kind of novel electron heat distribution device.

Background technology

Electronic type heat distribution device is to be used to measure and to show that the heating radiator of flowing through discharges or absorb the instrument of heat, is installed on the heat radiator, in order to control that the hear rate in the heating facility is accurately measured and charged.Its principle of work is that dual sensor is measured, electronic type heat distribution device is installed in heat-exchange system, when the heat radiator distribute heat, measure current spreader surface temperature by temperature-sensitive head, measure current indoor temperature with the another one thermistor again, two groups of data are brought in constant renewal in, and accumulative total numerical value regularly stores, and obtains the difference of radiator temperature and indoor temperature; Thereby calculate the integration of it and time, obtain each household with heat portion in the total heat expense of entire building space, the hot expense of calculating and sharing each household according to this numerical value at last.

Heat distribution device in the past adopts the aluminum temperature-sensitive head directly to be pressed in method on the heat radiator mostly, fits and conducts heat, and maximum shortcoming is: thermal loss is bigger, causes measuring error; No padded coaming, fragile base table and temp probe when causing assembling.

Summary of the invention

The purpose of this utility model is to provide a kind of measurement accurate, novel electron heat distribution device easy to assembly.

The utility model is achieved in that a kind of novel electron heat distribution device, comprise temperature-sensitive head and thermistor, it is characterized in that: described temperature-sensitive head bottom is provided with heat conductive silica gel and joins by the thermistor on temperature-sensitive head support and the pcb board (being wiring board), and the top is provided with heat conductive silica gel and aluminium sheet joins.

The thermometric structure comprises aluminium sheet, heat conductive silica gel, aluminum temperature-sensitive head, thermistor, temperature-sensitive head support.Temperature-sensitive head couples together aluminium sheet and pcb board as a bridge with support, this structure is " bridging " structure, can be fast, stable, the temperature with heat radiator informs thermistor more accurately, thereby cause the variation of thermistor resistance, obtain the surface temperature of heating radiator at that time, thereby the foundation of necessity is provided for the accounting temperature difference.

Aluminum temperature-sensitive head top is stained with a fritter heat conductive silica gel, in the bottom of temperature-sensitive head one fritter heat conductive silica gel is arranged also, temperature-sensitive head is put into the temperature-sensitive head support, again support is pushed groove on the pcb board, tiltedly colluding on the support blocked the location in groove, promptly whole assembly is installed on the pcb board by the structure of tiltedly colluding, at this moment, the heat conductive silica gel of temperature-sensitive head bottom covers on the thermistor.When divider being installed on the aluminium sheet that installs in advance on heat radiator, the temperature-sensitive head top can tightly be attached in the aluminum plate groove.When heating gas, the temperature of heat radiator slowly raises, and passes to aluminium sheet, passes to the heat conductive silica gel on temperature-sensitive head top again, passes to the aluminum temperature-sensitive head then, is delivered to the heat conductive silica gel of temperature-sensitive head bottom again, passes to the thermistor on the pcb board at last.

Thermistor be exploitation early, many, the development of the kind sensitive components of maturation. thermistor is made up of semiconductor ceramic material, the principle of utilizing is that temperature causes resistance variations. if the concentration in electronics and hole is respectively n, p, mobility is respectively μ n, μ p, then semi-conductive electricity lead into:

σ＝q(nμn+pμp)

Because n, p, μ n, μ p are the functions of temperature dependent T, so it is the function of temperature that electricity is led, therefore can extrapolate the height of temperature by measuring electric leading, and can make the resistance-temperature characteristics curve, because temperature-sensitive head is to be made good heat conductivity by fine aluminium (6063), coefficient of heat conductivity is probably at 237W/ (m.k), than higher, and its density is light in metal---2.7g/cm3, and specious.The post-processed that we do has: anodic oxidation, to deoil, and passivation in chromate prevents aluminium oxidation blackening in air, prolongs nondiscolouring, thus it is stable good to guarantee that temperature-sensitive head conducts heat, and color and luster is even.

And the heat conductive silica gel that adopts is to add conductive filler in silica gel, and as ceramic powders etc., coefficient of heat conductivity probably is 1.5W/ (m.k).This silica gel Shore hardness is 40, and is very soft, and self toughness can be bonded on the temperature-sensitive head.When being assemblied in temperature-sensitive head on the aluminium sheet, because aluminium sheet has mismachining tolerance, and heat sink has the branch of height, and employing silica gel can be easy for installation in bigger difference in height scope, and play buffer action, do not damage temperature-sensitive head.And organosilicon itself is the very strong material of a kind of stability, and serviceability temperature is at-60 to 200 ℃, transmission heat that can be more stable.

The advantage of " bridging " structure aspect heat transfer of Zu Chenging is just apparent thus: quick, stable, accurate.Certainly we consider that such structure still has a spot of thermal loss, cause actual temperature and measure temperature that deviation is arranged, the a large amount of experiment of process in the laboratory, the data that analysis obtains, thereby the temperature difference that this structure is caused tests out, then by the program compensation, to guarantee the consistance of actual temperature and measurement temperature.

In sum,, can stablize, transmit heat in time, accurately when these two kinds of structures are connected together by support, the temperature of reaction parameter, thus guarantee stable, the metering accurately of heat distribution device.The utility model has realized obtaining the difference of radiator temperature and indoor temperature more accurately, and measuring error is little, and employing silica gel can be easy for installation in bigger difference in height scope, and plays buffer action, does not damage temperature-sensitive head.

Description of drawings

Fig. 1 is the general structure synoptic diagram of the utility model embodiment;

Among the figure:

1. temperature-sensitive head 2. temperature-sensitive head supports 3. heat conductive silica gel A 4. heat conductive silica gel B 5. thermistor 6.PCB plates 7. aluminium sheets

Embodiment

The utility model is described in further detail below in conjunction with accompanying drawing and exemplary embodiments.

In Fig. 1, temperature-sensitive head (1) top is stained with a fritter heat conductive silica gel A (3), one fritter heat conductive silica gel B (3) is also arranged in the bottom of temperature-sensitive head (1), temperature-sensitive head (1) is put into temperature-sensitive head support (2), then this assembly is installed on the pcb board (5), at this moment, the heat conductive silica gel B (3) of temperature-sensitive head (1) bottom covers on the thermistor (4).In the time of on divider being installed in the aluminium sheet (6) that installs in advance on heat radiator, aluminium sheet (6) can be close in temperature-sensitive head (1) top.When heating gas, the temperature of heat radiator slowly raises, and heat is passed to aluminium sheet (6), pass to the heat conductive silica gel A (3) on temperature-sensitive head (1) top again, pass to temperature-sensitive head (1) then, be delivered to the heat conductive silica gel B (3) of temperature-sensitive head bottom again, pass to the thermistor (4) on the pcb board (5) at last.

Claims (1)

1. novel electron heat distribution device, comprise temperature-sensitive head and thermistor, it is characterized in that: described temperature-sensitive head bottom is provided with heat conductive silica gel and joins by the thermistor on temperature-sensitive head support and the pcb board, and the temperature-sensitive head top is provided with heat conductive silica gel and aluminium sheet joins.

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