CN201392705Y - Conducting plate series connection and positioning structure for plane-type electromagnetic induction element - Google Patents
Conducting plate series connection and positioning structure for plane-type electromagnetic induction element Download PDFInfo
- Publication number
- CN201392705Y CN201392705Y CN200920147551U CN200920147551U CN201392705Y CN 201392705 Y CN201392705 Y CN 201392705Y CN 200920147551 U CN200920147551 U CN 200920147551U CN 200920147551 U CN200920147551 U CN 200920147551U CN 201392705 Y CN201392705 Y CN 201392705Y
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- circuit board
- conducting strip
- multilayer circuit
- ring part
- conductive layer
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Abstract
A conducting plate series connection and positioning structure for a plane-type electromagnetic induction element adopts the structure that at least one auxiliary welding pad is arranged on at least one side surface of a multilayer circuit board, and then at least one positioning convex part extends and is formed on the conducting plate; and the positioning convex part is correspondingly connected with the auxiliary welding pad on the multilayer circuit board. Due to the design, various parts of the conducting plate can be weighted in average and further can be stably arranged on the multilayer circuit board, thereby effectively achieving the purposes of preventing the conducting plate from bending and upwarping, and preventing the conducting plate from being deformed and damaged.
Description
[technical field]
The utility model is the conducting strip located in series structure that prevents the plane type electromagnetic induction element of the crooked perk of conducting strip about a kind of.
[background technology]
Electromagnetic induction element, for example inductor or transformer etc., its way traditionally is winding first siding ring and a second siding ring on a magnetic core, utilize the variation of electric current and voltage in the first siding ring, the magnetic field that on magnetic core, changes, and then the electric current and the voltage that excite second siding ring to change; Yet, the volume of the electromagnetic induction element of above-mentioned prior art is big and be difficult to further dwindle, be that various now electronic installation is made every effort to gently, the obstruction under thin, short, little, in addition, the step of coil winding is difficult to utilize the machine automation to be carried out, and more causes the high of its inconvenience made and cost.
Be with, someone designs a kind of plane type electromagnetic induction element, it is to utilize between the arc-shaped conductive film of a plurality of stacked settings to join with parallel connection or series system, between each conducting strip, axially wear a magnetic core again, form the effect of coil winding whereby, with the purpose that reaches the volume that dwindles this electromagnetic induction element and simplify the production method of this electronic induction element.
Referring to shown in Figure 3, be the plane type electromagnetic induction element (is example with the transformer) of a prior art, it includes a multilayer circuit board 50, two conducting strips 60 and two magnetic cores 80;
Further referring to shown in Figure 4, run through on this multilayer circuit board 50 and be formed with a perforation 51, and include several layers of insulating barrier that is crisscross arranged 52 and conductive layer 53, each conductive layer 53 is one and has one first end 531 and one second end 532 around the arc lamellar body of this perforation 51, wherein, when first end, 531 correspondences of two adjacent conductive layers 53 are joined and second end, 532 correspondences when joining, be to link to each other between this two conductive layer 53 with parallel way, and when second end of first end 531 of a conductive layer 53 and another conductive layer 53 during 532 corresponding joining, then be to link to each other with series system between this two conductive layer 53;
Conducting strip 60 also is an arc lamellar body and has one first end 61 and one second end 62, it is to be located at respectively on the conductive layer 53 of these multilayer circuit board 50 two opposite sides, wherein, when the conductive layer 53 of this conducting strip 60 and this multilayer circuit board 50 joins with parallel way, be to make this two attaches mutually with welding manner, and when the conductive layer 53 of this conducting strip 60 and this multilayer circuit board 50 joins with series system (as shown in Figure 4), then the two adds a dielectric film 70 in this, and first end 531 of second end 62 that makes this conducting strip 60 and this conductive layer 53 joins with welding manner, a set weld pad 54 joins with welding manner on 61 at first end of conducting strip 60 and this multilayer circuit board 50, and sees through this weld pad 54 and be electrically connected with circuit in this multilayer circuit board 50;
Yet, when aforementioned conducting strip 60 is located on this multilayer circuit board 50 with series system, only weld in its two end 61,62, and the stress that conducting strip 60 is born concentrates on the result of this two end 61,62 and will cause the crooked perks in other positions of conducting strip 60, thereby because of distortion damages, so there is it to treat further improvements during the locate mode of conducting strip in the tandem plane electromagnetic induction element of prior art.
[utility model content]
Because aforementioned the deficiencies in the prior art, the utility model provides a kind of conducting strip located in series structure of plane type electromagnetic induction element, design solves in the plane type electromagnetic induction element of present prior art whereby, when one conducting strip is located on the multilayer circuit board with series system, can stress concentrates on its end and cause the shortcoming of the crooked perks in other positions of this conducting strip.
In order to reach above-mentioned utility model purpose, the technological means that the utility model utilized is to add a location mechanism on a plane type electromagnetic induction element, it is to be arranged between the ring-like portion of a multilayer circuit board and a conducting strip, ring part and multilayer circuit board with conducting strip mutually combines fixing whereby, the concrete structure of this detent mechanism is to include at least one supplemental pad that is arranged on the multilayer circuit board, and projection takes shape at least one positioning convex portion on this conducting strip, and this two be that correspondence is joined.
The conducting strip located in series structure of a kind of plane type electromagnetic induction element that the utility model provides, it includes a multilayer circuit board, at least one dielectric film and at least one conducting strip, wherein, run through on the multilayer circuit board and form a perforation, and include several layers of insulating barrier that is crisscross arranged and conductive layer, and be provided with a weld pad at least one side, this conductive layer is an arc lamellar body and has a ring part, one first end and one second end, join with this first end and the second end correspondence respectively between each conductive layer, this ring part is around the perforation setting of multilayer circuit board, this weld pad correspondence takes shape in the side of first end of this conductive layer, and be electrically connected with the circuit in this multilayer circuit board, dielectric film is arranged on the ring part of conductive layer of this multilayer circuit board, conducting strip is located on this dielectric film, it is to be an arc lamellar body and to have a ring part, one first end and one second end, this ring part correspondence is arranged on this dielectric film, corresponding the joining of weld pad of first end of conducting strip and this multilayer circuit board, corresponding the joining of first end of second end of conducting strip and the conductive layer of this multilayer circuit board, one location mechanism, it is arranged between the ring part of multilayer circuit board and conducting strip, and detent mechanism mutually combines the ring part and the multilayer circuit board of conducting strip fixing whereby.
The design of joining by the positioning convex portion and the supplemental pad on the circuit board of above-mentioned conducting strip, can make each position average force of this conducting strip, and then stably be arranged on this multilayer circuit board, effectively reach and avoid the crooked perk of conducting strip, prevent the purpose of this conducting strip deformed damaged.
[description of drawings]
Fig. 1 is a three-dimensional exploded view of the present utility model.
Fig. 2 is a stereo appearance figure of the present utility model.
Fig. 3 is the three-dimensional exploded view of prior art.
Fig. 4 is another three-dimensional exploded view of prior art.
(10) multilayer circuit board (11) perforation
(12) insulating barrier (13) conductive layer
(131) first ends (132) second ends
(133) ring part (14) weld pad
(20) dielectric film (30) conducting strip
(31) first ends (32) second ends
(33) ring part (40) detent mechanism
(41) supplemental pad (42) positioning convex portion
(50) multilayer circuit board (51) perforation
(52) insulating barrier (53) conductive layer
(531) first ends (532) second ends
(54) weld pad (60) conducting strip
(61) first ends (62) second ends
(70) dielectric film (80) magnetic core
(81) base plate (82) magnetic post
[embodiment]
Referring to the conducting strip located in series structure of the plane type electromagnetic induction element shown in Fig. 1,2 (is example with the transformer), it includes a multilayer circuit board 10, at least one dielectric film 20, at least one conducting strip 30 and a location mechanism 40, wherein:
Run through on the multilayer circuit board 10 and form a perforation 11, and include several layers of insulating barrier that is crisscross arranged 12 and conductive layer 13, and be provided with a weld pad 14 at least one side, this conductive layer 13 is an arc lamellar body and has a ring part 133, one first end 131 and one second end 132, join with this first end 131 and second end, 132 correspondences respectively between each conductive layer 13, the perforation 11 that this ring part 133 is surrounded on multilayer circuit board 10 is provided with, these weld pad 14 correspondences take shape in the side of first end 131 of this conductive layer 13, and are electrically connected with circuit in this multilayer circuit board 10;
Conducting strip 30 is located on this dielectric film 20, it is to be an arc lamellar body and to have a ring part 33, one first end 31 and one second end 32, these ring part 33 correspondences are arranged on this dielectric film 20, make between the ring part 133 of conductive layer 13 of the ring part 33 of conducting strip 30 and multilayer circuit board 10 and form insulation, 14 corresponding the joining of weld pad of first end 31 of conducting strip 30 and this multilayer circuit board 10,131 corresponding the joining of first end of second end 32 of conducting strip 30 and the conductive layer 13 of this multilayer circuit board 10;
Aforementioned again positioning convex portion 42 and supplemental pad 41 place that mutually combines, its preferable placement are the central position at the ring part 33 of this conducting strip 30, this middle position respectively with the distance of first end 31 of conducting strip 30 and second end 32 for equating.
Aforesaid design, this conducting strip 30 is except joining with the weld pad 14 of first end 31 with this multilayer circuit board 10, and join with first end 131 of the conductive layer 13 of multilayer circuit board 10 and reach outside the effect of connecting with second end 32, further join with this positioning convex portion 42 and the supplemental pad 41 on the multilayer circuit board 10, make each position mean forced of conducting strip 30 whereby, stably to be arranged on this multilayer circuit board 10, effectively reach and avoid conducting strip 30, and then prevent the effect that this conducting strip 30 damages because of distortion because of the crooked perk of unbalance stress.
The above only is a better embodiment of the present utility model, be not that the utility model is done any pro forma restriction, though the utility model discloses as above with better embodiment, yet be not in order to limit the utility model, any those skilled in the art, in the scope that does not break away from technical solutions of the utility model, when the technology contents that can utilize above-mentioned announcement is made a little change or is modified to the equivalent execution mode of equivalent variations, in every case be the content that does not break away from technical solutions of the utility model, any simple modification that foundation technical spirit of the present utility model is done above execution mode, equivalent variations and modification all still belong in the scope of technical solutions of the utility model.
Claims (5)
1. the conducting strip located in series structure of a plane type electromagnetic induction element, it includes a multilayer circuit board, at least one dielectric film and at least one conducting strip, wherein, run through on the multilayer circuit board and form a perforation, and include several layers of insulating barrier that is crisscross arranged and conductive layer, and be provided with a weld pad at least one side, this conductive layer is an arc lamellar body and has a ring part, one first end and one second end, join with this first end and the second end correspondence respectively between each conductive layer, this ring part is around the perforation setting of multilayer circuit board, this weld pad correspondence takes shape in the side of first end of this conductive layer, and be electrically connected with the circuit in this multilayer circuit board, dielectric film is arranged on the ring part of conductive layer of this multilayer circuit board, conducting strip is located on this dielectric film, it is to be an arc lamellar body and to have a ring part, one first end and one second end, this ring part correspondence is arranged on this dielectric film, corresponding the joining of weld pad of first end of conducting strip and this multilayer circuit board, corresponding the joining of first end of second end of conducting strip and the conductive layer of this multilayer circuit board, it is characterized in that:
One location mechanism, it is arranged between the ring part of multilayer circuit board and conducting strip, and detent mechanism mutually combines the ring part and the multilayer circuit board of conducting strip fixing whereby.
2. the conducting strip located in series structure of plane type electromagnetic induction element as claimed in claim 1 is characterized in that: the supplemental pad that detent mechanism has at least one positioning convex portion and is provided with respect to positioning convex portion, and it is specifically constructed:
This supplemental pad is arranged at least one side of multilayer circuit board, and this supplemental pad takes shape in the side of the ring part of this conductive layer;
This positioning convex portion projection is molded on the ring part of conducting strip, and with this multilayer circuit board on corresponding joining of supplemental pad.
3. the conducting strip located in series structure of plane type electromagnetic induction element as claimed in claim 2, it is characterized in that: this positioning convex portion is arranged on the central position of the ring part of conducting strip, and this middle position equates with the distance of first end and second end respectively.
4. as the conducting strip located in series structure of claim 2 or 3 described plane type electromagnetic induction elements, it is characterized in that: this supplemental pad not with this multilayer circuit board in circuit be electrically connected.
5. as the conducting strip located in series structure of claim 2 or 3 described plane type electromagnetic induction elements, it is characterized in that: the circuit in this supplemental pad and this multilayer circuit board is electrically connected.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN200920147551U CN201392705Y (en) | 2009-04-08 | 2009-04-08 | Conducting plate series connection and positioning structure for plane-type electromagnetic induction element |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CN200920147551U CN201392705Y (en) | 2009-04-08 | 2009-04-08 | Conducting plate series connection and positioning structure for plane-type electromagnetic induction element |
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CN201392705Y true CN201392705Y (en) | 2010-01-27 |
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CN200920147551U Expired - Fee Related CN201392705Y (en) | 2009-04-08 | 2009-04-08 | Conducting plate series connection and positioning structure for plane-type electromagnetic induction element |
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Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104681250A (en) * | 2015-02-13 | 2015-06-03 | 张家港市华洋电子有限公司 | High-frequency and high-power inductor for large-scale adjustable power supply |
CN105826056A (en) * | 2015-01-22 | 2016-08-03 | 全汉企业股份有限公司 | Transformer |
CN106376173A (en) * | 2015-07-22 | 2017-02-01 | 乾坤科技股份有限公司 | Multilayer lead structure of printed circuit board, magnetic element, and manufacturing method of the multilayer lead structure |
US10068693B2 (en) | 2015-07-22 | 2018-09-04 | Cyntec Co., Ltd. | Multi-layer wiring structure, magnetic element and manufacturing method thereof |
CN110444373A (en) * | 2018-05-02 | 2019-11-12 | 联宝电子股份有限公司 | Magnetic induction component and its manufacturing method |
-
2009
- 2009-04-08 CN CN200920147551U patent/CN201392705Y/en not_active Expired - Fee Related
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105826056A (en) * | 2015-01-22 | 2016-08-03 | 全汉企业股份有限公司 | Transformer |
CN104681250A (en) * | 2015-02-13 | 2015-06-03 | 张家港市华洋电子有限公司 | High-frequency and high-power inductor for large-scale adjustable power supply |
CN106376173A (en) * | 2015-07-22 | 2017-02-01 | 乾坤科技股份有限公司 | Multilayer lead structure of printed circuit board, magnetic element, and manufacturing method of the multilayer lead structure |
US10068693B2 (en) | 2015-07-22 | 2018-09-04 | Cyntec Co., Ltd. | Multi-layer wiring structure, magnetic element and manufacturing method thereof |
CN106376173B (en) * | 2015-07-22 | 2020-07-28 | 乾坤科技股份有限公司 | Multilayer lead structure of printed circuit board, magnetic element and manufacturing method thereof |
CN110444373A (en) * | 2018-05-02 | 2019-11-12 | 联宝电子股份有限公司 | Magnetic induction component and its manufacturing method |
CN110444373B (en) * | 2018-05-02 | 2021-12-17 | 联宝电子股份有限公司 | Magnetic induction component and manufacturing method thereof |
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Legal Events
Date | Code | Title | Description |
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C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20100127 Termination date: 20160408 |