CN201392357Y - Electronic element package structure of electric current sensor - Google Patents
Electronic element package structure of electric current sensor Download PDFInfo
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- CN201392357Y CN201392357Y CN200920300889U CN200920300889U CN201392357Y CN 201392357 Y CN201392357 Y CN 201392357Y CN 200920300889 U CN200920300889 U CN 200920300889U CN 200920300889 U CN200920300889 U CN 200920300889U CN 201392357 Y CN201392357 Y CN 201392357Y
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Abstract
The utility model relates to parts and components of an electric current sensor, in particular to an electronic element package structure of an electric current sensor. The electronic element package structure mainly solves the technical problems that in the prior art, the thickness of the package body of a Hall element is large and the thickness of the air gap of the matched magnetic core ring is consequently large, so that the magnetic leakage is much, the magnetic induction intensity inside the magnetic core ring is small, and the Hall output voltage, i.e. sensitivity, of the Hall element arranged inside the air gap of the magnetic core ring is small. The electronic element package structure comprises a package part upper part (1) and a package body lower part (2) which are connected together. The electronic element package structure is characterized in that a chip is arranged inside both the package part upper part and the package body lower part and is connected with a plurality of pins (3), the end parts of the pins (3) are protruded out of the package body upper part or the package body lower part; and thickness of the package of the package part upper part (1) and the package body lower part (2) ranges from 0.85 mm to 1.05 mm.
Description
Technical field
The utility model relates to a kind of parts of current sensor, especially relates to a kind of electronic element packaging structure of current sensor.
Background technology
The principle of work of current sensor is when having electric current to pass through on the detected lead, around lead, will produce magnetic field, assemble magnetic field by the magnetic core ring, be built in Hall element in the magnetic core ring air gap and can detect the size in magnetic field, and export corresponding Hall voltage, subsequent conditioning circuit is calculated size of current in the lead with this Hall voltage pro rata.The air gap of magnetic core ring is more little, and leakage magnetic field is few more, and the magnetic induction density of magnetic core ring inside is big more, and it is even more that the magnetic line of force distributes, and promptly the zone that is evenly distributed of the magnetic line of force is big more.Chinese patent discloses a kind of Hall current sensor, and (Granted publication number: CN 201145706Y), it comprises the insulation shell of ring-type, and the space wears for tested lead in the ring of this insulation shell; The ring-shaped core that on ring, has radial gap, the ring madial wall that is encapsulated in this insulation shell inside and this ring-shaped core surrounds the ring madial wall of this insulation shell; Hall device, the gap that it is positioned at this insulation shell inside and is arranged at this ring-shaped core; And the circuit board that is loaded with testing circuit, it is electrically connected with this hall device; This Hall current sensor also comprises the shading ring that is encapsulated in this insulation shell, and this shading ring is positioned at the ring madial wall inboard of this ring-shaped core and surrounds the ring madial wall of this insulation shell; This shading ring is non magnetic conductive material, is wrapped on the ring madial wall of the ring madial wall of this insulation shell or this ring-shaped core, perhaps is plated on the ring madial wall of the ring madial wall of this insulation shell or this ring-shaped core; Also be packaged with compensating coil in this insulation shell, it is sheathed on this iron core and with this circuit board and is electrically connected; Also comprise the cable that stretches out in this insulation shell, an end of this cable is electrically connected with this circuit board, and the other end is in order to connect external circuit.But this sensor is the same with general commercially available sensor, the plastic-sealed body of the Hall element that adopts as shown in Figure 1, thickness is 1.2mm, the magnetic core ring air gap that is complementary is bigger, must be greater than 1.3mm, therefore magnetic dispersion is more, and the magnetic induction density of magnetic core ring inside is less, is that sensitivity is also less thereby make the hall output voltage that is built in the Hall element in the magnetic core ring air gap.
The utility model content
The utility model technical issues that need to address provide a kind of electronic element packaging structure of current sensor, it mainly is that to solve the plastic-sealed body thickness of existing in prior technology Hall element bigger, the magnetic core ring air gap that is complementary is therefore also bigger, magnetic dispersion is more, the magnetic induction density of magnetic core ring inside is less, is the technical matters of the less grade of sensitivity thereby make the hall output voltage that is built in the Hall element in the magnetic core ring air gap.
Above-mentioned technical matters of the present utility model is mainly solved by following technical proposals:
The electronic element packaging structure of a kind of current sensor of the present utility model, comprise the plastic-sealed body top and the plastic-sealed body bottom that link together, it is characterized in that described plastic-sealed body top and plastic-sealed body lower interior portion are packaged with chip, chip is connected with some pins, and the pin other end stretches out outside the plastic-sealed body top or plastic-sealed body bottom of encapsulation; Thickness after described plastic-sealed body top and the encapsulation of plastic-sealed body bottom is 0.85～1.05mm.The chip of the inner encapsulation of plastic-sealed body can be a Hall element.Thinner with the design of the plastic-sealed body of electronic component is the thin about 0.25mm of Hall element of THS119 than commercially available model.Therefore the magnetic core ring air gap of the current sensor of making of the design can be littler, leakage magnetic field still less, the magnetic line of force that the magnetic core ring is assembled is more, the magnetic induction density of magnetic core ring inside is bigger, thereby the hall output voltage that is built in the Hall element in the magnetic core ring air gap is that sensitivity is bigger, i.e. sensitivity components identical under standard Magnetic Field, after being installed on the current sensor, the electronic component that adopts this structural design is that sensitivity is higher than the hall output voltage of THS119.And the Distribution of Magnetic Field in the magnetic core ring is more even, though position deviation slightly when element is installed, element testing to magnetic induction density also change very for a short time, promptly still can obtain essentially identical hall output voltage, make the accuracy of detection consistance of current sensor better.
As preferably, the thickness on described plastic-sealed body top is 0.5～0.65mm.The pin of electronic component can stretch out from the below of plastic-sealed body bottom.
As preferably, described pin is straight shape or is made up of bending segment and flat segments.
Therefore, the magnetic core ring air gap that the utlity model has current sensor diminishes, magnetic dispersion reduces, the magnetic induction density of magnetic core ring inside is bigger, Distribution of Magnetic Field is more even simultaneously, thereby making the hall output voltage that is built in the Hall element in the magnetic core ring air gap is characteristics such as sensitivity is bigger, and is simple and reasonable for structure.
Description of drawings
Accompanying drawing 1 is a kind of structural representation of the plastic-sealed body of former Hall element;
Accompanying drawing 2 is a kind of structural representations of the present utility model;
Accompanying drawing 4 is a kind of structural representations that current sensor of the present utility model is installed.
Parts, position and numbering among the figure: plastic-sealed body top 1, plastic-sealed body bottom 2, pin 3, magnetic core ring 4, lead 5.
Embodiment
Below by embodiment, and in conjunction with the accompanying drawings, the technical solution of the utility model is described in further detail.
Embodiment: the electronic element packaging structure of the current sensor that this is routine, as Fig. 2, Fig. 3, the plastic-sealed body top 1 and plastic-sealed body bottom 2 that link together are arranged, the inner hollow of plastic-sealed body top and plastic-sealed body bottom is equipped with chip in it, and chip is a Hall element.The thickness on plastic-sealed body top is 0.5mm, and plastic-sealed body top 1 is 0.85mm with the gross thickness of plastic-sealed body bottom.Chip is connected with pin 3, and pin stretches out outside the plastic-sealed body bottom of encapsulation, and pin 3 is made up of bending segment and flat segments.
During use, as Fig. 4, the utility model electronic component is put into the air gap of magnetic core ring 4, twine lead 5 on the magnetic core ring, when having electric current to pass through on the detected lead, around lead, can produce magnetic field, assemble magnetic field by magnetic core ring 4 then, the Hall element that is built in the magnetic core ring air gap can detect the size in magnetic field, and exports corresponding Hall voltage, and subsequent conditioning circuit can calculate size of current in the lead in proportion with this Hall voltage.Because the thickness of plastic-sealed body is less, so magnetic core ring air gap is also less, only is 1.1mm.
Claims (3)
1. the electronic element packaging structure of a current sensor, comprise the plastic-sealed body top (1) and plastic-sealed body bottom (2) that link together, it is characterized in that described plastic-sealed body top (1) and inside, plastic-sealed body bottom (2) are packaged with chip, chip is connected with some pins (3), and the pin other end stretches out outside the plastic-sealed body top or plastic-sealed body bottom of encapsulation; Thickness after described plastic-sealed body top (1) encapsulates with plastic-sealed body bottom (2) is 0.85～1.05mm.
2. the electronic element packaging structure of a kind of current sensor according to claim 1, the thickness that it is characterized in that described plastic-sealed body top (1) is 0.5～0.65mm.
3. the electronic element packaging structure of a kind of current sensor according to claim 1 and 2 is characterized in that described pin (3) forms for straight shape or by bending segment and flat segments.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200920300889U CN201392357Y (en) | 2009-02-26 | 2009-02-26 | Electronic element package structure of electric current sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200920300889U CN201392357Y (en) | 2009-02-26 | 2009-02-26 | Electronic element package structure of electric current sensor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201392357Y true CN201392357Y (en) | 2010-01-27 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200920300889U Expired - Fee Related CN201392357Y (en) | 2009-02-26 | 2009-02-26 | Electronic element package structure of electric current sensor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201392357Y (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103454597A (en) * | 2012-05-29 | 2013-12-18 | 北京嘉岳同乐极电子有限公司 | Current-induction measuring device and method and sensitivity adjusting method |
| CN106291033A (en) * | 2016-10-26 | 2017-01-04 | 绵阳市维博电子有限责任公司 | A kind of opening and closing type current sensor magnetic core fixed structure and core assembly |
-
2009
- 2009-02-26 CN CN200920300889U patent/CN201392357Y/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103454597A (en) * | 2012-05-29 | 2013-12-18 | 北京嘉岳同乐极电子有限公司 | Current-induction measuring device and method and sensitivity adjusting method |
| CN106291033A (en) * | 2016-10-26 | 2017-01-04 | 绵阳市维博电子有限责任公司 | A kind of opening and closing type current sensor magnetic core fixed structure and core assembly |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20100127 Termination date: 20140226 |